Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A wear member assembly has a wear member, a wear member receiver with at least first and second contact portions and at least one aperture to receive at least one wear member locating member of the wear member. An attachment mechanism, releasably attaches the wear member to the receiver has at least one moveable attachment member and at least one respective fastening means. Actuation of each of the fastening means moves the associated attachment member to apply a retaining force to one of the contact portions of the receiver and causes the respective wear member locating member to apply a retaining force to the other of the contact portions of the receiver.

Abstract: A wear member assembly has a wear member, a wear member receiver with at least first and second contact portions and at least one aperture to receive at least one wear member locating member of the wear member. An attachment mechanism, releasably attaches the wear member to the receiver has at least one moveable attachment member and at least one respective fastening means. Actuation of each of the fastening means moves the associated attachment member to apply a retaining force to one of the contact portions of the receiver and causes the respective wear member locating member to apply a retaining force to the other of the contact portions of the receiver.