Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: A controlling method for protecting an electronic apparatus, performed by the electronic apparatus to determine whether the system temperature thereof is overheated, so as to switch the electronic apparatus into a low-power operation mode when the system temperature is overheated. The controlling method is to monitor an electronic component of the electronic apparatus, so as to obtain the current temperature and the current working power of the electronic component and to determine whether the system temperature is overheated according to the current temperature and the current working power. When the system temperature is overheated, an overheating signal is generated to switch the electronic apparatus into the low-power operation mode.

Abstract: The disclosure relates to a method, circuit, and electronic device for controlling a rotation speed of a fan. The method provides a multistage function curve associates temperatures with rotation speed values. The multistage function curve comprises a first steady-state function segment with slope of zero, a second steady-state function segment with slope of zero and N function segments positioned between the first and second steady-state function segments. N is a positive integer. The slope of a (i+1)th function segment is greater than that of an ith function segment, and i is a positive integer in the range from 1 to N. The electronic device comprising the circuit may use the temperature of the processor based on the multistage function curve to dynamically control the rotation speed.

Abstract: A package structure is disclosed, which includes: a first substrate; a build-up layer formed on and electrically connected to the first substrate and having a cavity; at least an electronic element disposed in the cavity and electrically connected to the first substrate; a stack member disposed on the build-up layer so as to be stacked on the first substrate; and an encapsulant formed between the build-up layer and the stack member. The build-up layer facilitates to achieve a stand-off effect and prevent solder bridging.

Abstract: A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: A heat dissipating assembly which releases heat produced by an electronic device comprising a heat dissipating device and a plurality of elastic fastening members. The heat dissipating assembly includes a base plate having a plurality of engaging holes formed thereon. Each elastic fastening member includes a connecting member and a spring. The connecting member has a head portion and a bolt body that extends therefrom. The bolt body has an outer thread formed on the surface thereof and is being insertable into the respective engaging hole. The spring includes a winding portion woundable around the outer periphery of the bolt body, a clutching portion outwardly extended and downwardly bent from the bottom end of the winding portion to the base surface of the base plate, and a fastening segment extending from the clutching portion back under the winding portion. The instant disclosure further provides an elastic fastening member.

Abstract: A substrate structure includes a substrate body and a plurality of conductive pads formed on the substrate body and each having a first copper layer, a nickel layer, a second copper layer and a gold layer sequentially stacked. The thickness of the second copper layer is less than the thickness of the first copper layer. As such, the invention effectively enhances the bonding strength between the conductive pads and solder balls to be mounted later on the conductive pads, and prolongs the duration period of the substrate structure.

Abstract: By using a base in cooperation with a moving board, a first flowing area formed by a plurality of openings on the base may be partially blocked by the moving board moving relative to the base, thereby forming a second flowing area that provides different flow resistances. The flow resistance of an adjustable flow resistance device can be adjusted easily and dynamically, without replacing to another device. The flow resistance of the device may also be adjusted to various predefined default settings precisely and speedily by further applying a positioning mechanism that utilizes various predefined positioning holes or a rotary element.

Abstract: A controlling method for protecting an electronic apparatus, performed by the electronic apparatus to determine whether the system temperature thereof is overheated, so as to switch the electronic apparatus into a low-power operation mode when the system temperature is overheated. The controlling method is to monitor an electronic component of the electronic apparatus, so as to obtain the current temperature and the current working power of the electronic component and to determine whether the system temperature is overheated according to the current temperature and the current working power. When the system temperature is overheated, an overheating signal is generated to switch the electronic apparatus into the low-power operation mode.

Abstract: The disclosure relates to a method, circuit, and electronic device for controlling a rotation speed of a fan. The method provides a multistage function curve associates temperatures with rotation speed values. The multistage function curve comprises a first steady-state function segment with slope of zero, a second steady-state function segment with slope of zero and N function segments positioned between the first and second steady-state function segments. N is a positive integer. The slope of a (i+1)th function segment is greater than that of an ith function segment, and i is a positive integer in the range from 1 to N. The electronic device comprising the circuit may use the temperature of the processor based on the multistage function curve to dynamically control the rotation speed.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A semiconductor package and a method of fabricating the same. The semiconductor package includes a dielectric layer having opposite first and second surfaces; a semiconductor chip disposed on the first surface; at least two conductive pads embedded in and exposed from the first surface of the dielectric layer, and electrically connected to the semiconductor chip; a plurality of ball-implanting pads formed on the second surface of the dielectric layer; and a plurality of conductive pillars formed in the dielectric layer, each of the conductive pillars having a first end electrically connected to one of the ball-implanting pads and a second end opposing the first end and electrically connected to one of the conductive pads. Through the installation of the conductive pillars, it is not necessary for the ball-implanting pads to be associated with the conductive pads in position, and the semiconductor package thus has an adjustable ball-implanting area.

Abstract: An image presentation angle adjustment method is provided for a camera device to process images through the method. An image presentation angle assigning device module is integrated in the camera device. When the camera device captures a target image, the image presentation angle assigning device will automatically or through the operation of a user generate an image orientation parameter associated with the target image. Furthermore, the captured target image is stored in an image file within the image storage memory of the camera device associated with the image orientation parameter. Accordingly, when the target image is opened by the user for display, the target image will be displayed in the orientation indicated the image orientation parameter for viewing convenience.

Abstract: A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.