Patents by Inventor Wei-An Huang

Wei-An Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12004367
    Abstract: A display substrate, a manufacturing method thereof, and a display device are provided. The display substrate includes: a base substrate at least including a pixel area and a hole area; a plurality of sub-pixels arranged on the base substrate and located in the pixel area; a hole in the hole area; a first barrier dam arranged between the sub-pixels and the hole and at least partially surrounding the hole; an organic material layer including at least one film layer, wherein an orthographic projection of the organic material layer on the base substrate falls within the pixel area; and a filling structure, wherein at least a portion of the filling structure is arranged between the hole and the first barrier dam, and the filling structure and the at least one film layer of the organic material layer are located in the same layer and include the same material.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: June 4, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xin Zhang, Yupeng He, Yang Zhou, Wei Wang, Xiaofeng Jiang, Yu Wang, Lulu Yang, Yiyang Zhang, Guanghui Yang, Jiaming Lu, Rui Hao, Qun Ma, Pu Liu, Liudong Zhu, Qiang Huang, Bin He, Dinan Duan, Haiyong Bai, Xin Li, Ruiqi Wei
  • Patent number: 12004212
    Abstract: Systems and method for configuring and providing uplink control information (UCI) multiplexing on physical uplink shared channel (PUSCH) transmissions are disclosed. In embodiments, a base station configures and signals, to a user equipment (UE) a plurality of sets of beta-offset values to be used by the UE for multiplexing a UCI transmission of a first priority to a PUSCH transmission of a second priority. Each set of the plurality of sets of beta-offset values is configured based on the second priority of the PUSCH transmission. In embodiments, the UE determines whether the UCI transmission of the first priority is allowed to be multiplexed to the PUSCH transmission of the second priority, and multiplexes the UCI to the PUSCH when multiplexing of the UCI and PUSCH is allowed, using a beta-offset value from the plurality of sets of beta-offset values. Other aspects and features are also claimed and described.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: June 4, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Wei Yang, Yi Huang, Ahmed Elshafie
  • Patent number: 12003445
    Abstract: Certain aspects of the present disclosure provide techniques for applying a mechanism to signals, from different user equipments (UEs), multiplexed for UL transmission, such that the mechanism differentiates one UE's waveform from another UE's, even if the waveforms are on the same time resources. A method that may be performed by a UE includes determining a mechanism to allow the UE to share uplink (UL) resources with at least one other UE for UL transmission, applying the mechanism to at least one of RS symbols or information symbols to be multiplexed using orthogonal frequency division multiplexing (OFDM) before performing a discrete Fourier transform (DFT) for the UL transmission, and outputting a waveform for the UL transmission after performing the DFT and an inverse fast Fourier transform (IFFT).
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: June 4, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Peter Gaal, Wei Yang
  • Patent number: 12002768
    Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen, Chia-Hung Liu, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 12004291
    Abstract: A lens module of reduced size includes a base and an adhesive body. The base includes a first base portion and a second base portion located outside the first base portion. The first base portion is made of plastic and the second base portion is made of metal. The base further comprises a slot. The adhesive body is received in the slot and connects the first base portion and the second base portion. The disclosure also provides an electronic device having the lens module.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: June 4, 2024
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Yu-Shuai Li, Ding-Nan Huang, Jing-Wei Li, Jian-Chao Song
  • Patent number: 11999906
    Abstract: A hydraulic fracture fluid is provided. The fluid can include a liquid solvent, one or more surfactants, a proppant-forming compound, and one or more curing agents. The liquid reacts to form proppant in-situ under downhole conditions.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: June 4, 2024
    Assignees: CNPC USA Corporation, Beijing Huamei, Inc., China National Petroleum Corporation
    Inventors: Lijun Lin, Jiangshui Huang, Litao Bai, Stephanie Yu, Fuchen Liu, Congbin Yin, Wei Gong
  • Patent number: 12002479
    Abstract: A bandwidth extension (BWE) method includes: determining parameters of a low-frequency spectrum of a narrowband signal; inputting the parameters of the low-frequency spectrum into a neural network model, and obtaining a correlation parameter based on an output of the neural network model; obtaining a target high-frequency amplitude spectrum based on the correlation parameter and a low-frequency amplitude spectrum; obtaining a high-frequency spectrum based on a low-frequency phase spectrum and the target high-frequency amplitude spectrum of the narrowband signal; and obtaining a broadband signal after BWE based on the low-frequency spectrum and the high-frequency spectrum.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: June 4, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Wei Xiao, Xiaoming Huang, Jiajun Chen, Yannan Wang
