Patents by Inventor Wei-Chih Kao
Wei-Chih Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178128Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall. The structure also includes a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type. The structure further includes a gate bridge contact disposed on the first dielectric wall, and a gate via contact disposed on the gate bridge contact.Type: ApplicationFiled: January 22, 2023Publication date: May 30, 2024Inventors: Hong-Chih CHEN, Chun-Sheng LIANG, Yu-San CHIEN, Wei-Chih KAO
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Patent number: 11997066Abstract: A data transmission system and method thereof for edge computing are provided. A terminal mobile station international subscriber directory number (MSISDN) and a terminal IP of a target terminal are obtained with a domain name system (DNS) by a device providing communication services from the data transmission system. After data packets are sent to the data transmission system, if the target terminal is in an idle mode, a paging message is sent by a terminal wake-up module to enable the target terminal to return to a connected mode for communication. Before a connection is established between the data transmission system and the target terminal, downlink data packets can be temporarily stored, and the packets can be sent after the target terminal is in the connected mode. A computer readable medium for executing the data transmission method is also provided.Type: GrantFiled: January 9, 2023Date of Patent: May 28, 2024Assignee: CHUNGHWA TELECOM CO., LTD.Inventors: Yi-Hua Wu, Wei-Shan Lu, Kang-Hao Lo, Cheng-Yi Chien, Yueh-Feng Li, Ling-Chih Kao
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Publication number: 20240120334Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an isolation layer over a substrate. The method includes forming a spacer layer over the first fin, the second fin, and the isolation layer. The method includes forming a gate dielectric layer in the first trench and covering the first fin, the second fin, and the isolation layer exposed by the first trench. The method includes partially removing the gate dielectric layer to form a second trench in the gate dielectric layer and between the first fin and the second fin. The method includes forming a gate electrode in the first trench of the spacer layer and over the gate dielectric layer.Type: ApplicationFiled: February 9, 2023Publication date: April 11, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Chih KAO, Hsin-Che CHIANG, Jeng-Ya YEH
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Patent number: 11923194Abstract: A semiconductor device includes a semiconductor substrate having a first lattice constant, a dopant blocking layer disposed over the semiconductor substrate, the dopant blocking layer having a second lattice constant different from the first lattice constant, and a buffer layer disposed over the dopant blocking layer, the buffer layer having a third lattice constant different from the second lattice constant. The semiconductor device also includes a plurality of channel members suspended over the buffer layer, an epitaxial feature abutting the channel members, and a gate structure wrapping each of the channel members.Type: GrantFiled: April 25, 2022Date of Patent: March 5, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Kuo-Hua Pan
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Publication number: 20240021480Abstract: A semiconductor device structure and a formation method are provided. The method includes forming a first dielectric fin and a second dielectric fin over a substrate, and the second dielectric fin is taller than the first dielectric fin. The method also includes forming a gate stack over the substrate, and the gate stack extends across the first dielectric fin and the second dielectric fin. The method further includes partially removing the gate stack such that an opening exposing the second dielectric fin is formed and forming an isolation structure in the opening.Type: ApplicationFiled: July 14, 2022Publication date: January 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsin-Che CHIANG, Wei-Chih KAO
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Publication number: 20230420505Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes first and second gate structures formed over a semiconductor substrate and a multilayer gate isolation structure separating the first gate structure from the second gate structure. The multilayer gate isolation structure includes a first insulating feature adjacent to upper portions of the first gate structure and the second gate structure, and a second insulating feature separating the semiconductor substrate from the first insulating feature. The material of the second insulating feature is different than that of the first insulating feature. The second insulating feature has a lower dielectric constant or lower etch resistance than the first insulating feature.Type: ApplicationFiled: June 22, 2022Publication date: December 28, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hong-Chih CHEN, Wei-Chih KAO, Chun-Yi CHANG, Yu-San CHIEN, Hsin-Che CHIANG, Chun-Sheng LIANG
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Patent number: 11848373Abstract: A dummy fin described herein includes a low dielectric constant (low-k or LK) material outer shell. A leakage path that would otherwise occur due to a void being formed in the low-k material outer shell is filled with a high dielectric constant (high-k or HK) material inner core. This increases the effectiveness of the dummy fin to provide electrical isolation and increases device performance of a semiconductor device in which the dummy fin is included. Moreover, the dummy fin described herein may not suffer from bending issues experienced in other types of dummy fins, which may otherwise cause high-k induced alternating current (AC) performance degradation. The processes for forming the dummy fins described herein are compatible with other fin field effect transistor (finFET) formation processes and are be easily integrated to minimize and/or prevent polishing issues, etch back issues, and/or other types of semiconductor processing issues.Type: GrantFiled: June 21, 2021Date of Patent: December 19, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih Kao, Hsin-Che Chiang, Chun-Sheng Liang, Kuo-Hua Pan
