Abstract: A fluid-jet precision-dispensing device cartridge assembly includes a housing, a fluid-jet precision-dispensing device die, and a flexible circuit. The housing has a first surface and a second surface. The second surface is non-parallel to the first surface. The housing is insertable in a fluid-jet precision-dispensing device. The die is disposed at the first surface of the housing. The circuit is attached to the housing and wraps around the housing from the first surface to the second surface. The circuit includes electrically conductive traces and contacts that are electrically coupled to the die to transmit power and communicate signals between the device and the die. The circuit includes one or more regions having no functionality in usage of the assembly to precisely dispense fluid. The regions are rigid and/or thermally conductive to improve attachment of the circuit to the housing.

Abstract: A fluid-jet precision-dispensing device cartridge assembly includes a housing, a fluid-jet precision-dispensing device die, and a flexible circuit. The housing has a first surface and a second surface. The second surface is non-parallel to the first surface. The housing is insertable in a fluid-jet precision-dispensing device. The die is disposed at the first surface of the housing. The circuit is attached to the housing and wraps around the housing from the first surface to the second surface. The circuit includes electrically conductive traces and contacts that are electrically coupled to the die to transmit power and communicate signals between the device and the die. The circuit includes one or more regions having no functionality in usage of the assembly to precisely dispense fluid. The regions are rigid and/or thermally conductive to improve attachment of the circuit to the housing.

Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.

Abstract: The described embodiments relate to electrical interconnect assemblies and methods of forming same. One exemplary method applies a generally flowable protective material to an electrical interconnect region comprising portions of at least two conductors. The method also exposes the protective material to conditions sufficient to render the protective material to a generally non-flowable state which protects the electrical interconnect region from degradation, wherein said exposing also reflows solder positioned proximate the electrical interconnect region to allow the solder to bond with the at least two conductors.