  • Patent number: 12003249
    Abstract: The present invention discloses a DAC method having signal calibration mechanism used in a DAC circuit having thermometer-controlled current sources generating an output analog signal according to a total current thereof and a control circuit. Current offset values of the current sources are retrieved. The current offset values are sorted to generate a turn-on order, in which the current offset values are separated into current offset groups according to the turn-on order, the signs of each neighboring two groups being opposite such that the current offset values cancel each other when the current sources turn on according to the turn-on order to keep an absolute value of a total offset not larger than a half of a largest absolute value of the current offset values. The current sources are turned on based on the turn-on order according to a thermal code included in an input digital signal.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: June 4, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Kai-Yue Lin, Hsuan-Ting Ho, Liang-Wei Huang, Chi-Hsi Su
  • Patent number: 12003290
    Abstract: Methods, systems, and devices for wireless communications are described. A transmitter may transmit a payload in transmission to the base station in a wireless communications system. The transmitter may identify a payload to include in the transmission to the base station. The transmitter may determine to transmit the transmission using an orthogonal sequence codebook or a non-orthogonal sequence codebook, based on a size of the payload, a control message from the base station to the transmitter, or a combination of these. The transmitter may then transmit the transmission to the base station based on whether the transmission is to use the orthogonal sequence codebook or the non-orthogonal sequence codebook. The transmission may be a noncoherent transmission. The transmission may be an uplink control information transmission, an uplink data transmission, a downlink control information transmission, or a downlink data transmission.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: June 4, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Wei Yang, Wanshi Chen, Krishna Kiran Mukkavilli, Tingfang Ji
  • Patent number: 11999944
    Abstract: A method for promoting growth of a probiotic microorganism includes cultivating the probiotic microorganism in a growth medium containing a fermented culture of lactic acid bacterial strains that include Lactobacillus salivarius subsp. salicinius AP-32 deposited at the China Center for Type Culture Collection (CCTCC) under CCTCC M 2011127, Lactobacillus plantarum LPL28 deposited at the China General Microbiological Culture Collection Center (CGMCC) under CGMCC 17954, Lactobacillus acidophilus TYCA06 deposited at the CGMCC under CGMCC 15210, and Bifidobacterium longum subsp. infantis BLI-02 deposited at the CGMCC under CGMCC 15212.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: June 4, 2024
    Assignee: GLAC BIOTECH CO., LTD.
    Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yu-Fen Huang, Cheng-Chi Lin, Chen-Hung Hsu, Tsai-Hsuan Yi, Yu-Wen Chu, Yi-Wei Kuo, Jui-Fen Chen, Shin-Yu Tsai
  • Patent number: 12002684
    Abstract: A method for CMP includes following operations. A metal stack is received. The metal layer stack includes at least a first metal layer and a second metal layer, and a top surface of the first metal layer and a top surface of the second metal layer are exposed. A protecting layer is formed over the second metal layer. A portion of the first metal layer is etched. The protecting layer protects the second metal layer during the etching of the portion of the first metal layer. A top surface of the etched first metal layer is lower than a top surface of the protecting layer. The protecting layer is removed from the second metal layer.
    Type: Grant
    Filed: November 21, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin, Wei-Wei Liang, Liang-Guang Chen, Kei-Wei Chen, Hung Yen, Ting-Hsun Chang, Chi-Hsiang Shen, Li-Chieh Wu, Chi-Jen Liu
  • Patent number: 12002186
    Abstract: Methods and systems to detect and blend a surround area to avoid filtering artifact due to the area in image filtering are disclosed. The described methods include a compensation step and can be applied to arbitrary images with padded areas of arbitrary shape, such as letterboxes, pillar-boxes, ovals, or other shapes, including logos and close captions. Such methods detect the surround areas in the image with possible compression artifact and noise, and then perform blending to minimize the effects of the surround areas for any arbitrary image filtering operations.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: June 4, 2024
    Assignee: Dolby Laboratories Licensing Corporation
    Inventors: Tsung-Wei Huang, Guan-Ming Su
  • Patent number: 12002710
    Abstract: A semiconductor structure and method of forming the same are provided. The method includes: forming a plurality of mandrel patterns over a dielectric layer; forming a first spacer and a second spacer on sidewalls of the plurality of mandrel patterns, wherein a first width of the first spacer is larger than a second width of the second spacer; removing the plurality of mandrel patterns; patterning the dielectric layer using the first spacer and the second spacer as a patterning mask; and forming conductive lines laterally aside the dielectric layer.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hsin Chan, Jiing-Feng Yang, Kuan-Wei Huang, Meng-Shu Lin, Yu-Yu Chen, Chia-Wei Wu, Chang-Wen Chen, Wei-Hao Lin, Ching-Yu Chang
