Patents by Inventor Wei-Chu LIN
Wei-Chu LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11851318Abstract: A microelectromechanical system device includes a substrate, a dielectric layer, an electrode, a surface modification layer and a membrane. The dielectric layer is formed on the substrate, and is formed with a cavity that is defined by a cavity-defining wall. The electrode is formed in the dielectric layer. The surface modification layer covers the cavity-defining wall, and has a plurality of hydrophobic end groups. The membrane is connected to the dielectric layer, and seals the cavity. The membrane is movable toward or away from the electrode. A method for making a microelectromechanical system device is also provided.Type: GrantFiled: April 22, 2021Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Xin-Hua Huang, Wei-Chu Lin
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Publication number: 20230382719Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including bonding a capping substrate over a sensing substrate, forming a through hole traversing the capping substrate, forming a dielectric layer over the capping substrate under a first vacuum level, and forming a metal layer over the dielectric layer under a second vacuum level, wherein the second vacuum level is higher than the first vacuum level.Type: ApplicationFiled: July 27, 2023Publication date: November 30, 2023Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Patent number: 11772960Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including bonding a capping substrate over a sensing substrate, forming a through hole traversing the capping substrate, forming a dielectric layer over the capping substrate under a first vacuum level, and forming a metal layer over the dielectric layer under a second vacuum level, wherein the second vacuum level is higher than the first vacuum level.Type: GrantFiled: March 22, 2021Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu
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Patent number: 11516596Abstract: A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.Type: GrantFiled: October 30, 2020Date of Patent: November 29, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Chu Lin, Yi-Chuan Teng, Jung-Kuo Tu
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Publication number: 20220367378Abstract: A method for forming a semiconductor device includes receiving a first bonded to a second substrate by a dielectric layer, wherein a conductive layer is disposed in the dielectric layer and a cavity is formed between the first substrate, the second substrate and the dielectric layer; forming a via opening in the second substrate to expose the conductive layer and a vent hole in the substrate to couple to the cavity; forming a first buffer layer covering sidewalls of the via opening and a second buffer layer covering sidewalls of the vent hole; and forming a connecting structure in the via opening and a sealing structure to seal the vent hole.Type: ApplicationFiled: July 27, 2022Publication date: November 17, 2022Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Publication number: 20220340407Abstract: A microelectromechanical system device includes a substrate, a dielectric layer, an electrode, a surface modification layer and a membrane. The dielectric layer is formed on the substrate, and is formed with a cavity that is defined by a cavity-defining wall. The electrode is formed in the dielectric layer. The surface modification layer covers the cavity-defining wall, and has a plurality of hydrophobic end groups. The membrane is connected to the dielectric layer, and seals the cavity. The membrane is movable toward or away from the electrode. A method for making a microelectromechanical system device is also provided.Type: ApplicationFiled: April 22, 2021Publication date: October 27, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Chuan TENG, Ching-Kai SHEN, Jung-Kuo TU, Wei-Cheng SHEN, Xin-Hua HUANG, Wei-Chu LIN
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Patent number: 11462478Abstract: A semiconductor device includes a first substrate; a dielectric layer disposed over the first substrate and a conductive layer disposed in the dielectric layer; a second substrate bonded to the dielectric layer, wherein the second substrate has a first surface facing the first substrate and a second surface opposite to the first substrate; a connecting structure penetrating the second substrate and a portion of the dielectric layer and electrically coupled to the conductive layer; a vent hole penetrating the second substrate from the second surface to the first surface; a first buffer layer between the connecting structure and the dielectric layer and between the connecting structure and the second substrate; and a second buffer layer covering sidewalls of the vent hole and exposed through the first surface of the second substrate. The first buffer layer and the second buffer layer include a same material and a same thickness.Type: GrantFiled: May 30, 2019Date of Patent: October 4, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu
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Publication number: 20220141596Abstract: A MEMS device and a method for manufacturing a MEMS device are provided. The MEMS device includes an anchor, a diaphragm structure, and a sealing film. The diaphragm structure is disposed over the anchor and has an opening through the diaphragm structure. The sealing film covers at least a portion of the opening of the diaphragm structure.Type: ApplicationFiled: October 30, 2020Publication date: May 5, 2022Inventors: WEI-CHU LIN, YI-CHUAN TENG, JUNG-KUO TU
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Publication number: 20210206627Abstract: The present disclosure provides a method for fabricating a semiconductor structure, including bonding a capping substrate over a sensing substrate, forming a through hole traversing the capping substrate, forming a dielectric layer over the capping substrate under a first vacuum level, and forming a metal layer over the dielectric layer under a second vacuum level, wherein the second vacuum level is higher than the first vacuum level.Type: ApplicationFiled: March 22, 2021Publication date: July 8, 2021Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Patent number: 10961114Abstract: The present disclosure provides a semiconductor structure, including a sensing substrate, a capping substrate over the sensing substrate, the capping substrate having a first surface facing toward the sensing substrate and a second surface facing away from the sensing substrate, wherein the capping substrate comprises a through hole extending from the first surface to the second surface, a spacer between the sensing substrate and the capping substrate, the spacer, the sensing substrate, and the capping substrate forming a cavity connecting with the through hole, and a sealing structure at the second surface and aligning with the through hole, wherein the sealing structure comprises a metal layer and a dielectric layer.Type: GrantFiled: May 30, 2019Date of Patent: March 30, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ching-Kai Shen, Yi-Chuan Teng, Wei-Chu Lin, Hung-Wei Liang, Jung-Kuo Tu
