Abstract: A heat dissipation device includes a heat sink forming an engaging portion along an outer periphery thereof, a fan holder attached to the heat sink and a fan secured to the heat sink via the fan holder. The fan holder includes an elastic main body, a first clip pivotally connected to a free end of the elastic main body and a second clip connected with the first clip and engaging with an opposite free end of the elastic main body. The elastic main body includes a pair of fixing portions formed at upper and lower sides thereof. The lower fixing portion of the fan holder is tightly engaged with the engaging portion of the heat sink and the upper fixing portion presses the fan towards the heat sink when the second clip is tightly locked to the opposite free end of the elastic main body.

Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.

Abstract: A locking structure for assembling a first component to a second component. The locking structure includes a nut embedded into the first component and a bolt. The nut defines a groove in a circumferential periphery thereof. The first component forms a protrusion engaging into the grove of the nut. The bolt extends through the second component and screws into the nut.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs.

Abstract: A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.

Abstract: A heat dissipation device includes a heat sink, a heat-absorbing plate with two slots defined in two lateral sides thereof, a heat pipe connecting the heat-absorbing plate and the heat sink, and a clip having an abutting portion and two locking portions extending from two ends of the abutting portion. The abutting portion presses on the heat pipe, and the locking portions insert through the slots of the heat-absorbing plate and are then bent to lock on the heat-absorbing plate to thereby secure the heat pipe on the heat-absorbing plate.

Abstract: A heat dissipation device includes a heat sink and a blower. The heat sink has a base and a plurality of fins formed on the base. The blower includes a frame and an impeller rotatably secured to the frame. The frame faces and is secured to the base of the heat sink to define an airflow passage between the base of the heat sink and the blower. An airflow inlet is defined through the frame of the blower. Another airflow inlet is defined through the base of the heat sink. An airflow produced by the blower passes through the airflow passage via the airflow inlets and then blows towards channels defined between the fins of the heat sink.

Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.

Abstract: A heat dissipation device includes a heat sink forming an engaging portion along an outer periphery thereof, a fan holder attached to the heat sink and a fan secured to the heat sink via the fan holder. The fan holder includes an elastic main body, a first clip pivotally connected to a free end of the elastic main body and a second clip connected with the first clip and engaging with an opposite free end of the elastic main body. The elastic main body includes a pair of fixing portions formed at upper and lower sides thereof. The lower fixing portion of the fan holder is tightly engaged with the engaging portion of the heat sink and the upper fixing portion presses the fan towards the heat sink when the second clip is tightly locked to the opposite free end of the elastic main body.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs.

Abstract: A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.