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Publication number: 20230387274Abstract: A dummy fin described herein includes a low dielectric constant (low-k or LK) material outer shell. A leakage path that would otherwise occur due to a void being formed in the low-k material outer shell is filled with a high dielectric constant (high-k or HK) material inner core. This increases the effectiveness of the dummy fin to provide electrical isolation and increases device performance of a semiconductor device in which the dummy fin is included. Moreover, the dummy fin described herein may not suffer from bending issues experienced in other types of dummy fins, which may otherwise cause high-k induced alternating current (AC) performance degradation. The processes for forming the dummy fins described herein are compatible with other fin field effect transistor (finFET) formation processes and are be easily integrated to minimize and/or prevent polishing issues, etch back issues, and/or other types of semiconductor processing issues.Type: ApplicationFiled: August 10, 2023Publication date: November 30, 2023Inventors: Wei-Chih KAO, Hsin-Che CHIANG, Chun-Sheng LIANG, Kuo-Hua PAN
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Publication number: 20230369465Abstract: An embodiment method includes: forming a semiconductor liner layer on exposed surfaces of a fin structure that extends above a dielectric isolation structure disposed over a substrate; forming a first capping layer to laterally surround a bottom portion of the semiconductor liner layer; forming a second capping layer over an upper portion of the semiconductor liner layer; and annealing the fin structure having the semiconductor liner layer, the first capping layer, and the second capping layer thereon, the annealing driving a dopant from the semiconductor liner layer into the fin structure, wherein a dopant concentration profile in a bottom portion of the fin structure is different from a dopant concentration profile in an upper portion of the fin structure.Type: ApplicationFiled: July 20, 2023Publication date: November 16, 2023Inventors: Wei-Chih Kao, Hsin-Che Chiang, Yu-San Chien, Chun-Sheng Liang, Kuo-Hua Pan
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Patent number: 11799017Abstract: An embodiment method includes: forming a semiconductor liner layer on exposed surfaces of a fin structure that extends above a dielectric isolation structure disposed over a substrate; forming a first capping layer to laterally surround a bottom portion of the semiconductor liner layer; forming a second capping layer over an upper portion of the semiconductor liner layer; and annealing the fin structure having the semiconductor liner layer, the first capping layer, and the second capping layer thereon, the annealing driving a dopant from the semiconductor liner layer into the fin structure, wherein a dopant concentration profile in a bottom portion of the fin structure is different from a dopant concentration profile in an upper portion of the fin structure.Type: GrantFiled: March 22, 2022Date of Patent: October 24, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Wei-Chih Kao, Hsin-Che Chiang, Yu-San Chien, Chun-Sheng Liang, Kuo-Hua Pan
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Patent number: 11502189Abstract: Charge storage and sensing devices having a tunnel diode operable to sense charges stored in a charge storage structure are provided. In some embodiments, a device includes a substrate, a charge storage device on the substrate, and tunnel diode on the substrate adjacent to the charge storage device. The tunnel diode includes a tunnel diode dielectric layer on the substrate, and a tunnel diode electrode on the tunnel diode dielectric layer. A substrate electrode is disposed on the doped region of the substrate, and the tunnel diode electrode is positioned between the charge storage device and the substrate electrode.Type: GrantFiled: December 3, 2020Date of Patent: November 15, 2022Assignees: Taiwan Semiconductor Manufacturing Co., Ltd., National Taiwan UniversityInventors: Jenn-Gwo Hwu, Chien-Shun Liao, Wei-Chih Kao
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Publication number: 20220328654Abstract: A dummy fin described herein includes a low dielectric constant (low-k or LK) material outer shell. A leakage path that would otherwise occur due to a void being formed in the low-k material outer shell is filled with a high dielectric constant (high-k or HK) material inner core. This increases the effectiveness of the dummy fin to provide electrical isolation and increases device performance of a semiconductor device in which the dummy fin is included. Moreover, the dummy fin described herein may not suffer from bending issues experienced in other types of dummy fins, which may otherwise cause high-k induced alternating current (AC) performance degradation. The processes for forming the dummy fins described herein are compatible with other fin field effect transistor (finFET) formation processes and are be easily integrated to minimize and/or prevent polishing issues, etch back issues, and/or other types of semiconductor processing issues.Type: ApplicationFiled: June 21, 2021Publication date: October 13, 2022Inventors: Wei-Chih KAO, Hsin-Che CHIANG, Chun-Sheng LIANG, Kuo-Hua PAN
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Publication number: 20220254623Abstract: A semiconductor device includes a semiconductor substrate having a first lattice constant, a dopant blocking layer disposed over the semiconductor substrate, the dopant blocking layer having a second lattice constant different from the first lattice constant, and a buffer layer disposed over the dopant blocking layer, the buffer layer having a third lattice constant different from the second lattice constant. The semiconductor device also includes a plurality of channel members suspended over the buffer layer, an epitaxial feature abutting the channel members, and a gate structure wrapping each of the channel members.Type: ApplicationFiled: April 25, 2022Publication date: August 11, 2022Inventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Kuo-Hua Pan
