Abstract: Various embodiments of the present disclosure are directed towards a method for forming a semiconductor structure, the method includes forming a buffer layer over a substrate. An active layer is formed on the buffer layer. A top electrode is formed on the active layer. An etch process is performed on the buffer layer and the substrate to define a plurality of pillar structures. The plurality of pillar structures include a first pillar structure laterally offset from a second pillar structure. At least portions of the first and second pillar structures are spaced laterally between sidewalls of the top electrode.

Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: An impeller is provided, including a metal housing, a shaft, and a plastic member. The metal housing has a shaft mounting hole. The inner surface of the shaft mounting hole includes three or more contact points, and the contact points are closer to the shaft than other portions of the inner surface of the shaft mounting hole. The shaft passes through the shaft mounting hole and is affixed by the contact points. The metal housing divides the shaft into an upper section, a middle section, and a lower section. The plastic member passes through the shaft mounting hole and is in contact with the middle section.

Abstract: A chip package is provided. A first bonding structure is disposed on a first redistribution layer (RDL). A first chip includes a sensing region and a conductive pad that are adjacent to an active surface. The first chip is bonded onto the first RDL through the first bonding structure. The first bonding structure is disposed between the conductive pad and the first RDL. A molding layer covers the first RDL and surrounds the first chip. A second RDL is disposed on the molding layer and the first chip and is electrically connected to the first RDL. A second chip is stacked on a non-active surface of the first chip and is electrically connected to the first chip through the second RDL, the first RDL, and the first bonding structure. A method of forming the chip package is also provided.

Abstract: A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided.

Abstract: A chip package is provided. A first bonding structure is disposed on a first redistribution layer (RDL). A first chip includes a sensing region and a conductive pad that are adjacent to an active surface. The first chip is bonded onto the first RDL through the first bonding structure. The first bonding structure is disposed between the conductive pad and the first RDL. A molding layer covers the first RDL and surrounds the first chip. A second RDL is disposed on the molding layer and the first chip and is electrically connected to the first RDL. A second chip is stacked on a non-active surface of the first chip and is electrically connected to the first chip through the second RDL, the first RDL, and the first bonding structure. A method of forming the chip package is also provided.

Abstract: A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device. The chip includes an integrated circuit device. The second conductive structure is positioned on the chip and is electrically connected to the integrated circuit device and the first conductive structure. In addition, the chip package includes an insulating layer covering the sensing device and the chip. The insulating layer has a hole. The first conductive structure is positioned under the bottom of the hole. The top surface of the insulating layer is coplanar with the top surface of the second conductive structure. A method for forming the chip package is also provided.

Abstract: A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device. The chip includes an integrated circuit device. The second conductive structure is positioned on the chip and is electrically connected to the integrated circuit device and the first conductive structure. In addition, the chip package includes an insulating layer covering the sensing device and the chip. The insulating layer has a hole. The first conductive structure is positioned under the bottom of the hole. The top surface of the insulating layer is coplanar with the top surface of the second conductive structure. A method for forming the chip package is also provided.

Abstract: A chip package is provided. The chip package includes a substrate having conductive pads therein and adjacent to a first surface thereof. Chips are attached on a second surface opposite to the first surface of the substrate, and an encapsulation layer covers the chips. First redistribution layers are disposed between the second surface of the substrate and the encapsulation layer, and second redistribution layers are disposed on the encapsulation layer. First conductive structures and second conductive structures are disposed in the encapsulation layer. Each of first and second conductive structures respectively includes at least one bonding ball. The first conductive structures are configured to connect first and second redistribution layers, and the second conductive structures are configured to connect the second redistribution layers and the chip. A method of forming the chip package is also provided.

Abstract: A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device. The chip includes an integrated circuit device. The second conductive structure is positioned on the chip and is electrically connected to the integrated circuit device and the first conductive structure. In addition, the chip package includes an insulating layer covering the sensing device and the chip. The insulating layer has a hole. The first conductive structure is positioned under the bottom of the hole. The top surface of the insulating layer is coplanar with the top surface of the second conductive structure. A method for forming the chip package is also provided.

