Patents by Inventor Wataru Urano

Wataru Urano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100065320
    Abstract: Disclosed is a wiring board comprising a plurality of conductors (11) having a conductive member including first conductive material (1) and second conductive material (2), and insulating member (3) covering the conductive member. A plurality of conductors (11) are arranged lattice-like and are weaved like a woven cloth, and sections intersecting with each other are electrically connected.
    Type: Application
    Filed: December 6, 2007
    Publication date: March 18, 2010
    Applicant: NEC CORPORATION
    Inventor: Wataru Urano
  • Publication number: 20080190654
    Abstract: The printed wiring board in accordance with the present invention is comprised of a substrate, an electrically conductive pattern formed on the substrate to define a circuit wire and a pad electrically connected to the circuit wire, and an electrical insulator covering the substrate and the electrically conductive pattern therewith. A region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad. The opening has opposite ends extending in a first direction beyond the electrically conductive pattern such that opposite ends of the pad in the first direction are defined by the electrically conductive pattern, and the opening further has opposite ends extending in a second direction perpendicular to the first direction to intersect with the electrically conductive pattern such that the pad is defined in shape in the second direction by the opposite ends of the opening extending in the second direction.
    Type: Application
    Filed: January 9, 2007
    Publication date: August 14, 2008
    Applicant: NEC CORPORATION
    Inventor: Wataru URANO
  • Patent number: 7180005
    Abstract: The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad, and a region except the pad is used as a circuit wire. The opening has opposite ends extending in a first direction beyond the electrically conductive pattern such that opposite ends of the pad in the first direction are defined by the electrically conductive pattern, and further has opposite ends extending in a second direction perpendicular to the first direction to intersect with the electrically conductive pattern such that the pad is defined in shape in the second direction by the opposite ends of the opening extending in the second direction. The pad is smaller in length in the first direction than the circuit wire.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: February 20, 2007
    Assignee: NEC Corporation
    Inventor: Wataru Urano
  • Publication number: 20050167154
    Abstract: The printed wiring board includes a substrate, an electrically conductive pattern formed on the substrate, and an electrical insulator covering the substrate and the electrically conductive pattern therewith, wherein a region of the electrically conductive pattern exposed through an opening formed throughout the electrical insulator is used as the pad, and a region except the pad is used as a circuit wire. The opening has opposite ends extending in a first direction beyond the electrically conductive pattern such that opposite ends of the pad in the first direction are defined by the electrically conductive pattern, and further has opposite ends extending in a second direction perpendicular to the first direction to intersect with the electrically conductive pattern such that the pad is defined in shape in the second direction by the opposite ends of the opening extending in the second direction. The pad is smaller in length in the first direction than the circuit wire.
    Type: Application
    Filed: May 19, 2003
    Publication date: August 4, 2005
    Inventor: Wataru Urano
  • Patent number: 4880892
    Abstract: Advancement catalysts which are a combination of a phosphonium halide or an alkylene phosphorane and a nitrogen heterocycle selected from the group consisting of substituted or unsubstituted imidazoles, benzimidazoles, imidazolines, dihydropyrimidines, tetrahydropyrimidines, dihydroquinazolines, their salts and mixtures thereof, confer high reactivity and selectivity on epoxy resin advancement reactions. The advanced epoxy resins are useful in the preparation of coatings of high quality.
    Type: Grant
    Filed: August 22, 1988
    Date of Patent: November 14, 1989
    Assignee: Ciba-Geigy Corporation
    Inventors: Wataru Urano, Yasuaki Sugano