Patents by Inventor Wei-En Chen

Wei-En Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139301
    Abstract: The disclosure provides a method of active immunotherapy for a cancer patient, comprising administering vaccines against Globo series antigens (i.e., Globo H, SSEA-3 and SSEA-4). Specifically, the method comprises administering Globo H-CRM197 (OBI-833/821) in patients with cancer. The disclosure also provides a method of selecting a cancer patient who is suitable as treatment candidate for immunotherapy. Exemplary immune response can be characterized by reduction of the severity of disease, including but not limited to, prevention of disease, delay in onset of disease, decreased severity of symptoms, decreased morbidity and delayed mortality.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 2, 2024
    Inventors: Ming-Tain LAI, Cheng-Der Tony YU, I-Ju CHEN, Wei-Han LEE, Chueh-Hao YANG, Chun-Yen TSAO, Chang-Lin HSIEH, Chien-Chih OU, Chen-En TSAI
  • Patent number: 11950380
    Abstract: A portable electronic device is provided. The portable electronic device includes a main body and an accessory. The main body includes a display region, a non-display region, and a plurality of magnetic sensors. The magnetic sensors are disposed on the non-display region along a path. The accessory is movably disposed on the non-display region and includes a magnetic element. When the accessory moves on the non-display region, the accessory drives the magnetic element moving along the path.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: April 2, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wei-En Chen, Pei-Chiang Lin
  • Patent number: 11923392
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Jen-Cheng Liu, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting, Shuang-Ji Tsai, Wei-Chieh Chiang
  • Publication number: 20230223977
    Abstract: A protective case applied to assemble to a handheld electronic device is provided. The protective case includes an inner surface, an outer surface, a connector, a plurality of first detachable connecting structures, and a plurality of first electrical connecting structures. The connector is located at the inner surface to electrically connect to the handheld electronic device. The connector includes a plurality of signal transmitting pins. The first detachable connecting structures are arranged in a first array on the outer surface. The first electrical connecting structures are arranged in a second array on the outer surface. The first electrical connecting structures are electrically connected to the signal transmitting pins respectively.
    Type: Application
    Filed: August 24, 2022
    Publication date: July 13, 2023
    Inventors: Wei-En CHEN, Kuo Wei LIEN, Yuan-Kai YEH, Yu-Sheng LIN, Pei-Chiang LIN, Wei-Hsiang CHIU, Guan-Wei CHEN
  • Publication number: 20230225061
    Abstract: A portable electronic device is provided. The portable electronic device includes a main body and an accessory. The main body includes a display region, a non-display region, and a plurality of magnetic sensors. The magnetic sensors are disposed on the non-display region along a path. The accessory is movably disposed on the non-display region and includes a magnetic element. When the accessory moves on the non-display region, the accessory drives the magnetic element moving along the path.
    Type: Application
    Filed: August 30, 2022
    Publication date: July 13, 2023
    Inventors: Wei-En CHEN, Pei-Chiang LIN
  • Publication number: 20220018481
    Abstract: A sealing compression ring apparatus couplable to a liner and a pipe component has an annular body and a bore, with a first side including a raised outer edge portion, a recessed annular portion between the raised outer edge portion and the bore, and an o-ring gland encircling the bore on the recessed annular portion. A pipe assembly has a base pipe including a flange, a liner extending axially within the base pipe and extending radially out and over a portion of the flange to define a liner flange, an opposite flange surface, and a sealing compression ring apparatus compressed between the flange and the opposite flange surface, and an o-ring positioned in the o-ring gland of the ring.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 20, 2022
    Inventors: GREGORY MICHAEL HENRY, WEI-EN CHEN, MATTHEW FRANK BEER
  • Publication number: 20210348299
    Abstract: A composition for making a composite polycrystalline diamond includes a plurality of diamond particles, a plurality of boron-doped diamond particles, and an additive which is selected from the group consisting of boron oxide powder, nano-carbon material and a combination thereof. Based on the total weight of the composition, the diamond particles are present in an amount that ranges from 0.5 wt % to 99.4 wt %, the boron-doped diamond particles are present in an amount that ranges from 0.5 wt % to 99.4 wt %, and the additive is present in an amount that ranges from 0.1 wt % to 20 wt %. A method for making the composite polycrystalline diamond and a composite polycrystalline diamond made thereby are also disclosed.