  • Publication number: 20240174512
    Abstract: A MEMS probe and manufacturing method thereof are provided. The method is mainly to form connected first-level, second-level, and third-level pin grooves on both sides of the silicon substrate through an etching process, followed by two electroplating processes to deposit nickel-cobalt-phosphorus alloy in the first-level pin groove to form the tip of the microprobe, and to deposit nickel-cobalt alloy in the second-level pin groove and the third-level pin to form the pin head and pin arm, thereby forming a three-level microprobe. A circuit substrate made of ceramic material is disposed with at least one window, the surface of the circuit substrate adjacent to the window is provided with a plurality of circuit pads, and the circuit substrate is abutted to the pin arm of the microprobe. The silicon substrate is then removed, to form a plurality of cantilever microprobes made of nickel-cobalt-phosphorus alloy and nickel-cobalt alloy on the circuit substrate.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 30, 2024
    Inventors: SHANG-KUANG WU, YU-TSUNG FU, MING-WEI HUANG
  • Publication number: 20240175314
    Abstract: A window blind position damping device is applied to a window blind with slat being expanded horizontally, forming a damping to a pull cord effectively when the slat is pulled down at any height, so as to define the height. The window blind position damping device includes a machine part, and an interior of the machine part has a spring scroll wheel and a position damping device which links a pull cord through a provided release idler. A damping shear pillar is vertically disposed on a base plate of the provided machine part, between an outlet of the release idler and an opening. By a provided shear ridge, the damping shear pillar shears an overrun section of the pull cord that passes through, forming the damping and thereby defining and fixing the slat at any height when being expanded.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 30, 2024
    Inventors: Hsien-Te HUANG, Yu-Wei HUANG
  • Publication number: 20240175170
    Abstract: Techniques are described by which a fabric designer system provides a user interface (UI) to enable a user to design a data center fabric. For example, a fabric designer system comprises processor(s) and a memory comprising instructions that when executed by the processor(s) cause the one or more processors to: generate data representative of a user interface (UI) for display on a display device, the data representative of the UI comprising UI elements representing one or more fabric design requirements receive, via the UI on the display device, an indication of a user input selecting one or more of the UI elements representing the one or more fabric design requirements; generate a model for a data center fabric based on the one or more fabric design requirements and a catalog of network devices; and generate UI elements representing fabric design specifications of the model for the data center fabric.
    Type: Application
    Filed: September 29, 2023
    Publication date: May 30, 2024
    Inventors: Mansi Joshi, Eric Huang, Venkata Rama Pradeep Kumar Vajrapu, Vidushi Gupta, Travis Gregory Newhouse, Wei Gao, James Worth Westbrook
  • Publication number: 20240176335
    Abstract: A fault detection method, includes the following steps. A target sequence is received, the target sequence includes several data. A first moving average operation is performed on the target sequence to establish a first moving average sequence. A second moving average operation is performed on the target sequence to establish a second moving average sequence. A difference operation between the first moving average sequence and the second moving average sequence is performed to obtain a difference sequence, the difference sequence includes several difference values. An upper limit value is set. When one of the difference values is greater than the upper limit value, the target sequence is determines as abnormal.
    Type: Application
    Filed: February 6, 2024
    Publication date: May 30, 2024
    Inventors: Yung-Yu Yang, Kang-Ping Li, Chih-Kuan Chang, Chung-Chih Hung, Chen-Hui Huang, Nai-Ying Lo, Shih-Wei Huang
  • Publication number: 20240176109
    Abstract: An optical lens, an optical module, and an electronic device are provided. The optical lens includes: a first lens (1), a reflector (2), a diaphragm (3), a second lens (4), a third lens (5), a fourth lens (6), and a fifth lens (7) in sequence from an object side to an image side.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 30, 2024
    Inventors: Tao FENG, Haiyan WANG, Wei HUANG
  • Publication number: 20240178363
    Abstract: The present invention provides a method for stabilizing an electrode using a functional layer, the electrode and applications thereof, which generates a beneficial electrolyte interface layer on the surface of the negative electrode after charging and discharging, and a protective buffer layer to form an alloy that facilitates the deposition of dense lithium on the negative current collector, significantly extending the life of the battery.
    Type: Application
    Filed: February 22, 2023
    Publication date: May 30, 2024
    Inventors: Bing-Joe Hwang, Sheng-Chiang Yang, Semaw Kebede Merso, Wei-Nien Su, She-Huang Wu
  • Patent number: D1029949
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: June 4, 2024
    Assignee: Razor USA LLC
    Inventors: Joey Chih-Wei Huang, Robert Chen