Abstract: A fan cage assembly includes a cage and a handle mechanism, the handle mechanism includes a mount member including a mount portion and an extension portion respectively located at different sides of the cage and an operative member movably disposed on the extension portion of the mount member.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.

Abstract: A method of forming a semiconductor device is provided. A transistor is formed at a first side of the substrate and a first dielectric layer is formed aside the transistor. A first metal via is formed through the first dielectric layer and aside the transistor. A first interconnect structure is formed over the first side of the substrate and electrically connected to the transistor and the first metal via. The substrate is thinned from a second side of the substrate. A capacitor is formed at the second side of the substrate and a second dielectric layer is formed aside the capacitor. A second metal via is formed through the second dielectric layer and the substrate and electrically connected to the first metal via.

Abstract: Packaged memory devices including memory devices hybrid bonded to logic devices and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first memory die including a first memory cell electrically coupled to a first word line; a second memory cell electrically coupled to the first word line; and a first interconnect structure electrically coupled to the first word line; a circuitry die including a second interconnect structure, a first conductive feature of the first interconnect structure being bonded to a second conductive feature of the second interconnect structure through metal-to-metal bonds; and a word line driver electrically coupled to the first word line between the first memory cell and the second memory cell, the word line driver being electrically coupled to the first word line through the first interconnect structure and the second interconnect structure.

Abstract: A method for fabricating nonenzymatic glucose sensor, which comprises steps of: (a) providing a bottom substrate; (b) preparing a graphene layer on the bottom substrate; (c) depositing plural amount of zinc oxide (ZnO) seed crystals on the graphene layer; (d) growing the ZnO seed crystals into columnar nanorods with hydrothermal method; (e) coating a thin film of cuprous oxide (Cu2O) on the surface of the ZnO nanorods by electrochemistry-based electrodeposition; and (f) grafting single-walled carbon nanotubes (SWCNTs) on surface of the Cu2O thin film, by using Nafion fixative composited with SWCNTs. The structure of the above sensor, therefore, comprises a bottom substrate and other components orderly assembled on it, including, from inside to outside, a graphene layer, plural amount of ZnO nanorods, a Cu2O thin film, plural amount of SWCNTs, and the Nafion fixative. Accordingly, the sensor has advantages of low cost, rapid response, and easy for preservation.

Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.

Abstract: The federated learning system includes a moderator and client devices. Each client device performs a method for verifying model update as follows: receiving a hash function and a general model; training a client model according to the general model and raw data; calculating a difference as an update parameter between the general model and the client model, sending the update parameter to the moderator; inputting the update parameter to the hash function to generate a hash value; sending the hash value to other client devices, and receiving other hash values; summing all the hash values to generate a trust value; receiving an aggregation parameter calculated according to the update parameters; inputting the aggregation parameter to the hash function to generate a to-be-verified value; and updating the client model according to the aggregation parameter when the to-be-verified value equals the trust value.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A server system includes a server host and a server device. The server host includes a first casing and an electrical substrate. The electrical substrate includes a first dock portion, a first metal shell, and a first magnetic piece. The first magnetic piece is in the first metal shell. The server device includes a second casing and a mainboard. The mainboard includes a second dock portion, a second metal shell, and a second magnetic piece. The second magnetic piece is in the second metal shell. The second dock portion is adapted to be docked with the first dock portion. A magnetic attraction force is generated between the first magnetic piece and the first magnetic piece, so that the second dock portion is docked with the first dock portion. Accordingly, the connection between the first dock portion and the second dock portion can be ensured.

Abstract: The disclosure provides a projection device, an actuator device thereof, and a projection method adapted for the actuator device. The projection method includes disposing an optical element in a frame body, and disposing a driving assembly between a base and the frame body; controlling the driving assembly to drive the frame body by a signal so that the optical element reciprocally swings relative to the base based on a first, a second, and a third moving shaft. The signal includes a first driving signal corresponding to the first moving shaft, a second driving signal corresponding to the second moving shaft, and a third driving signal corresponding to the third moving shaft. The first and the second driving signal have a first frequency; the third driving signal has a second frequency different from the first frequency. The phase difference between the first and the second driving signal is not equal to zero.

Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.

Abstract: An under boat support (UBS) includes an electrostatic discharge (ESD) safe ceramic body and a conductive body. The ESD safe ceramic body is coupled to a surface of the conductive body by an adhesive, which may be resistant to high temperatures. A plurality of springs are present within the adhesive and extend from the surface of the conductive body to a surface of the ESD safe ceramic body. For example, first ends of the plurality of springs are electrically coupled to the surface of the conductive body, and second ends of the plurality of springs, which are opposite to corresponding ones of the first ends of the plurality of springs, are electrically coupled to the surface of the ESD safe ceramic body. The plurality of springs form electrical pathways such that the ESD safe ceramic body is electrically coupled to the conductive body.

Abstract: An illumination system configured to provide an illumination beam is provided and includes a light-source module and a first and a second wavelength conversion devices. The light-source module provides a first and a second excitation beams. The first wavelength conversion device is disposed on a path of the first excitation beam and has first regions and at least one first boundary disposed between every two adjacent first regions. The second wavelength conversion device is disposed on a path of the second excitation beam and has second regions and at least one second boundary disposed between every two adjacent second regions. The second regions correspond to the first regions. A time point when the first boundary gets into the path of the first excitation beam is different from a time point when the second boundary gets into the path of the second excitation beam. A projection apparatus is also provided.

Abstract: An actuator, a projection device, and a projection method are provided. The projection method includes the following. A first optical element is disposed in a first frame body. At least one first driving assembly is disposed between a first base and the first frame body. A second optical element is disposed in a second frame body. At least one second driving assembly is disposed between a second base and the second frame body. The first driving assembly is controlled by a first signal to drive the first frame body, such that the first optical element reciprocally swing relative to the first base based on a first actuating axis and a second actuating axis. The second driving assembly is controlled by a second signal to drive the second frame body, such that the second optical element reciprocally swing relative to the second base based on a third actuating axis.

Abstract: A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

Abstract: A projection device includes: an illumination system providing an illumination beam; a light valve arranged on a transmission path of the illumination beam and converting the illumination beam into an image beam; a projection lens arranged on a transmission path of the image beam and projecting the image beam out of the projection device; a first actuating module connecting and moving a first element, so that the image beam shifts back and forth along at least one of the first, second, and third directions; and a second actuating module connecting and moving a second element, so that the image beam shifts back and forth along at least one of the first, second, and third directions. The first and second directions are perpendicular. The third and first directions form an angle of 45 degrees, so do the third and second directions. The first and second elements are different.

Abstract: A fixing mechanism is applied to an interface card assembly and an electronic apparatus. The fixing mechanism includes a movable window and an operation component. The movable window is slidably disposed on a casing of the interface card assembly. The operation component has a fixed end and a free end opposite to each other. The fixed end is disposed on the movable window. The free end is detachably engaged with the casing to position the movable window. The movable window is positioned on one of a first region and a second region of the casing for respectively fixing interface cards with different sizes to the casing.

Abstract: A server apparatus includes a casing having a first engaging structure, a tray mechanism including a tray, a handle and an elastic member, and a server module disposed on the tray. The handle is pivoted to the tray. The elastic member connected to the tray and has an interfering structure. The interfering structure interferes with the handle to position the handle for making the handle not interfere with the first engaging structure when the tray is inserted into the casing along an insertion direction.