Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An image sensor module comprises an image sensor having a light sensing area, a cover glass for covering the light sensing area, a dam between the image sensor and the cover glass, which surrounds the light sensing area, and has an outer wall and an inner wall, where a cross-section of the inner wall parallel to the surface of the light sensing area of the image sensor forms a sawtooth pattern and/or, where a cross-section of the inner wall orthogonal to the surface of the light sensing area of the image sensor forms an inclined surface.

Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: An IC structure includes a fin structure, a contact overlying the fin structure along a first direction, and an isolation layer between the contact and the fin structure. The isolation layer is adjacent to a portion of the contact along a second direction perpendicular to the first direction.

Abstract: An immersion cooling system includes a pressure seal tank, an electronic apparatus, a pressure balance pipe and a relief valve. The pressure seal tank is configured to store coolant. A vapor space is formed in the pressure seal tank above the liquid level of the coolant. The electronic apparatus is completely immersed in the coolant. The pressure balance pipe has a gas collection length. The first port of the pressure balance pipe is disposed on the top surface of the pressure seal tank. The relief valve is disposed on the second port of the pressure balance pipe. The second port is farther away from the top surface of the pressure seal tank than the first port. The gas collection length of the pressure equalization tube allows the concentration of vaporized coolant at the first port to be greater than the concentration of vaporized coolant at the second port.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: Provided is a lentivirus packaging system, which comprises: a transfer plasmid comprising a nucleotide sequence of TAR-reserved-chimeric 5? long terminal repeat (LTR); at least one packaging plasmid comprising a nucleotide sequence encoding TAR RNA binding protein, a nucleotide sequence of rev gene, a nucleotide sequence of gag gene, and a nucleotide sequence of pol gene; and an envelope plasmid. Due to the expression of gene of TAR RNA binding protein by the packaging plasmids, the produced lentivirus has higher virus titer and can improve the transduction rate and the gene delivery efficiency during cell transduction. The present invention further provides a method of improving lentivirus production in a host cell, which comprises using the lentivirus packaging system to transfect the host cell. The present invention further provides a cell transduced by the lentivirus and a method of using the cell for treating cancer.

Abstract: A direct-type light source module including N-stage light sources and an optical sheet is provided. The optical sheet is disposed above the N-stage light sources, and an optical distance between the i-th-stage light source and the optical sheet is smaller than an optical distance between the i+1-th-stage light source and the optical sheet, where 1?i<N, and N is a positive integer greater than 1. A display device is also provided.

Abstract: The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes providing a substrate, the substrate includes a first fin, a second fin, and an isolation region disposed between the first fin and the second fin. The second fin includes a different material than a material of the substrate. The method includes forming an oxide over the first fin, the second fin, and a top surface of the isolation region at a temperature of about 400 degrees C. or less, and post-treating the oxide at a temperature of about 600 degrees C. or less.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a method of manufacturing a semiconductor device includes providing a substrate, the substrate includes a first fin, a second fin, and an isolation region disposed between the first fin and the second fin. The second fin includes a different material than a material of the substrate. The method includes forming an oxide over the first fin, the second fin, and a top surface of the isolation region at a temperature of about 400 degrees C. or less, and post-treating the oxide at a temperature of about 600 degrees C. or less.

Abstract: A touch panel is provided. The touch panel having a pixel area and a sensing area includes a first substrate and an opposite second substrate. A press sensing spacer is disposed on the sensing area of the first substrate. A press sensing stage is disposed on the sensing area of the second substrate, corresponding to the press sensing spacer. An alignment layer is disposed over the second substrate, covering the press sensing stage and the pixel area of the second substrate. In an embodiment, the height of the press sensing stage is greater than the height from the surface of the second substrate at the pixel area to the bottom of the alignment layer by at least 0.05 ?m.

Abstract: A method and a control board for eliminating power-off residual images in a display and a display using the same are provided. The method includes the following steps of providing a first voltage to compensate a second voltage which is used for sequentially turning on all scan lines within a display panel when the display is in power-off, and then forming a third voltage to turn on all scan lines within the display panel according to the compensated second voltage.

Abstract: A touch panel is provided. The touch panel having a pixel area and a sensing area includes a first substrate and an opposite second substrate. A press sensing spacer is disposed on the sensing area of the first substrate. A press sensing stage is disposed on the sensing area of the second substrate, corresponding to the press sensing spacer. An alignment layer is disposed over the second substrate, covering the press sensing stage and the pixel area of the second substrate. In an embodiment, the height of the press sensing stage is greater than the height from the surface of the second substrate at the pixel area to the bottom of the alignment layer by at least 0.05 ?m.

Abstract: A backlight module includes a back plate structure, a light source disposed in the back plate structure, at least one wire connected to the light source, and at least one wire fixing frame fixed on the back plate structure. Each wire fixing frame includes a main part, a first fixing part disposed on a side of the main part, a second fixing part disposed on a side of the main part and opposite to the first fixing part, and an extending part extending in a direction from the second fixing part to the first fixing part. A wire outlet is defined between the extending part and the first fixed part, and a wire inlet is opposite to the wire outlet. A wire hold space is defined among the main part, the first fixing part, the second fixing part, and the back plate structure.

Abstract: A backlight module includes a back plate structure, a light source disposed in the back plate structure, at least one wire connected to the light source, and at least one wire fixing frame fixed on the back plate structure. Each wire fixing frame includes a main part, a first fixing part disposed on a side of the main part, a second fixing part disposed on a side of the main part and opposite to the first fixing part, and an extending part extending in a direction from the second fixing part to the first fixing part. A wire outlet is defined between the extending part and the first fixed part, and a wire inlet is opposite to the wire outlet. A wire hold space is defined among the main part, the first fixing part, the second fixing part, and the back plate structure.

Abstract: A wire fixing frame for fixing at least one wire on a substrate is described. The wire fixing frame includes a main part, a first fixing part, a second fixing part, and an extending part. A wire outlet is defined between the extending part and the first fixed part, and a wire inlet is opposite to the wire outlet. A wire hold space is defined among the main part, the first fixing part, the second fixing part, and the substrate. The wire passes from the wire inlet to the wire outlet through the wire hold space, and the wire is fixed at a position by a round corner of the first fixing part and the extending part.

Abstract: A method and a control board for eliminating power-off residual images in a display and a display using the same are provided. The method includes the following steps of providing a first voltage to compensate a second voltage which is used for sequentially turning on all scan lines within a display panel when the display is in power-off, and then forming a third voltage to turn on all scan lines within the display panel according to the compensated second voltage.