Abstract: An image editing method and an electronic device including a display unit are provided. In the method, a first image is captured and displayed on the display unit. A first object is extracted from the first image, and a second object in the first image is detected. A second image is captured and the second object in the second image is detected. A movement of the second object is obtained according to the first image and the second image, and the first object on the display unit is moved along with the movement of the second object. Accordingly, an object in a photo can be moved by using images.

Abstract: A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device. The chip includes an integrated circuit device. The second conductive structure is positioned on the chip and is electrically connected to the integrated circuit device and the first conductive structure. In addition, the chip package includes an insulating layer covering the sensing device and the chip. The insulating layer has a hole. The first conductive structure is positioned under the bottom of the hole. The top surface of the insulating layer is coplanar with the top surface of the second conductive structure. A method for forming the chip package is also provided.

Abstract: A chip package is provided. The chip package includes a substrate having conductive pads therein and adjacent to a first surface thereof. Chips are attached on a second surface opposite to the first surface of the substrate, and an encapsulation layer covers the chips. First redistribution layers are disposed between the second surface of the substrate and the encapsulation layer, and second redistribution layers are disposed on the encapsulation layer. First conductive structures and second conductive structures are disposed in the encapsulation layer. Each of first and second conductive structures respectively includes at least one bonding ball. The first conductive structures are configured to connect first and second redistribution layers, and the second conductive structures are configured to connect the second redistribution layers and the chip. A method of forming the chip package is also provided.

Abstract: A zooming control method is disclosed to perform following operations. A graphical user interface is displayed, and the graphical user interface includes a preview image corresponding to the zooming scale of the camera. A user input is received to assign the zooming scale for zooming in or zooming out the camera. The camera is natively capable of adopting the zooming scale within a scalable range between a wide bound and a telephoto bound. In response to a determination that the zooming scale assigned by the user input is wider than the wide bound of the scalable range, a panorama view mode is launched on the graphical user interface. The preview image during the panorama view mode is generated by the camera adopting the zooming scale at the wide bound, displayed within a central part on the graphical user interface and surrounded by a blank area on the graphical user interface.

Abstract: A mobile device and an information protection method are presented. The mobile device includes a sensor, a storage and a processor that is electrically connected with the sensor and the storage. The sensor is configured to sense at least one electronic device. The processor is configured to determine an authority of the at least one electronic device and define a protection state for at least one part of the information stored in the storage according to the authority. The information protection method is applied to the mobile device to implement the aforesaid operations.

Abstract: A method, an electronic apparatus, and a computer readable medium for processing reflection in an image are proposed. In the method, a first image and a second image are obtained. A plurality of objects in the first image and the second image are recognized and a plurality of lighting regions having a brightness higher than a first threshold in the first image and the second image are detected. Then, a plurality of displacements between corresponding objects and corresponding lighting regions in the first image and the second image are calculated. It is determined whether a ratio of the displacement of the object nearby one of the lighting regions to the displacement of the lighting region is over a second threshold. Finally, the lighting region is determined as a reflection if the ratio is over the second threshold.

Abstract: Provided herein are monoclonal antibodies with a high binding affinity to isoforms of alpha 1-antitrypsin (A1AT), hybridoma cells producing the same, and their uses in diagnosing and/or detecting endometriosis from a serum sample of a subject suspicious of having endometriosis or a subject under health examination.

Abstract: A method, an electronic apparatus, and a computer readable medium for processing reflection in an image are proposed. In the method, a first image and a second image are obtained. A plurality of objects in the first image and the second image are recognized and a plurality of lighting regions having a brightness higher than a first threshold in the first image and the second image are detected. Then, a plurality of displacements between corresponding objects and corresponding lighting regions in the first image and the second image are calculated. It is determined whether a ratio of the displacement of the object nearby one of the lighting regions to the displacement of the lighting region is over a second threshold. Finally, the lighting region is determined as a reflection if the ratio is over the second threshold.

Abstract: An image editing method and an electronic device including a display unit are provided. In the method, a first image is captured and displayed on the display unit. A first object is extracted from the first image, and a second object in the first image is detected. A second image is captured and the second object in the second image is detected. A movement of the second object is obtained according to the first image and the second image, and the first object on the display unit is moved along with the movement of the second object. Accordingly, an object in a photo can be moved by using images.

Abstract: A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided.