Abstract: A semiconductor structure includes a first device and a second device. The first device includes: a first gate structure formed over an active region and a first air spacer disposed adjacent to the first gate structure. The second device includes: a second gate structure formed over an isolation structure and a second air spacer disposed adjacent to the second gate structure. The first air spacer and the second air spacer have different sizes.

Abstract: A pattern decomposition method including following steps is provided. A target pattern is provided, wherein the target pattern includes first patterns and second patterns alternately arranged, and the width of the second pattern is greater than the width of the first pattern. Each of the second patterns is decomposed into a third pattern and a fourth pattern, wherein the third pattern and the fourth pattern have an overlapping portion, and a pattern formed by overlapping the third pattern and the fourth pattern is the same as the second pattern. The third patterns and the first pattern adjacent to the fourth pattern are designated as first photomask patterns of a first photomask. The fourth patterns and the first pattern adjacent to the third pattern are designated as second photomask patterns of a second photomask.

Abstract: A semiconductor chip includes a first intellectual property block. There are a second intellectual property block and a third intellectual property block around the first intellectual property block. There is a multiple metal layer stack over the first intellectual property block, the second intellectual property block, and the third intellectual property block. An interconnect structure is situated in the upper portion of the multiple metal layer stack. The interconnect structure is configured for connecting the first intellectual property block and the second intellectual property block. In addition, at least a part of the interconnect structure extends across and over the third intellectual property block.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: A tool includes a barrel, a guiding wire, and an electrically conductive member. The barrel is made of electrically conductive material. The guiding wire is disposed in the barrel. The barrel and the guiding wire are directly or indirectly connected to two opposite electrodes of a power source. The electrically conductive member is connected to an outer periphery of the guiding wire and is electrically connected to the guiding wire. The electrically conductive member is disposed between the barrel and the guiding wire and is spaced from the barrel. When the power source is activated, an electric arc is generated between the electrically conductive member and the barrel.

Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A ceiling fan motor housing and cover side fixing structure includes a motor housing, a cover and a stator. The motor housing includes a rotor and plural side guide holes formed on a sidewall. The cover includes plural fixing holes formed at an edge of a top circular flange, and the side guide holes opposite to the fixing holes are fixed by plural passing-through fixing members, so that the motor housing and the cover are combined for accommodating the stator to simplify the overall assembly of the ceiling fan motor effectively, and provide a convenient way of combining the motor housing and the cover without increasing the width. Further, the wire winding space of the stator in the motor housing and the cover of the ceiling fan motor is increased for convenient assembling.

Abstract: A ceiling fan motor housing and cover side fixing structure includes a motor housing, a cover and a stator. The motor housing includes a rotor and plural side guide holes formed on a sidewall. The cover includes plural fixing holes formed at an edge of a top circular flange, and the side guide holes opposite to the fixing holes are fixed by plural passing-through fixing members, so that the motor housing and the cover are combined for accommodating the stator to simplify the overall assembly of the ceiling fan motor effectively, and provide a convenient way of combining the motor housing and the cover without increasing the width. Further, the wire winding space of the stator in the motor housing and the cover of the ceiling fan motor is increased for convenient assembling.

Abstract: A tube assembly for a reverse osmosis filter cartridge has a tube body, an inlet port, an outlet port, two side assemblies and a stop cone. Each of the side assemblies has a block ring, a bearing plate, a sealing plate and a connecting tube. The sealing plate has a clamping segment and at least one rotation-stopping segment formed on an inward surface of the sealing plate, and the stop cone is securely mounted around the clamping segment and engages with the at least one rotation-stopping segment, thereby securely assembling the stop cone and the sealing plate to avoid relative shake and rotation.

Abstract: A block ring for a tube assembly for a reverse osmosis filter cartridge has multiple block segments connected to each other into a loop; any two adjacent ones of the block segments pivotally connected to each other, and outer ends of two of the block segments detachably abutting each other. For assembling, the block ring that is not formed into a loop yet is mounted into an outer annular groove of a tube body, and then the two block segments are rotated to make the outer ends abut each other. Thus, the block segments are braced transversely to securely abut the outer annular groove. Therefore, the block ring is securely mounted in the tube body. Besides, the block ring is integrated axially, such that the block ring can effectively and axially bear the outward abutting of a bearing plate, which prevents the block ring from deformation and enhances the safety.

Abstract: A method of removing the residue left after a plasma process is described. First, a substrate having at least a material layer thereon is provided. The material layer includes a metal. Then, a fluorine-containing plasma process is performed so that a residue containing the aforesaid metallic material is formed on the surface of the material layer. After that, a wet cleaning operation is performed using a cleaning agent to remove the residue. The cleaning agent is a solution containing water, a diluted hydrofluoric acid and an acid solution.

Abstract: An environmental survey robot suitable for wireless communicating with a survey action management center having a geographic information system to scheme an advance route with multiple check points is provided. The environmental survey robot includes a moving vehicle, a controlling computer, a wireless communication network, a Global positioning system, an environment detector, a solar cell and a power controller. The wireless communication network receives the advance route from the detecting action management center, and the controlling computer autonomously controls the moving vehicle to move in accordance with the advance route. The environmental detector is suitable for detecting the environment information and sending the same to the controlling computer. When the electricity of the solar cell is less than a predetermined value, the power controller will send the signal to the controlling computer such that the action controller will stop the action of the moving vehicle.

Abstract: A method of removing the residue left after a plasma process is described. First, a substrate having at least a material layer thereon is provided. The material layer includes a metal. Then, a fluorine-containing plasma process is performed so that a residue containing the aforesaid metallic material is formed on the surface of the material layer. After that, a wet cleaning operation is performed using a cleaning agent to remove the residue. The cleaning agent is a solution containing water, a diluted hydrofluoric acid and an acid solution.