Abstract: A light detecting device includes a substrate that has a lattice constant. A buffer layer is disposed on the substrate. A gradient layer is formed on the buffer layer opposite to the substrate, and includes a plurality of sublayers that have respectively lattice constants each of which is greater than the lattice constant of the substrate. The sublayers are arranged in a manner that the lattice constants of the sublayers undergo a gradual increase in lattice constant in a direction away from the substrate. A barrier layer is formed on the gradient layer opposite to the buffer layer, and has a lattice constant which is greater than that of the substrate and no smaller than the lattice constants of the sublayers. An absorption layer is formed on the barrier layer opposite to the gradient layer.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: Provided are conductive structures located within dielectric material, and methods for fabricating such structures and devices. An exemplary method includes providing a substrate having a conductive feature in a first dielectric layer; depositing a second dielectric layer over the conductive feature and the first dielectric layer; etching the second dielectric layer to form a cavity through the second dielectric layer, wherein the cavity has a bottom with a convex profile; depositing a barrier layer along the bottom of the cavity; and depositing a conductive material in the cavity to form a structure electrically connected to the conductive feature.

Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.

Abstract: A system includes a cooler, a concentration meter, a first pump and a second pump. The cooler is configured to cool first liquid by second liquid in the cooler. The concentration meter is configured to measure a concentration of the first liquid. The first pump is configured to move the first liquid according to the concentration. The second pump is coupled to the cooler, disposed with the first pump in a parallel manner, and configured to move the second liquid.

Abstract: A system includes a cleaning device and a concentration measuring device. The cleaning device includes a first pipe and a first pump. The first pump is configured to move first liquid in the first pipe. Two terminals of the first pump are respectively coupled to the first pipe. The concentration measuring device includes a tube, a cooler, a concentration meter and a second pump. The tube is coupled to the first pipe, and is configured to retrieve the first liquid. The cooler covers the tube to cool the first liquid. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler. The second pump is coupled to the tube, and is configured to move the first liquid according to the concentration.

Abstract: A communication device includes a wireless communication module, a frame element, and a fixing assembly. The frame element includes a bottom plate and a side plate connected to the bottom plate, and the side plate includes a fixing hole. The fixing assembly includes a first fixing element. The first fixing element includes a first connection portion and a first fixing portion. The first connection portion is adapted to be fixed to the wireless communication module, and the first fixing portion includes a first neck portion and a first protruding portion. The first neck portion is adapted to be in the fixing hole, and the first neck portion is connected between the first connection portion and the first protruding portion. Hence, the fixing component fixes the wireless communication module with the frame element.

Abstract: A system includes a cleaning device and a concentration measuring device. The cleaning device includes a first pipe and a first pump. The first pump is configured to move first liquid in the first pipe. Two terminals of the first pump are respectively coupled to the first pipe. The concentration measuring device includes a tube, a cooler, a concentration meter and a second pump. The tube is coupled to the first pipe, and is configured to retrieve the first liquid. The cooler covers the tube to cool the first liquid. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler. The second pump is coupled to the tube, and is configured to move the first liquid according to the concentration.

Abstract: A system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Abstract: A signal processing system includes an analog-to-digital converter (ADC) that is used to convert a first analog value into a first digital value and convert a second analog value into a second digital value. The ADC includes a first digital-to-analog converter (DAC) circuit and a second DAC circuit operating in different voltage domains. A first bit segment and a second bit segment of each digital value are determined via the first DAC circuit and the second DAC circuit, respectively. An analog injection value is injected to the second analog value, the analog injection value is converted from a digital injection value formed by a subset of bits of the second bit segment of the first digital value, and the second bit segment of the second digital value is derived from injecting the digital injection value to a digital value determined by the second DAC circuit.

Abstract: A positive and negative electrode material and a preparation method thereof are provided. The positive and negative electrode material includes a powder, a first seed growth layer and a second graft growth layer. A material of the powder includes graphite, silicon based material, lithium titanate, tin oxide, tin alloy, lithium nickel cobalt manganese oxide, lithium nickel cobalt aluminum oxide or lithium iron phosphate. The first seed growth layer is formed radially on a surface of the powder, and the second graft growth layer is radially connected to the first seed growth layer.

Abstract: An electronic device and a connection mechanism thereof are provided. The connection mechanism includes a first assembly and a second assembly. The first assembly has a first body, a first pivot portion and a limiting portion. The first body is connected to the first pivot portion and the limiting portion. The limiting portion has an accommodation slot and a notch. The second assembly has a second body, a second pivot portion and a blocker. The second body is connected to the second pivot portion and the blocker. The first assembly and the second assembly are pivotally connected with each other by the first pivot portion and the second pivot portion. The first assembly and the second assembly are engagable with each other by the blocker and the notch.

Abstract: A signal processing system includes an analog-to-digital converter (ADC) that is used to convert a first analog value into a first digital value and convert a second analog value into a second digital value. The ADC includes a first digital-to-analog converter (DAC) circuit and a second DAC circuit operating in different voltage domains. A first bit segment and a second bit segment of each digital value are determined via the first DAC circuit and the second DAC circuit, respectively. An analog injection value is injected to the second analog value, the analog injection value is converted from a digital injection value formed by a subset of bits of the second bit segment of the first digital value, and the second bit segment of the second digital value is derived from injecting the digital injection value to a digital value determined by the second DAC circuit.

Abstract: A system is disclosed herein. The system includes a tank, a tube, a cooler, and a concentration meter. The tank is configured to contain first liquid. The tube is coupled to the tank and configured to convey the first liquid from the tank. The cooler covers the tube to cool the first liquid conveyed by the tube. The concentration meter is configured to measure a concentration of the first liquid cooled by the cooler.

Abstract: An electronic device and a connection mechanism thereof are provided. The connection mechanism includes a first assembly and a second assembly. The first assembly has a first body, a first pivot portion and a limiting portion. The first body is connected to the first pivot portion and the limiting portion. The limiting portion has an accommodation slot and a notch. The second assembly has a second body, a second pivot portion and a blocker. The second body is connected to the second pivot portion and the blocker. The first assembly and the second assembly are pivotally connected with each other by the first pivot portion and the second pivot portion. The first assembly and the second assembly are engagable with each other by the blocker and the notch.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.

Abstract: A storage structure includes a cover, a main body, and a movable element. The main body includes a first board and a cavity. The first board has a first opening. The cover connects to the main body. The movable element is accommodated in the cavity and selectively disposed in the first opening.

Abstract: Multiple slots are disposed on a chassis, and a fabric card is disposed in one of the slots. The fabric card includes following units. A first baseboard management controller (BMC) includes multiple pins. A first processor is coupled to the first BMC and obtains a first BMC identification (ID) of the first BMC by at least one pin of the first BMC. A second BMC also includes multiple pins. A second processor is coupled to the second BMC and obtains a second BMC ID of the second BMC by at least one pin of the second BMC. The first BMC ID is different from the second BMC ID.

Abstract: A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.