Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: Methods of forming contacts for source/drain regions and a contact plug for a gate stack of a finFET device are disclosed herein. Methods include etching a contact opening through a dielectric layer to expose surfaces of a first source/drain contact and repairing silicon oxide structures along sidewall surfaces of the contact opening and along planar surfaces of the dielectric layer to prevent selective loss defects from occurring during a subsequent selective deposition of conductive fill materials and during subsequent etching of other contact openings. The methods further include performing a selective bottom-up deposition of conductive fill material to form a second source/drain contact. According to some of the methods, once the second source/drain contact has been formed, the contact plug may be formed over the gate stack.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A connection structure of a ceramic cartridge of a faucet contains: a control body, a rotatable operation rod, a connection ring, a stop ring, a guide ring, and a seal washer. The control body includes an accommodation space and an outlet. The guiding ring includes a fan-shaped hole corresponding to multiple stopping fringes of the stop ring. The control body includes an orifice, and the rotatable operation rod includes multiple O rings fitted thereon to avoid a leakage of the waters. The orifice has a recess, and the rotatable operation rod includes a notch for accommodating a C retainer. The rotatable operation rod includes an insertion, and the connection ring includes a receiving trough. The insertion has a hook, and the receiving trough has a cutout configured to engage with the hook. The connection ring includes a rib. The stop ring includes an aperture and multiple stopping fringes.

Abstract: A gas pipe joint contains: a connection pipe, a first threaded pipe, and a second threaded pipe. The connection pipe includes a first part and a second part, the first part has a first threaded orifice, and the second part has a second threaded orifice. The first threaded pipe includes a first coupling section, a first nut section, and a second coupling section. The second threaded pipe includes a second nut section and a third coupling section, the second nut section has a second screwing portion, and the third coupling section has at least one second recessed portion and a second groove. The third coupling section has a second shoulder. The second shoulder has a second lower gasket. The first groove has two first loops, and the second groove has two second loops.

Abstract: A gas pipe joint contains: a connection pipe, a first threaded pipe, and a second threaded pipe. The connection pipe includes a first part and a second part, the first part has a first threaded orifice, and the second part has a second threaded orifice. The first threaded pipe includes a first coupling section, a first nut section, and a second coupling section. The second threaded pipe includes a second nut section and a third coupling section, the second nut section has a second screwing portion, and the third coupling section has at least one second recessed portion and a second groove. The third coupling section has a second shoulder. The second shoulder has a second lower gasket. The first groove has two first loops, and the second groove has two second loops.

Abstract: A rotary control structure for a water valve contains: a body, a connection disk, a guide disc, a guide disc, and a stop ring. The body accommodates a control shaft and includes a receiving space and an outlet. The connection disk is connected with a positioning disc including a sector cutout. The guide disc is mounted below the positioning disc and includes a fan-shaped aperture corresponding to the sector cutout. The stop ring is mounted below the fan-shaped aperture and limits the connection disk, the positioning disc, and the guide disc in the receiving space. The body includes a limitation slot, and the control shaft includes a fixing portion and a C-retainer fitted on the fixing portion. The control shaft further includes an insertion retained with a coupling groove of the connection disk, and the connection disk includes a rib configured to urge the positioning disc to rotate.

Abstract: An electronic device including a bio-polymer material and a method for manufacturing the same are disclosed. The electronic device of the present invention comprises: a substrate; a first electrode disposed on the substrate; a bio-polymer layer disposed on the first electrode, wherein the bio-polymeric material is selected from a group consisting of wool keratin, collagen hydrolysate, gelatin, whey protein and hydroxypropyl methylcellulose; and a second electrode disposed on the biopolymer material layer. The present invention is suitable for various electronic devices such as an organic thin film transistor, an organic floating gate memory, or a metal-insulator-metal capacitor.

Abstract: An improved structure for a communication probe component comprises a cylindrical housing, a post-shaped push up pin, an elastic component and a cap; wherein the cylindrical housing with hollow cavity has two oppositely disposed open ends, so that electrolyte may evenly and completely distribute on the inner wall and bottom surfaces of the hollow cavity during electroplating to ensure excellent electroplating quality; and since the electroplating quality is good for all parts of the communication probe component, the functionality of the communication probe component is ensured without concerns about poor electric conductivity or connection when used as a recharging pin or antenna signal pin for mobile phones