Abstract: A method that includes measuring vibration levels in a semiconductor manufacturing apparatus, determining one or more sections of the semiconductor manufacturing apparatus that vibrate at levels greater than a predetermined vibration level, and reducing the vibration levels in the one or more sections to be at or within the predetermined vibration level by coupling one or more weights to an external surface of the semiconductor manufacturing apparatus in the one or more sections.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: An optical device is provided. The optical device includes a substrate that has a top surface and a bottom surface. The optical device also includes a cover layer disposed on the substrate, and the cover layer has a top surface and a bottom surface. The top surface of the cover layer faces the bottom surface of the substrate. The optical device further includes a first meta structure disposed on the bottom surface of the substrate and a second meta structure disposed on the top surface of the cover layer. Moreover, the optical device includes a detector disposed on the bottom surface of the cover layer.

Abstract: An optical device is provided. The optical device includes a substrate, a waveguide layer, a first input grating, a first fold grating, and an isolation layer. The waveguide layer is disposed on the substrate. The first input grating is disposed in the waveguide layer. A first incident light passes through the first input grating to form a first light. The first fold grating is disposed in the waveguide layer. The first light passes through the first fold grating to form a first diffracted light in a first direction and a second diffracted light in a second direction. The isolation layer includes a first well array and is disposed on the waveguide layer. When the first diffracted light in the first direction travels to a first top portion corresponding to the first well array of the waveguide layer, the first diffracted light further passes through the first well array.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die, a second die, a first encapsulant, and a buffer layer. The first die and the second die are disposed side by side. The first encapsulant encapsulates the first die and the second die. The second die includes a die stack encapsulated by a second encapsulant encapsulating a die stack. The buffer layer is disposed between the first encapsulant and the second encapsulant and covers at least a sidewall of the second die and disposed between the first encapsulant and the second encapsulant. The buffer layer has a Young's modulus less than a Young's modulus of the first encapsulant and a Young's modulus of the second encapsulant.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: The present invention relates to a liposomal lupeol acetate (Lipo-LA) and its use in the treatment or prevention of rheumatoid arthritis (RA). The liposomal lupeol acetate of the present invention especially inhibits inflammatory responses and osteoclast generation (osteoclastogenesis) in the progression of rheumatoid arthritis (RA) at a half dose of the un-capsulated lupeol acetate, which may significantly reduce the incidence of RA and improve the therapeutic efficacy of lupeol acetate.

Abstract: The present disclosure illustrates a code activation device used to transmit an activation signal to a back-end device, so as to activate the back-end device. The code activation device comprises a sensing module and a processing module. The sensing module comprises a sensor unit, and the sensor unit generates sensing signals according to a preset action of a trigger object. The processing module connected to the sensing module receives the sensing signals, generates a sensing beat according to interval periods between the sensing signals, and determines whether the sensing beat matches a preset beat, wherein the processing module generates the activation signal when the sensing beat matches the preset beat.

Abstract: A preheating device for endoscopy includes a flexible bag, a plurality of first welded joint, and a mark member. The flexible bag is disposed with a saturated sodium acetate solution and a trigger. The flexible bag includes a closed circumference around the outer periphery thereof. The closed circumference includes a longer side and a shorter side next to each other. The plurality of the first welded joint is arranged into a folding line along a longitudinal direction, wherein every two adjacent first welded joints of the folding line forms a flowing space. The folding line is substantially parallel to the longer side. The first welded joint nearest to the shorter side is the last first welded joint, and the mark member is disposed on the flexible bag between the last first welded joint and the shorter side. The mark member is used for indicating a placement of an endoscopy.

Abstract: An endoscope defogging and pre-heating device includes a bag including a first seal line and first and second chambers defined at an opposite lateral sides relative to the first seal line, a heat storage/release material flowing between the first chamber and the second chamber for storing/releasing heat energy, a fixation device for securing the bag in a folded status to hold the endoscope to be pre-heated between the first and second chambers, and an actuator bendable to generate oscillation waves for causing the heat storage/release material to produce a temperature rise and then to release heat for pre-heating the loaded endoscope to about 98° F.˜138° F.

Abstract: The present invention relates to synergistic combinations of lupeol acetate and curcumin at low dosage, and their use for the treatment or prevention of osteoporosis.

Abstract: The present invention relates to synergistic combinations of lupeol acetate and curcumin at low dosage, and their use for the treatment or prevention of activated osteoclast precursor related diseases, including rheumatoid arthritis and osteoporosis.

Abstract: An endoscope defogging and pre-heating device includes a bag including a first seal line and first and second chambers defined at an opposite lateral sides relative to the first seal line, a heat storage/release material flowing between the first chamber and the second chamber for storing/releasing heat energy, a fixation device for securing the bag in a folded status to hold the endoscope to be pre-heated between the first and second chambers, and an actuator bendable to generate oscillation waves for causing the heat storage/release material to produce a temperature rise and then to release heat for pre-heating the loaded endoscope to about 98° F.˜138° F.

Abstract: The present invention relates to a liposomal lupeol acetate (Lipo-LA) and its use in the treatment or prevention of rheumatoid arthritis (RA). The liposomal lupeol acetate of the present invention especially inhibits inflammatory responses and osteoclast generation (osteoclastogenesis) in the progression of rheumatoid arthritis (RA) at a half dose of the un-capsulated lupeol acetate, which may significantly reduce the incidence of RA and improve the therapeutic efficacy of lupeol acetate.

Abstract: A heat storage/release device for hot/cold compress application is disclosed to include a bag, which defines therein a sealed accommodation chamber, a heat storage/release material, which is accommodated in the accommodation chamber of the bag and adapted for storing/releasing heat energy, and flexible members fastened to the bag at two opposite sides relative to the accommodation chamber and bendable to hold the bag in a predetermined shape and to secure the bag to a person's face.