Patents by Inventor Wayne Eugene Reister

Wayne Eugene Reister has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for bonding rigid substrates
    Patent number: 5997786
    Abstract: Rigid substrates containing an adhesive composition on at least one surface are prepared by an injection molding operation. The degree of bonding between the adhesive layer and the substrate is greater than can be achieved using conventional methods for coating substrates with adhesive compositions.
    Type: Grant
    Filed: April 1, 1998
    Date of Patent: December 7, 1999
    Assignee: Dow Corning Corporation
    Inventors: Steven Paul Arthur, Brian Dale Kruse, Wayne Eugene Reister, Vladimir Azaroff