Abstract: A sheet detection device includes: a magnetic sensing element disposed on a sheet guide, wherein the sheet guide brings the magnetic sensing element to move to a first position or a second position; a first magnetic element disposed on a sheet tray corresponding to the first position; a second magnetic element disposed on the sheet tray corresponding to the second position and in spaced with the first magnetic element; a processing element electrically connected with the magnetic sensing element. When the magnetic sensing element outputs a first voltage signal, the processing element determines the sheet guide is located at the first position according to the first voltage signal. When the magnetic sensing element outputs a second voltage signal, the processing element determines the sheet guide is located at the second position according to the second voltage signal. The first voltage signal is different from the second voltage signal.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A detecting method of a sheet detection device includes: generating, by a first magnetic sensing element, a first voltage signal corresponding to a magnetic element; generating, by a second magnetic sensing element, a second voltage signal corresponding to the magnetic element; determining, by a processing element, a first relative position of the magnetic element relative to the first magnetic sensing element according to the first voltage signal; determining, by the processing element, a second relative position of the magnetic element relative to the second magnetic sensing element according to the second voltage signal; determining, by the processing element, a stopping position of the magnetic element according to the first relative position and the second relative position; determining, by the processing element, a paper size of a paper abutted by a paper guide according to the stopping position. A sheet detection device is also disclosed.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.

Abstract: A semiconductor package includes a first semiconductor substrate, an array of conductive bumps, a second semiconductor substrate, and a spacing pattern. The first semiconductor substrate includes a pad region and an array of first pads disposed within the pad region. The array of conductive bumps is disposed on the array of first pads respectively. The second semiconductor substrate is disposed over the first semiconductor substrate and includes an array of second pads bonded to the array of conductive bumps respectively. The spacing pattern is disposed between the first semiconductor substrate and the second semiconductor substrate, wherein the spacing pattern is located at a periphery of the pad region.

Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: An image sensor structure includes a semiconductor substrate, a plurality of image sensing elements, a reflective element, and a high-k dielectric structure. The image sensing elements are in the semiconductor substrate. The reflective element is in the semiconductor substrate and between the image sensing elements. The high-k dielectric structure is between the reflective element and the image sensing elements.

Abstract: A thin film transistor includes a gate electrode embedded in an insulating layer that overlies a substrate, a gate dielectric overlying the gate electrode, an active layer comprising a compound semiconductor material and overlying the gate dielectric, and a source electrode and drain electrode contacting end portions of the active layer. The gate dielectric may have thicker portions over interfaces with the insulating layer to suppress hydrogen diffusion therethrough. Additionally or alternatively, a passivation capping dielectric including a dielectric metal oxide material may be interposed between the active layer and a dielectric layer overlying the active layer to suppress hydrogen diffusion therethrough.

Abstract: A method for fabricating nonenzymatic glucose sensor, which comprises steps of: (a) providing a bottom substrate; (b) preparing a graphene layer on the bottom substrate; (c) depositing plural amount of zinc oxide (ZnO) seed crystals on the graphene layer; (d) growing the ZnO seed crystals into columnar nanorods with hydrothermal method; (e) coating a thin film of cuprous oxide (Cu2O) on the surface of the ZnO nanorods by electrochemistry-based electrodeposition; and (f) grafting single-walled carbon nanotubes (SWCNTs) on surface of the Cu2O thin film, by using Nafion fixative composited with SWCNTs. The structure of the above sensor, therefore, comprises a bottom substrate and other components orderly assembled on it, including, from inside to outside, a graphene layer, plural amount of ZnO nanorods, a Cu2O thin film, plural amount of SWCNTs, and the Nafion fixative. Accordingly, the sensor has advantages of low cost, rapid response, and easy for preservation.

Abstract: A contextual label compression framework is presented that uses trained sequence to sequence models. A set of training data including received queries and related content can be processed to generate sequences of semantic encodings. These sequences can be used to train the sequence to sequence models, in order to be able to predict queries for instances of content when the relevant information for those instances is processed by the model. When such information is received for an instance, that information can be processed to generate a semantic encoding sequence which can then be processed by the model. A resulting semantic sequence output by the model can be segmented and decoded to produce a set of relevant queries for the instance of content. This information can then be provided to an entity associated with the instance of content for purposes in managing aspects relating to that content.

Abstract: A method of counting sheet materials applied to a pile of sheet materials, comprising the steps of: receiving an image of the pile of sheet materials; obtaining a grayscale value of a plurality of pixels along a first image axis direction of the image to form an one dimensional first array; performing binarization of the first elements of the first array with a first threshold value to form an one dimensional second array; obtaining the number of the second elements of a first value appearing between two second elements of a second value in the second array to form a third array; dividing the elements of the third array into a first cluster and a second cluster with a second threshold value; counting the number of the third elements belonging to the first cluster and defining said number as the number of the first sheet materials.

Abstract: A method of counting sheet materials applied to a pile of sheet materials, comprising the steps of: receiving an image of the pile of sheet materials; obtaining a grayscale value of a plurality of pixels along a first image axis direction of the image to form an one dimensional first array; performing binarization of the first elements of the first array with a first threshold value to form an one dimensional second array; obtaining the number of the second elements of a first value appearing between two second elements of a second value in the second array to form a third array; dividing the elements of the third array into a first cluster and a second cluster with a second threshold value; counting the number of the third elements belonging to the first cluster and defining said number as the number of the first sheet materials.

Abstract: This present invention provides an orthodontic aligner installed on a user's teeth which includes a target tooth and an anchor tooth, the orthodontic aligner comprising a shell having a space constructed by receding of the shell, and a recess formed by recessing from one side of edge of the shell, and an extension formed by protruding from another side of edge of the shell, wherein the recess is located corresponding to position of the target tooth and the extension portion is located corresponding to position of the anchor tooth. This present invention also provides an orthodontic aligner assembly and manufacturing method therefor. So, only the target tooth needs to be moved will be moved during orthodontic treatment processes which can reduce sequels and the target tooth could make a predictable and long distance movement because of the recess without changing aligner frequently.

Abstract: A pixel structure of electroluminescent display panel includes a substrate, a display driving structure, a planarization structure and an electroluminescent device. The display driving structure is disposed on the substrate. The display driving structure includes a driving device. The planarization structure is disposed on the substrate. The planarization structure covers the top surface and the sidewall of the driving device, and the planarization structure has a contact hole partially exposing the driving device. The electroluminescent device is disposed on the planarization structure. The electroluminescent device includes an anode, a light-emitting layer and a cathode. The anode covers the top surface of the planarization structure and surrounds the sidewall of the planarization structure, and the anode is filled into the contact hole and electrically connected to the driving device. The light-emitting layer is disposed on the anode. The cathode is disposed on the light-emitting layer.

Abstract: A data compression system and a data compression method using the same are provided. The data compression method includes acquiring original data from a memory and performs image processing and quantization on the original data to transform the original data into a quantization matrix. The data compression method then transforms the quantization matrix into a digital sequence based on a coding table and compares the data volume of the digital sequence and a target volume to generate a volume difference. The data compression method transforms the digital sequence into an inverse quantization matrix based on the volume difference and then transforms the inverse quantization matrix into a modified digital sequence based on the volume difference. The data compression method repeats the processes until the data volume of the digital sequence is substantially equal to a target volume or within an acceptable range of the target volume.