Patents by Inventor Wei-Fang Wu

Wei-Fang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145641
    Abstract: A color conversion panel and a display device are provided. The color conversion panel includes an opaque substrate and a sapphire substrate. The opaque substrate includes a plurality of first pixel openings, a plurality of second pixel openings and a plurality of third pixel openings. The first pixel openings are filled with red quantum dot material, and the second pixel openings are filled with green quantum dot material. The sapphire substrate is on the opaque substrate. A first surface of the sapphire substrate that faces the opaque substrate has a plurality of first arc surfaces corresponding to the first pixel openings, a plurality of second arc surfaces corresponding to the second pixel openings, and a plurality of third arc surfaces corresponding to the third pixel openings.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 2, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Kai-Ling Liang, Wei-Hung Kuo, Hui-Tang Shen, Chun-I Wu, Suh-Fang Lin
  • Patent number: 11964811
    Abstract: A liquid storage tank includes a housing, a piston located in the housing, a cover, an elastic element, and an outlet pipe. The cover is attached to the housing and has a support post extending toward the piston. The piston, the housing, and the cover define a tank chamber. The tank chamber is filled with cooling liquid. The elastic element is connected with the tank hosing and the piston. The elastic element is free from contact with the cooling liquid. The outlet pipe communicates with the tank chamber. An extension direction of an opening of the outlet pipe is not parallel to a direction of movement of the elastic element. When the cooling liquid is decreased, the piston compressed the tank chamber such that the elastic element is released. The tank chamber is continuously compressed by pairing the elastic element and the piston.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Jei Huang, Wei-Fang Wu, Chia-Ying Hsu, Chih-Chieh Lu
  • Patent number: 11603846
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: March 14, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Chia-Ying Hsu, Chia-Yu Yeh, Chi-Chang Teng
  • Patent number: 11549760
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: January 10, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Patent number: 11486652
    Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: November 1, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yu-Hung Huang, Li-Kuang Tan, Wei-Fang Wu
  • Publication number: 20220315315
    Abstract: A liquid storage tank includes a housing, a piston located in the housing, a cover, an elastic element, and an outlet pipe. The cover is attached to the housing and has a support post extending toward the piston. The piston, the housing, and the cover define a tank chamber. The tank chamber is filled with cooling liquid. The elastic element is connected with the tank hosing and the piston. The elastic element is free from contact with the cooling liquid. The outlet pipe communicates with the tank chamber. An extension direction of an opening of the outlet pipe is not parallel to a direction of movement of the elastic element. When the cooling liquid is decreased, the piston compressed the tank chamber such that the elastic element is released. The tank chamber is continuously compressed by pairing the elastic element and the piston.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Inventors: Yu-Jei HUANG, Wei-Fang WU, Chia-Ying HSU, Chih-Chieh LU
  • Patent number: 11421692
    Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: August 23, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Chia-Ying Hsu, Chia-Yu Yeh, Chi-Chang Teng
  • Publication number: 20220120510
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Application
    Filed: December 28, 2021
    Publication date: April 21, 2022
    Inventors: Wei-Fang WU, Li-Kuang TAN
  • Patent number: 11236948
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: February 1, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Publication number: 20210025399
    Abstract: A pump body includes a housing, a first and a second chambers separated and communicated by the housing, an input pipe communicated with the first chamber and an output pipe communicated with the second chamber. The input pipe has a water outlet located in the first chamber. The output pipe has a water inlet located in the second chamber. The first pump has a first rotor placed in the first chamber. The second pump has a second rotor placed in the second chamber, wherein an extension line of a rotating shaft of the second rotor is perpendicular to a plane where a rotating shaft of the first rotor located.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Publication number: 20210024277
    Abstract: A liquid storage tank includes a housing, a piston, a lower cover, an elastic element, and an outlet pipe. The piston is located in the housing. The lower cover is attached to the housing and has a support post extending toward the piston. The piston, the housing, and the lower cover define a tank chamber. The elastic element is connected with the tank hosing and the piston. The outlet pipe communicates with the tank chamber.
    Type: Application
    Filed: December 26, 2019
    Publication date: January 28, 2021
    Inventors: Yu-Jei HUANG, Wei-Fang WU, Chia-Ying HSU, Chih-Chieh LU
  • Publication number: 20210025397
    Abstract: A pump mechanism is provided, including a housing, a first impeller, a second impeller, and two driving modules. The housing includes a first recess, a second recess, a plate, a channel, an input pipe, a first output pipe, and a second output pipe. The plate is disposed between the first recess and the second recess. The channel passes through the plate and communicated with the first recess and the second recess. The input pipe is connected to the channel and passes through the housing and the plate. The first output pipe and the second output pipe are respectively communicated with the first recess and the second recess.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 28, 2021
    Inventors: Wei-Fang WU, Chia-Ying HSU, Chia-Yu YEH, Chi-Chang TENG
  • Publication number: 20200217595
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Application
    Filed: March 16, 2020
    Publication date: July 9, 2020
    Inventors: Wei-Fang WU, Li-Kuang TAN
  • Patent number: 10631435
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: April 21, 2020
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Li-Kuang Tan
  • Publication number: 20190339023
    Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.
    Type: Application
    Filed: July 16, 2019
    Publication date: November 7, 2019
    Inventors: Yu-Hung HUANG, Li-Kuang TAN, Wei-Fang WU
  • Publication number: 20180063994
    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.
    Type: Application
    Filed: October 27, 2016
    Publication date: March 1, 2018
    Inventors: Wei-Fang WU, Li-Kuang TAN
  • Publication number: 20150129175
    Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.
    Type: Application
    Filed: December 31, 2013
    Publication date: May 14, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Yu-Hung HUANG, Li-Kuang TAN, Wei-Fang WU
  • Publication number: 20120240401
    Abstract: A manufacturing method of a heat sink is disclosed. A board having a first width is transported to a machine tool. The board is punched to form multiple sheet bodies. A bent part is formed on a terminal end of each sheet body having a second width. A first combined part protrudes from the bent part. A second combined part is hollowly disposed on the edge of the bent part as an indentation corresponding to the first combined part. The bent part is bent to stand correspondingly to each of the sheet bodies. Each sheet body is cut to form multiple heat dissipation fins. The second width is equal to the first width. When the heat dissipation fins overlap with each other, the first combined part of one heat dissipation fin is connected to the second combined part of another dissipation fin.
    Type: Application
    Filed: March 30, 2012
    Publication date: September 27, 2012
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Wei-Fang Wu, Cheng-Chih Lee, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20080295995
    Abstract: A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed.
    Type: Application
    Filed: April 29, 2008
    Publication date: December 4, 2008
    Inventors: Wei-Fang WU, Cheng-Chih Lee, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 7277285
    Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: October 2, 2007
    Assignee: Delta Electronics, Inc.
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen