Abstract: A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent substrate integrated with the transparent portion. A plurality of through holes are defined on the transparent substrate.

Abstract: A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.

Abstract: An electronic device includes a speaker, and a cover covering the speaker. The cover includes a transparent main portion, and a non-transparent border portion. The non-transparent border portion includes a substrate integrated with the transparent main portion. The substrate of the border portion defines a plurality of through holes corresponding to the speaker to transmit sound output from the speaker.

Abstract: An electronic device includes a speaker, and a cover covering the speaker. The cover includes a transparent main portion, and a non-transparent border portion. The non-transparent border portion includes a substrate integrated with the transparent main portion. The substrate of the border portion defines a plurality of through holes corresponding to the speaker to transmit sound output from the speaker.

Abstract: A cover for an electronic device includes a main portion and a border portion beside the main portion. The border portion includes a transparent substrate and a adhesive layer. The transparent substrate defines at least one through hole. The adhesive layer is adhered to an inner wall of the at least one through hole.

Abstract: A cover for an electronic device includes a transparent portion and a non-transparent portion beside the transparent portion. The transparent portion defines a display area of the electronic device. The non-transparent portion defines a non-display area of the electronic device beside the display area. The non-transparent portion includes a transparent substrate integrated with the transparent portion. A plurality of through holes are defined on the transparent substrate.

Abstract: A die bonding apparatus and a die bonding method are provided, which are capable of simultaneously bonding a plurality of dies from a first placement area onto a substrate disposed on a second placement area. The die bonding apparatus includes a die sucking device which is movably located above the first placement area and a second placement area. The die sucking device includes a plurality of nozzles. The nozzles can suck the dies disposed on the first placement area, and then simultaneously bond the dies onto the substrate.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The adhesive layer is disposed between the electrode portion and the circuit portion to form an electrical connection therebetween. The adhesive layer is a material, which comprises a metal compound, with a Negative Coefficient of Thermal Expansion (Negative CTE). Because of the material with a Negative CTE, the alignment shift can be avoided after the chip and the substrate are adhered together.

Abstract: A chip bonding process includes the following steps. At least one chip is transferred onto a carrier, and a negative pressure environment is provided. Heat is provided to the at least one chip and/or the carrier, and a positive pressure is applied onto the at least one chip.

Abstract: A chip bonding apparatus includes a chamber, a chip transportation device, a heating device and a ventilation device. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The chip transportation device is used for transferring at least one chip onto a carrier within the chamber. The heating device is used for providing heat to the at least one chip and/or the carrier within the chamber. The ventilation device communicates gas to flow through the chamber to form a negative pressure environment therein. The negative pressure environment is provided when the chip transportation device transfers at least one chip onto the carrier within the chamber, and a positive pressure is applied onto the at least one chip when the heating device provides heat to the at least one chip and/or the carrier.