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Publication number: 20220216329Abstract: An embodiment method includes: forming a semiconductor liner layer on exposed surfaces of a fin structure that extends above a dielectric isolation structure disposed over a substrate; forming a first capping layer to laterally surround a bottom portion of the semiconductor liner layer; forming a second capping layer over an upper portion of the semiconductor liner layer; and annealing the fin structure having the semiconductor liner layer, the first capping layer, and the second capping layer thereon, the annealing driving a dopant from the semiconductor liner layer into the fin structure, wherein a dopant concentration profile in a bottom portion of the fin structure is different from a dopant concentration profile in an upper portion of the fin structure.Type: ApplicationFiled: March 22, 2022Publication date: July 7, 2022Inventors: Wei-Chih Kao, Hsin-Che Chiang, Yu-San Chien, Chun-Sheng Liang, Kuo-Hua Pan
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Patent number: 11315785Abstract: A method includes providing a semiconductor substrate; epitaxially growing a blocking layer from a top surface of the semiconductor substrate, wherein the blocking layer has a lattice constant different from the semiconductor substrate; epitaxially growing a semiconductor layer above the blocking layer; patterning the semiconductor layer to form a semiconductor fin, wherein the blocking layer is under the semiconductor fin; forming a source/drain (S/D) feature in contact with the semiconductor fin; and forming a gate structure engaging the semiconductor fin.Type: GrantFiled: September 17, 2019Date of Patent: April 26, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Kuo-Hua Pan
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Patent number: 11282942Abstract: An embodiment method includes: forming a semiconductor liner layer on exposed surfaces of a fin structure that extends above a dielectric isolation structure disposed over a substrate; forming a first capping layer to laterally surround a bottom portion of the semiconductor liner layer; forming a second capping layer over an upper portion of the semiconductor liner layer; and annealing the fin structure having the semiconductor liner layer, the first capping layer, and the second capping layer thereon, the annealing driving a dopant from the semiconductor liner layer into the fin structure, wherein a dopant concentration profile in a bottom portion of the fin structure is different from a dopant concentration profile in an upper portion of the fin structure.Type: GrantFiled: July 10, 2020Date of Patent: March 22, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Chih Kao, Hsin-Che Chiang, Yu-San Chien, Chun-Sheng Liang, Kuo-Hua Pan
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Publication number: 20210119026Abstract: Charge storage and sensing devices having a tunnel diode operable to sense charges stored in a charge storage structure are provided. In some embodiments, a device includes a substrate, a charge storage device on the substrate, and tunnel diode on the substrate adjacent to the charge storage device. The tunnel diode includes a tunnel diode dielectric layer on the substrate, and a tunnel diode electrode on the tunnel diode dielectric layer. A substrate electrode is disposed on the doped region of the substrate, and the tunnel diode electrode is positioned between the charge storage device and the substrate electrode.Type: ApplicationFiled: December 3, 2020Publication date: April 22, 2021Inventors: Jenn-Gwo Hwu, Chien-Shun Liao, Wei-Chih Kao
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Publication number: 20210082686Abstract: A method includes providing a semiconductor substrate; epitaxially growing a blocking layer from a top surface of the semiconductor substrate, wherein the blocking layer has a lattice constant different from the semiconductor substrate; epitaxially growing a semiconductor layer above the blocking layer; patterning the semiconductor layer to form a semiconductor fin, wherein the blocking layer is under the semiconductor fin; forming a source/drain (S/D) feature in contact with the semiconductor fin; and forming a gate structure engaging the semiconductor fin.Type: ApplicationFiled: September 17, 2019Publication date: March 18, 2021Inventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Kuo-Hua Pan
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Publication number: 20210066476Abstract: An embodiment method includes: forming a semiconductor liner layer on exposed surfaces of a fin structure that extends above a dielectric isolation structure disposed over a substrate; forming a first capping layer to laterally surround a bottom portion of the semiconductor liner layer; forming a second capping layer over an upper portion of the semiconductor liner layer; and annealing the fin structure having the semiconductor liner layer, the first capping layer, and the second capping layer thereon, the annealing driving a dopant from the semiconductor liner layer into the fin structure, wherein a dopant concentration profile in a bottom portion of the fin structure is different from a dopant concentration profile in an upper portion of the fin structure.Type: ApplicationFiled: July 10, 2020Publication date: March 4, 2021Inventors: Wei-Chih Kao, Hsin-Che Chiang, Yu-San Chien, Chun-Sheng Liang, Kuo-Hua Pan
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Patent number: 10879393Abstract: A method of fabricating a semiconductor device includes forming a dummy gate structure on a substrate, forming gate spacers on sidewalls of the dummy gate structure, and depositing an interlayer dielectric layer around the gate spacers. The method also includes removing the dummy gate structure to form a space between the gate spacers, and forming a gate structure in the space, wherein the gate structure includes a gate dielectric layer and a gate electrode layer over the gate dielectric layer. The method further includes removing a portion of the gate electrode layer to form a recess that is surrounded by the gate dielectric layer. In addition, the method includes implanting on the interlayer dielectric layer to form a strained layer for bending the gate dielectric layer and the gate spacers towards the recess.Type: GrantFiled: October 5, 2018Date of Patent: December 29, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Jeng-Ya Yeh