Patents by Inventor Watson R. Henderson

Watson R. Henderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5914802
    Abstract: A light modulator for both intensity and phase modulating coherent light on a pixel-by-pixel basis includes a modulating material responsive to an electric potential for modulating the intensity of coherent light passing through the modulating material, and electrodes for applying an electric potential across the modulating material on a pixel-by-pixel basis. The coherent light associated with a first set of pixels has a different optical path length through the modulating material than does the coherent light associated with a second set of pixels. The modulating material is a liquid crystal material. The electrodes include a set of first reflective pixel electrodes embedded in the liquid crystal material, the first reflective pixel electrodes having a first thickness, and a set of second reflective pixel electrodes embedded in the liquid crystal material, the second reflective pixel electrodes having a second thickness.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: June 22, 1999
    Assignee: Northrop Grumman Corporation
    Inventors: Eddy A. Stappaerts, Watson R. Henderson
  • Patent number: 5469324
    Abstract: A printed circuit board includes a planar first outer layer, a planar second outer layer, and a planar capacitive power distribution core disposed between the first and second outer layers. The capacitive core is formed from first and second electrically conductive layers with a dielectric layer disposed therebetween. The dielectric layer is made from a high dielectric constant material such as a ceramic in the form of a perforated sheet. The perforations permit the electrically conductive layers to be bound to the dielectric layer without significantly increasing the separation between the conductive layers. Each perforation allows a column of adhesive to collect therein to bond the power distribution core together. The resulting capacitance is typically sufficient to eliminate the need for decoupling capacitors.
    Type: Grant
    Filed: October 7, 1994
    Date of Patent: November 21, 1995
    Assignee: Storage Technology Corporation
    Inventors: Watson R. Henderson, Floyd G. Paurus, Stanley R. Szerlip
  • Patent number: 5274584
    Abstract: The solid state memory device consists of a circuit board based system which is mounted in a 3480 type magnetic tape cartridge form factor housing to make this media physically compatible with the 3480 type magnetic tape cartridges. The interconnection of the solid state memory device with the read/write device is by an optical connections which transfer data between the solid state memory device and the associated read/write device. A plurality of batteries in the solid state memory device provide power for the memory retention capability required of the volatile solid state memory devices. The batteries are recharged by the use of a pair of power rails that are incorporated into the exterior housing of the 3480 form factor cartridge. Thus, the associated read/write device applies power to the solid state memory via these power rails when the 3480 form factor cartridge is placed in the associated read/write device.
    Type: Grant
    Filed: May 6, 1991
    Date of Patent: December 28, 1993
    Assignee: Storage Technology Corporation
    Inventors: Watson R. Henderson, Michael S. Kelly, Michael L. Leonhardt, Floyd G. Paurus, Archibald W. Smith, Stanley R. Szerlip
  • Patent number: 4839197
    Abstract: A process for fabricating a thin film magnetic head to achieve improved dimensions and tolerances of the pole tip portion of the head. A lower thin film magnetic layer comprising the lower pole tip is first formed followed by a thin layer defining the gap of the head. A thin film magnetic layer is then deposited only in the vicinity of the pole tip to define the upper pole of the head. Following this, successive layers of insulation and coils are deposited. Finally, a top thin film magnetic layer is deposited. This top layer contacts the already formed layer comprising the top pole piece.
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: June 13, 1989
    Assignee: Storage Technology Corporation
    Inventor: Watson R. Henderson