Abstract: A coating shim and a coating device, for applying a first slurry and a second slurry to an object to be coated are provided. The coating shim includes: a first flow channel for applying the first slurry to the object to be coated to form a first coating layer; and a second flow channel for applying the second slurry to the object to be coated to form a second coating layer. The first flow channel has a first slurry outlet at a first end face of the shim facing the object to be coated, the second flow channel has a second slurry outlet at the first end face, and the first slurry outlet and the second slurry outlet are configured to partially overlap in a thickness direction of the shim, such that the first coating layer and the second coating layer partially overlap in the thickness direction of the shim.

Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.

Abstract: Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a controller, a first mold compound surrounding the controller, a plurality of semiconductor dies, a second mold compound surrounding the plurality of semiconductor dies, and one or more through-mold interconnects electrically coupling the controller to the plurality of semiconductor dies.

Abstract: A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

Abstract: An optical device and the prism module thereof are provided. The prism module includes a first prism, a second prism, and a third prism. The second prism is disposed beside the first prism. The third prism is adhered to the second prism. First light enters the first prism, is reflected plural times in the first prism, enters the second prism, and is emitted from the second prism. Second light enters the second prism, is reflected plural times in the second prism, and is emitted from the second prism. Third light sequentially passes through the third prism and the second prism, enters the first prism, is reflected plural times in the first prism, and is emitted from the first prism.

Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.

Abstract: The invention discloses a method to set up a cross-domain DDS-secure network and then use it to transmit various kinds of data. To set up the cross-domain DDS-secure network, we first register IoT and monitor devices on the administration website. Second, we group devices based on our needs and then ask the website to generate configurations and certificates for each device. Finally, we download those files and deploy them to each device. In an extremely case, we can accomplish all operations only through a mobile device. During the system operating, all devices establish the DDS-secure connections to each other, and data will transmit on the network securely.

Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an isolation layer over a substrate. The method includes forming a spacer layer over the first fin, the second fin, and the isolation layer. The method includes forming a gate dielectric layer in the first trench and covering the first fin, the second fin, and the isolation layer exposed by the first trench. The method includes partially removing the gate dielectric layer to form a second trench in the gate dielectric layer and between the first fin and the second fin. The method includes forming a gate electrode in the first trench of the spacer layer and over the gate dielectric layer.

Abstract: A simulated shaking bullet chain type toy gun equipped with a bullet chain is provided. The toy gun includes a gun body, an actuated member, and a bolt assembly and a reciprocating assembly both reciprocatingly disposed in the gun body. The reciprocating assembly is linked to the bolt assembly and has a trigger portion reciprocating with the reciprocating assembly to produce a moving path. The actuated member is installed in the gun body and located on the moving path, and connected to the bullet chain. The reciprocating assembly reciprocates to trigger the actuated member by the trigger portion, and the actuated member links the bullet chain to shake, so as to achieve a high degree of simulation of the shaking effect of the bullet chain.

Abstract: A device for a plasma processing chamber includes a base, an upper portion attached to the base and extending transverse to the base, and one or more first through holes defined in the base. The one or more first through holes correspond to one or more openings defined in the plasma processing chamber for attaching the device. The device further includes a second through hole defined in the upper portion, and a gauge located in the second through hole, the gauge configured for recording a position of the plasma processing chamber and a shift in the position of the plasma processing chamber.

Abstract: An example method for detecting stability of a medical implant is provided. The method includes (a) applying a force to the medical implant with a probe, (b) based on the applied force, determining a response signal associated with a vibration of the medical implant, (c) comparing the determined response signal with a computer model of the medical implant, and (d) based on the comparison, determining an angular stiffness coefficient of the medical implant, wherein the angular stiffness coefficient indicates a stability of the medical implant.