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Publication number: 20200377362Abstract: The present disclosure provides a semiconductor structure, including a sensing substrate, a capping substrate over the sensing substrate, the capping substrate having a first surface facing toward the sensing substrate and a second surface facing away from the sensing substrate, wherein the capping substrate comprises a through hole extending from the first surface to the second surface, a spacer between the sensing substrate and the capping substrate, the spacer, the sensing substrate, and the capping substrate forming a cavity connecting with the through hole, and a sealing structure at the second surface and aligning with the through hole, wherein the sealing structure comprises a metal layer and a dielectric layer.Type: ApplicationFiled: May 30, 2019Publication date: December 3, 2020Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Publication number: 20200381366Abstract: A semiconductor device includes a first substrate; a dielectric layer disposed over the first substrate and a conductive layer disposed in the dielectric layer; a second substrate bonded to the dielectric layer, wherein the second substrate has a first surface facing the first substrate and a second surface opposite to the first substrate; a connecting structure penetrating the second substrate and a portion of the dielectric layer and electrically coupled to the conductive layer; a vent hole penetrating the second substrate from the second surface to the first surface; a first buffer layer between the connecting structure and the dielectric layer and between the connecting structure and the second substrate; and a second buffer layer covering sidewalls of the vent hole and exposed through the first surface of the second substrate. The first buffer layer and the second buffer layer include a same material and a same thickness.Type: ApplicationFiled: May 30, 2019Publication date: December 3, 2020Inventors: CHING-KAI SHEN, YI-CHUAN TENG, WEI-CHU LIN, HUNG-WEI LIANG, JUNG-KUO TU
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Patent number: 10456881Abstract: The disclosure relates to a machine tool. The machine tool includes machine base, guide rails, and movable main structure. The movable main structure is slidably disposed on the machine base via the guide rails, and each guide rail has bearing surfaces. The machine tool has X-axis, Y-axis, and Z-axis, the Z-axis is substantially parallel to an axis of a chuck of the machine tool, and the Y-axis is substantially parallel to a sliding direction of the movable main structure. The machine tool characterized in that: normal directions of the bearing surfaces of the guide rails are not parallel to the X-axis, the Y-axis, the Z-axis of the machine tool and a reference line that passes through the guide rails.Type: GrantFiled: January 29, 2019Date of Patent: October 29, 2019Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wei Chen Lin, Jen Ji Wang, Hsiao Chen Ho, Wei Chu Lin
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Publication number: 20160154676Abstract: A method of resource allocation in a server system includes predicting a resource requirement of an application by adopting a neural network algorithm. When the resource requirement of the application is greater than a virtual machine allocation threshold, turn on a virtual machine for the application and adjust the value of the virtual machine allocation threshold to be the sum of the virtual machine allocation threshold and a resource capacity of the virtual machine.Type: ApplicationFiled: March 30, 2015Publication date: June 2, 2016Inventors: Hung-Pin Wen, Wei-Chu Lin, Gen-Hen Liu, Kuan-Tsen Kuo, Kuo-Feng Huang, Dean-Chung Wang
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Patent number: 9102474Abstract: A rotation mechanism includes a mandrel, a rotation axle, a needle roller bearing and an angular bearing. The mandrel includes a shaft portion, a first annular contact portion and a second annular contact portion. The shaft portion has an outer surface, and the first annular contact portion and the second annular contact portion are located on the outer surface and respectively surround the axis of the mandrel. The rotation axle includes an annular portion, a third annular contact portion and a fourth annular contact portion. The annular portion has a shaft hole and an inner surface forming the shaft hole. The third annular contact portion and the fourth annular contact portion are located on the inner surface, and the mandrel passes through the shaft hole. The needle roller bearing is in contact with the first annular contact portion and the third annular contact portion, and is located between them.Type: GrantFiled: February 10, 2014Date of Patent: August 11, 2015Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Wei-Chu Lin, Mei-Chin Chou, Yu-Shiang Huang, Hsin-Chuan Su, Hsi-Hung Hsiao
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Publication number: 20150139759Abstract: A rotation mechanism includes a mandrel, a rotation axle, a needle roller bearing and an angular bearing. The mandrel includes a shaft portion, a first annular contact portion and a second annular contact portion. The shaft portion has an outer surface, and the first annular contact portion and the second annular contact portion are located on the outer surface and respectively surround the axis of the mandrel. The rotation axle includes an annular portion, a third annular contact portion and a fourth annular contact portion. The annular portion has a shaft hole and an inner surface forming the shaft hole. The third annular contact portion and the fourth annular contact portion are located on the inner surface, and the mandrel passes through the shaft hole. The needle roller bearing is in contact with the first annular contact portion and the third annular contact portion, and is located between them.Type: ApplicationFiled: February 10, 2014Publication date: May 21, 2015Applicant: Industrial Technology Research InstituteInventors: Wei-Chu LIN, Mei-Chin CHOU, Yu-Shiang HUANG, Hsin-Chuan SU, Hsi-Hung HSIAO