Patents by Inventor Wei-Heng Lin
Wei-Heng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12001560Abstract: A method and system to ensure correct firmware image execution in a computer system. The computer system has a processor executing a basic input/output system (BIOS) and a baseboard management controller (BMC). A first flash memory device is coupled to the processor storing a BIOS firmware image and a project name. A second flash memory device is coupled to the BMC storing a BMC firmware image and the project name. A programmable logic device is coupled to the first and second flash memory devices. The programmable logic device including a non-volatile memory storing a project name. The programmable logic device is configured to execute a Platform Firmware Resilience routine to compare the project name of the BIOS firmware image and the project name of the BMC firmware image with the stored project name before starting the BMC or executing the BIOS firmware image by the processor.Type: GrantFiled: October 28, 2021Date of Patent: June 4, 2024Assignee: QUANTA COMPUTER INC.Inventors: Tzu-Heng Wen, Yen-Ping Tung, Wei-Hung Lin
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Patent number: 11934065Abstract: A display device includes a substrate, a first light emitting element, a second light emitting element, and an optical film sheet. The first light emitting element and the second light emitting element are disposed on the substrate. The first light emitting element emits a first light, and the first light has a first wavelength range. The second light emitting element emits a second light, and the second light has a second wavelength range. The optical film sheet is disposed above the first light emitting element and the second light emitting element. The optical film sheet includes a first zone and a second zone. The first zone includes a first cholesteric liquid crystal, and the first cholesteric liquid crystal reflects light in at least the first wavelength range. The second zone includes a second cholesteric liquid crystal, and the second cholesteric liquid crystal reflects light in at least the second wavelength range.Type: GrantFiled: June 8, 2023Date of Patent: March 19, 2024Assignee: AUO CorporationInventors: Wan Heng Chang, Min-Hsuan Chiu, Syuan-Ying Lin, Wei-Ming Cheng
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Publication number: 20220384958Abstract: An antenna device includes a radio frequency (RF) die, a first dielectric layer, a feeding line, a ground line, a second dielectric layer, and a radiating element. The first dielectric layer is over the RF die. The feeding line is in the first dielectric layer and is connected to the RF die. The ground line is in the first dielectric layer and is spaced apart from the feeding line. The second dielectric layer covers the first dielectric layer. The radiating element is over the second dielectric layer and is not in physically contact with the feeding line.Type: ApplicationFiled: August 10, 2022Publication date: December 1, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Patent number: 11482788Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.Type: GrantFiled: September 4, 2020Date of Patent: October 25, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
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Publication number: 20200411996Abstract: An antenna device includes a package, a radiating element, and a director. The package includes a radio frequency (RF) die and a molding compound in contact with a sidewall of the RF die. The radiating element is in the molding compound and electrically coupled to the RF die. The director is in the molding compound, wherein the radiating element is between the director and the RF die, and a top of the radiating element is substantially coplanar with a top of the director.Type: ApplicationFiled: September 4, 2020Publication date: December 31, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Patent number: 10854580Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: GrantFiled: September 9, 2019Date of Patent: December 1, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
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Patent number: 10770795Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.Type: GrantFiled: August 23, 2016Date of Patent: September 8, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu
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Publication number: 20190393197Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: ApplicationFiled: September 9, 2019Publication date: December 26, 2019Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
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Patent number: 10468385Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: GrantFiled: November 29, 2017Date of Patent: November 5, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Wei-Heng Lin, Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu
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Publication number: 20190164937Abstract: The present disclosure provides a semiconductor structure including a first chip having a first dielectric surface, a second chip having a second dielectric surface facing the first dielectric surface and maintaining a distance thereto, and an air gap between the second dielectric surface and the first dielectric surface. The first chip includes a plurality of first conductive lines in proximity to the first dielectric surface and parallel to each other, two adjacent first conductive lines each having a sidewall partially exposed from the first dielectric surface. The present disclosure further provides a method for manufacturing the semiconductor structure described herein.Type: ApplicationFiled: November 29, 2017Publication date: May 30, 2019Inventors: WEI-HENG LIN, TUNG-LIANG SHAO, CHIH-HANG TUNG, CHEN-HUA YU
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Patent number: 10153239Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: GrantFiled: August 4, 2017Date of Patent: December 11, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Publication number: 20170346185Abstract: An antenna device includes a package and at least one antenna. The package includes at least one radio frequency (RF) die and a molding compound in contact with at least one sidewall of the RF die. The antenna has at least one conductor at least partially in the molding compound and operatively connected to the RF die.Type: ApplicationFiled: August 23, 2016Publication date: November 30, 2017Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chuei-Tang WANG, Chung-Hao TSAI, Jeng-Shien HSIEH, Wei-Heng LIN, Kuo-Chung YEE, Chen-Hua YU
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Publication number: 20170338195Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: ApplicationFiled: August 4, 2017Publication date: November 23, 2017Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Patent number: 9735118Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: GrantFiled: December 4, 2015Date of Patent: August 15, 2017Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin
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Publication number: 20170162524Abstract: A method includes forming a first metal plate, forming a metal ring aligned to peripheral regions of the first metal plate, and placing a device die level with the metal ring, encapsulating the device die and the metal ring in an encapsulating material. The method further includes filling a dielectric material into a space encircled by the metal ring, and forming a second metal plate covering the dielectric material and the metal ring, with an opening formed in the second metal plate. A plurality of redistribution lines is formed, with one of the redistribution lines overlapping a portion of the opening. The first metal plate, the metal ring, the second metal plate, and the dielectric material in combination form an antenna or a waveguide. The redistribution line forms a signal-coupling line of the passive device.Type: ApplicationFiled: December 4, 2015Publication date: June 8, 2017Inventors: Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Jeng-Shien Hsieh, Wei-Heng Lin