Patents by Inventor Wee Hock Chan

Wee Hock Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9889461
    Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: February 13, 2018
    Assignees: 3M INNOVATIVE PROPERTIES COMPANY, TRIMECH TECHNOLOGY PTE. LTD
    Inventors: Stanley C. Busman, Chin Teong Ong, Yi Lin Sim, Wee Hock Chan, Xinhe Chen, Meng Sheng Toy
  • Publication number: 20150037593
    Abstract: There is a method for forming a laminated product having a first substrate and a second substrate. The method may comprise applying a liquid adhesive on a surface of the first substrate for bonding the first substrate to the second substrate. The liquid adhesive located on a circumferential periphery of the first substrate for limiting movement of the liquid adhesive within the circumferential adhesive wall structure. Pressure may be applied on a bond area between the first substrate and the second substrate in a vacuum environment to incrementally increase the bond area between the first substrate and the second substrate to incrementally bond the first substrate to the second substrate. The liquid adhesive may be cured to bond the first and second substrates.
    Type: Application
    Filed: November 22, 2012
    Publication date: February 5, 2015
    Applicants: 3M Innovative Properties Company, Trimech Technology PTE. LTD.
    Inventors: Wee Hock Chan, Xinhe Chen, Jia Tow, Chin Teong Ong, Yi Lin Sim
  • Publication number: 20130295337
    Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.
    Type: Application
    Filed: September 9, 2011
    Publication date: November 7, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Stanley C. Busman, Chin Teong Ong, Yi Lin Sim, Wee Hock Chan, Xinhe Chen, Meng Sheng Toy
  • Publication number: 20120018419
    Abstract: A thermode assembly comprises a heating element comprising a material having a first thermal expansion coefficient and a base comprising a material having a second thermal expansion coefficient lower than the first thermal expansion coefficient. The thermode assembly also comprises a tensioning mechanism for tensioning the heating element in contact with the base.
    Type: Application
    Filed: April 5, 2010
    Publication date: January 26, 2012
    Applicant: TRIMECH TECHNOLOGY PTE. LTD.
    Inventor: Wee Hock Chan