Abstract: A semiconductor device includes: a substrate, including an upper surface and a first to a fourth side surfaces; wherein the upper surface includes a first edge connecting the first side surface and a second edge opposite to the first edge and connecting the second side surface; a first modified trace formed on the first side surface; and a semiconductor stack formed on the upper surface, including a lower surface connecting the upper surface of the substrate, and the lower surface comprises a fifth edge adjacent to the first edge and a sixth edge opposite to the fifth edge and adjacent to the second edge; wherein a shortest distance between the first edge and the fifth edge is S1 ?m, and a shortest distance between the second edge and the sixth edge is S2 ?m; wherein in a lateral view viewing from the third side surface, the first side surface forms a first acute angle with a degree of ?1 with the vertical direction, the second side surface forms a second acute angle with a degree of ?2 with the vertical dire

Abstract: Embodiments of the disclosure provide a method, apparatus, device, and storage medium for content capturing. The method includes, in response to a capturing start instruction, presenting a capturing start page which including at least a capturing control; in response to detecting a trigger instruction for the capturing control, switching from the capturing start page to a capturing page for video capturing, the capturing page including at least a stop control and a pause control, and the stop control being presented in a more prominent way than the pause control; and in response to detecting a trigger instruction for the stop control, switching from the capturing page to a video editing page, the video editing page being used to edit a captured video. In this way, it is possible for users to quickly perform video capturing and directly enter the editing page to complete editing of a work.

Abstract: A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (UBM) and a capping layer. The UBM is disposed on and electrically coupled to the redistribution circuit structure, where the UBM includes a recess. The capping layer is disposed on and electrically coupled to the UBM, where the UBM is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the UBM.

Abstract: A method and apparatus are disclosed. In an example from the perspective of a first device, a grant is received from a network node. The grant allocates a set of sidelink data resources. One or more sidelink data transmissions are performed on the set of sidelink data resources. A second feedback information associated with the one or more sidelink data transmissions is received and/or detected. An uplink resource is derived. A first feedback information is transmitted on the uplink resource to the network node. The first feedback information is set based upon the second feedback information.

Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The floating device includes a plurality of floating units. The waste collection device is coupled to the floating device. Each of the floating units includes a base and a pillar connected to the base, and the density of the base is greater than the density of the pillar.

Abstract: This disclosure provides an image capturing optical lens assembly including, in order from an object side to an image side: a first lens element with refractive power having an object-side surface being convex in a paraxial region thereof a second lens element having positive refractive power; a third lens element with refractive power having an image-side surface being concave in a paraxial region thereof a fourth lens element with refractive power having an image-side surface being concave in a paraxial region thereof, wherein both surfaces thereof being aspheric; a fifth lens element with refractive power having an object-side surface being concave in a paraxial region thereof and a sixth lens element with refractive power having an image-side surface being concave in a paraxial region thereof, wherein both surfaces thereof being aspheric, and the image-side surface having at least one convex shape in an off-axis region thereof.

Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The waste collection device includes a fluid ejection element, and the flow out of the fluid ejection element flows toward a space where waste is collected.

Abstract: An electrical connection device is provided and includes a cable-end connector and a board-end connector. The cable-end connector includes an insulative housing and a circuit board. The insulative housing includes a housing body and a mating plate, the housing body has a front end face, the mating plate has a front end portion. The board-end connector includes an insulative base, a plurality of terminals and a metal outer shell. A mating groove is formed between the metal outer shell and the insulative base and is used to allow the mating plate to mate therewith. One of the insulative base and the metal outer shell is provided with a protruding member and when the cable-end connector reversely inserts into the board-end connector, the protruding member stops the front end portion of the mating plate.

Abstract: A pneumatic valve mechanism disposed in a toy gun includes a trigger with an action bar, a driving assembly and a firing assembly. The driving assembly is disposed pivotally on the toy gun and linked with a shaft to pivot by the action bar. The firing assembly has a pushing portion and a triggering portion disposed oppositely to the pushing portion. The triggering portion makes the firing assembly reciprocate by an elastic member. The shaft is disposed with a pushing surface. The pushing surface pushes the triggering portion of the firing assembly when the shaft rotates pivotally.