Abstract: A laminated wear ring for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring includes a high stiffness stainless steel base and a plastic laminate. The high stiffness stainless steel base avoids flexing of the wear ring during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed. The plastic laminate protects the stainless steel base from attack by the polishing slurry and provides a buffer that protects the stainless steel base from mechanically damaging the wafer and vice versa.

Abstract: A laminated wear ring for a chemical mechanical planarization (CMP) apparatus provides improved control of the removal rate of material from the edge of a wafer during a polishing/planarization operation. The laminated wear ring includes a high stiffness stainless steel base and a plastic laminate. The high stiffness stainless steel base avoids flexing of the wear ring during polishing and thus provides control of the flexing of a polish pad against which the wafer surface is pressed. The plastic laminate protects the stainless steel base from attack by the polishing slurry and provides a buffer that protects the stainless steel base from mechanically damaging the wafer and vice versa.

Abstract: The present invention is a method and apparatus for conditioning a polishing pad used for chemically mechanically polishing semiconductor wafers. The conditioning device includes a rigid elongated element that resists bowing or warping during the conditioning process. Abrasive elements are supported by a substantially planar bottom surface of the rigid element. The abrasive elements may have a diamond layer cut into a grid pattern to provide an abrasive surface. The conditioning device is preferably used to condition a polishing pad supported by a rigid platen. The conditioning device is pressed against and swept across the polishing pad by an actuator while the polishing pad is rotated to uniformly condition the polishing pad. This uniform conditioning, while avoiding the bowing and warping of the prior art, provides a superior conditioning process for the polishing pad.

Abstract: A reinforced bladder for a chemical-mechanical planarization (CMP) polishing device includes an elastomer infused with a reinforcing material. The elastomer can be a rubber such as EPDM. The reinforcing material can be a chopped fiber such as aramid. Alternatively, the reinforcing material can be a sheet (such as a triaxial or hexaxial weave of aramid) embedded in and infused with the elastomer.