Patents by Inventor Weddle Aquien

Weddle Aquien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
    Patent number: 6737298
    Abstract: A new method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: May 18, 2004
    Assignee: St Assembly Test Services Ltd
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo
  • Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same
    Publication number: 20030138994
    Abstract: A new method and assembly is provided for anchoring the heat spreader of a PBGA package to the substrate thereof. Anchor features are made part of the PBGA package, these anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
    Type: Application
    Filed: January 23, 2002
    Publication date: July 24, 2003
    Applicant: St Assembly Test Services Pte Ltd
    Inventors: Il Kwon Shim, Hermes T. Apale, Weddle Aquien, Dario Filoteo, Virgil Ararao, Leo Merilo