Abstract: A wavelength conversion module and a projection device are provided. The projection device includes an illumination system providing an illumination light, a light valve forming the illumination light into an image light, and a projection lens forming the image light into a projection light. The illumination system includes an excitation light source providing an excitation light, and a wavelength conversion module receiving the excitation light. The wavelength conversion module includes a case and a wavelength conversion layer. The case has a liquid inlet, a liquid outlet, and a cavity connecting the liquid inlet and the liquid outlet for circulation of a cooling liquid. The wavelength conversion layer is located on the case, wherein the relative positions of the wavelength conversion layer and the excitation light remain unchanged. The projection device and the wavelength conversion module have good reliability.

Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.

Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.

Abstract: A thermal module and a projector using the same are provided. The thermal module comprises a heat sink and a base. The heat sink comprises a bottom, a plurality of fins, a cover, and a plurality of side walls. The fins are disposed on the bottom, and each of the fins comprises a reference plane and a plurality of protrusions, wherein adjacent two of the protrusions are convex toward opposite directions with respect to the reference plane, and rows of through holes are formed by adjacent two protrusions along a flowing direction. The cover is disposed on the fins. The side walls are disposed between the bottom and the cover and surrounding the fins, wherein a liquid is capable of flowing through the heat sink by entering the inlet and exiting by the outlet of the side walls or the cover. The bottom of the heat sink is disposed on the base.

Abstract: A liquid cooled heat dissipation module includes a housing and at least one flow channel. The housing includes a chamber, and the at least one flow channel is located in the chamber. The housing includes an upper plate, a lower plate, and a plurality of annular wall portions. Two ends of each of the annular wall portions are respectively connected to the upper plate and the lower plate. The annular wall portions respectively form a plurality of through-holes between the upper plate and the lower plate, and the through-holes penetrate through the upper plate and the lower plate. The at least one flow channel is located between two adjacent annular wall portions. In addition, a projection device is also provided.

Abstract: A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.

Abstract: The invention provides a liquid-cooling device, including a shell, wherein the shell includes a top plate, a bottom plate, a front plate, a rear plate and two opposite side plates, and form an accommodating space. At least one water inlet pipe is disposed on the top plate of the shell and communicates with the accommodating space. At least one water outlet pipe is disposed on the front plate of the shell and communicates with the accommodating space. A plurality of heat-dissipating fins is disposed in the accommodating space. A partition plate is disposed in the accommodating space. The partition plate forms at least two flow passages in the accommodating space.

Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.

Abstract: A projector includes a casing, an optical engine module, and a heat dissipation module. The optical engine module is disposed in the casing. The heat dissipation module is disposed in the casing and includes a heat dissipation fin set. The heat dissipation fin set includes at least one heat dissipation fin and at least one turbulent structure. The heat dissipation fin has a surface. The surface includes a first turbulent region and a second turbulent region. The first turbulent region is adjacent to the second turbulent region. The turbulent structure is disposed at least one of the first turbulent region and the second turbulent region, and the turbulent structure protrudes from the surface. An opening is formed between a top end of the turbulent structure and the surface.

Abstract: A planar heat dissipating device includes: a planar housing defining a planar inner space therein; and a partitioning unit dividing the inner space into a plurality of upper fluid channels and a plurality of lower fluid channels that cross the upper fluid channels. Each of the upper fluid channels is in fluid communication with at least one of the lower fluid channels at an intersection therebetween.

Abstract: A planar heat dissipating device includes: a planar housing defining a planar inner space therein; and a partitioning unit dividing the inner space into a plurality of upper fluid channels and a plurality of lower fluid channels that cross the upper fluid channels. Each of the upper fluid channels is in fluid communication with at least one of the lower fluid channels at an intersection therebetween.

Abstract: The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a top plate and a side plate, wherein the top plate curves and extends to be the side plate. The top plate includes a sink contacting with the chip.

Abstract: The present invention relates to a thermal dissipating element of a chip to dissipate heat producing by operating the chip. The thermal dissipating element includes a cover and a lump. The cover includes a top plate and a side plate, wherein the top plate curves and extendedly connects to the side plate. The lump is fastened between the chip and the top plate of the cover.

Abstract: A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.

Abstract: A die paddle for receiving an integrated circuit die in a plastic substrate. The die paddle is defined by a copper film on the plastic substrate and comprises a plurality of via holes through the plastic substrate, a plurality of opening through the copper film, and a gold-containing ring formed on the peripheral portion of the copper film. The outermost openings (and/or the outermost via holes) and the gold-containing ring are separated by a distance of about 1 to about 20 mils.