Abstract: High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an ethylene vinyl acetate and/or ethylene 2-ethyl hexyl acrylate polymer having a melt index of at least 550 grams/10 minutes, a paraffin wax and a rosin derived tackifier.

Abstract: A low application temperature, high heat resistant hot melt adhesive comprising an ethylene vinyl acetate and/or ethylene 2-ethyl hexyl acrylate polymer having a melt index of at least 550 grams/10 minutes, a paraffin wax and a rosin derived tackifier.

Abstract: High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.

Abstract: This invention relates to solvent-free moisture curable one-part hot melt polyurethane adhesive or sealant compositions which are solid at room temperature. In one embodiment, the polyurethane adhesive or sealant composition comprises in percentages by weight (a) from about 20% to about 75% of a urethane prepolymer; (b) from about 1% to about 66% of a reactive, hydroxyl containing, or a nonreactive polymer formed from ethylenically unsaturated monomers; and (c) from about 20% to about 75% of a thermoplastic resin. In another embodiment, the polyurethane adhesive or sealant composition comprises, in percentages by weight of the polyurethane composition (a) from about 10% to about 90% of a urethane prepolymer; and (b) from about 5% to about 90% of a thermoplastic resin which is an ethylene vinylacetate/ethylene acrylate terpolymer.

Abstract: The specification discloses a polyphenylene oxide delivery system for use in preparing an A-B-A block copolymer adhesive formulation having an increased service temperature. The delivery system comprises a preblend of polyphenylene oxide (PPO) resin having a T.sub.g within the range of from about 150.degree. to about 210.degree. C. and a B-block compatible resin. The PPO/B-block resin preblend enables introduction of more PPO into the composition thereby increasing the service temperature of the adhesive formulation.

Abstract: The specification discloses a polyphenylene oxide delivery system for use in preparing an A-B-A block copolymer adhesive formulation having an increased service temperature. The delivery system comprises a preblend of polyphenylene oxide (PPO) resin having a T.sub.g within the range of from about 150.degree. to about 210.degree. C. and a B-block compatible resin. The PPO/B-block resin preblend enables introduction of more PPO into the composition thereby increasing the service temperature of the adhesive formulation.

Abstract: The specification discloses an additive composition for use in preparing adhesive formulations, particularly hot melt adhesive formulations based on A-B-A block copolymers which exhibit increased upper service temperatures. The additive composition comprises a preblend of of an A-block compatible reinforcing resin having a number average molecular weight ranging from about 2,000 to about 10,000 Daltons and a polydispersity index of less than about 4.0 and a B-block compatible resin. The A-block compatible reinforcing resin/B-block resin preblend enables introduction of more A-block reinforcing resin into the composition thereby increasing the overall upper service temperature of the adhesive formulation.

Abstract: A method for the preparation of an adhesive with an improved high temperature shear strength is disclosed. The method comprises the steps of blending a styrene homopolymer with a tackifier resin to form a resin blend and combining the resin blend with an elastomer. An adhesive with improved high temperature shear strength is also disclosed.