Abstract: A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect.

Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.

Abstract: An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

Abstract: A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

Abstract: A socket (10) is described for housing similar integrated circuits (#1, #2). The socket (10) comprises a center support (14) which includes integral end panels (14a, 14b). The center support further includes a plurality of upstanding separators (42, 44) which form a plurality of recesses (46, 48). Side panels (18, 20) are joined to the center support to form first and second chambers (23, 24). A bottom plate (16) is connected to the center support (14) and side panels (18, 20). A lead frame (22) is positioned within the first and second chambers to provide metallic strips within the recesses (46, 48). In certain of the recesses the metallic strips extend from corresponding recesses in the two chambers (23, 24) and connect to a respective socket lead (12). In other selected recesses a metallic strip extends directly to connect to a package lead (12) such that there is no direct connection between common recesses.