    Type: Application
    Filed: September 30, 2020
    Publication date: November 11, 2021
    Inventors: Yin-Tung SUN, Po-Chuan PAN, Wei-En CHEN
  • Patent number: 8003344
    Abstract: The present invention provides a microbial hydrogen-producing process, comprising: providing at least one Clostridium microbe and at least one Bacillus microbe; and co-culturing said at least one Clostridium microbe and said at least one Bacillus microbe in a fermentation culture system to produce hydrogen. The present invention also provides a microbial hydrogen-producing system, characterized by that the system comprises at least one Clostridium microbe and at least one Bacillus microbe, and it uses an organic waste medium as the substrate to perform a hydrogen-producing fermentation having high efficiency, high stability, and high reproducibility.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: August 23, 2011
    Assignee: National Chung Hsing University
    Inventors: Chieh-Chen Huang, Jui-Jen Chang, Cheng-Yu Ho, Wei-En Chen, Jiunn-Jyi Lay, Chia-Hung Chou, Chang-Lung Han
  • Publication number: 20110083835
    Abstract: Provided are a heat-dissipating structure and a method for fabricating the same so as for the heat-dissipating structure thus fabricated to dissipate heat from the heat-generating portion of an electronic device. The heat-dissipating structure includes a metal base and a carbon composite layer. The carbon composite layer is formed on the metal base and includes metal particles and carbon particles sintered together. The heat-dissipating structure is more effective in dissipating heat than a conventional vapor chamber or heat spreader. The heat-dissipating structure further includes a carbon composite layer and a metal plate with high thermal conductivity. The heat-dissipating structure is attachable to a heat-generating electronic component to facilitate heat exchange therebetween and thereby enhance heat dissipation.
    Type: Application
    Filed: December 4, 2009
    Publication date: April 14, 2011
    Inventors: Ying-Tung Chen, Wei-En Chen
  • Publication number: 20100319895
    Abstract: A heat spreader structure includes at least one carbonaceous matter-metal composite layer having a plurality of carbonaceous particles and at least one metal-mesh layer having a plurality of meshes. The carbonaceous particles are either separately firmly held inside the meshes of the metal-mesh layer or covered and held in place by the metal-mesh layer. The carbonaceous matter-metal composite layer can be coated on a metal-made body through sintering to ensure good bonding of the carbonaceous particles to the metal-made body and accordingly enhance the heat spreading efficiency of the metal-made body. A method for manufacturing the heat spreader structure is also disclosed.
    Type: Application
    Filed: June 19, 2009
    Publication date: December 23, 2010
    Inventors: Wei-En Chen, Ying-Tung Chen
  • Publication number: 20090035812
    Abstract: The present invention provides a microbial hydrogen-producing process, comprising: providing at least one Clostridium microbe and at least one Bacillus microbe; and co-culturing said at least one Clostridium microbe and said at least one Bacillus microbe in a fermentation culture system to produce hydrogen. The present invention also provides a microbial hydrogen-producing system, characterized by that the system comprises at least one Clostridium microbe and at least one Bacillus microbe, and it uses an organic waste medium as the substrate to perform a hydrogen-producing fermentation having high efficiency, high stability, and high reproducibility.
    Type: Application
    Filed: February 1, 2008
    Publication date: February 5, 2009
    Applicant: National Chung Hsing University
    Inventors: Chieh-Chen Huang, Jui-Jen Chang, Cheng-Yu Ho, Wei-En Chen, Jiunn-Jyi Lay
  • Patent number: D995461
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: August 15, 2023
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Wei-En Chen, Guan-Wei Chen, Yuan-Kai Yeh, Pei-Chiang Lin, Wei-Hsiang Chiu, Kuo-Wei Lien
  • Patent number: D996385
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: August 22, 2023
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Wei-En Chen, Guan-Wei Chen, Yuan-Kai Yeh, Pei-Chiang Lin, Wei-Hsiang Chiu, Kuo-Wei Lien