Abstract: An optical system is provided. The optical system includes a light source assembly, a sensing element, and a light guiding element. The light source assembly is used for generating first light and second light. The sensing element is used for sensing third light from the second light reflected by an eye. The light guiding element is used for transporting the first light, the second light, and the third light. Wavelengths of the first light and the second light are different.

Abstract: The present disclosure provides a sintered neodymium-iron-boron permanent magnet, a preparation method and use thereof. The permanent magnet described herein comprises a grain and a grain boundary phase. The grain boundary phase is located on an epitaxial layer of the grain. The grain boundary phase comprises at least an RH. The grain comprises at least Nd2Fe14B. In the grain boundary phase within a depth of 100 ?m from the surface to the center of the sintered neodymium-iron-boron permanent magnet, the area of the grain boundary phase with an RH content of more than 6 wt % accounts for 50% or more of the total area of the grain boundary phase. The present disclosure adopts an RH and an RL as the diffusion source for composite diffusion, significantly improving the coercivity of the permanent magnet and the utilization rate of the RH in the diffusion source.

Abstract: The image sensing structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes at least one first unit. The at least one first unit includes a plurality of first interconnects adjacent to the top side of the first semiconductor device, a row selector, and an analog-to-digital converter (ADC) connected to the row selectors. The second semiconductor device includes at least one second unit. The at least one second unit includes a photodiode facing the top side of the second semiconductor device. The photodiode is configured to receive the light incident on the top side of the second semiconductor device. The top side of the first semiconductor device is bonded to the bottom side of the second semiconductor device.

Abstract: An optical system used for displaying a target image is provided. The optical system includes a light source assembly used for generating an initial image, an optical path adjustment assembly used for transferring the initial image to the target image, a control element used for providing a first control signal to the light source assembly, and a sensing assembly used for providing a sensing signal to the control element. The control element provides the first control signal based on the sensing signal.

Abstract: A wearable physiological measurement apparatus comprises a base, a bridge member, and a first and second support members movably coupled to the base and the bridge member to surround size-variable an opening for accommodating a care giver's finger therein. A measurement device is coupled to the base and with a probe projecting toward the opening for contacting the finger for vital sign measurement and monitoring. Resilient members are coupled between the base, the bridge member and the first and second support members to bias the base, the bridge member and the first and second support members moving toward each other to grip the finger to maintain proper contact of the probe to the finger.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: Apparatuses, systems, and methods for multi-TRP by a UE, including out of order delivery of PDSCH, PUSCH, and/or DL ACK/NACK. The UE may receive, from a base station, a configuration that may include multiple control resource set (CORESET) pools and each CORESET pool may be associated with an index value. The UE may determine that at least two DCIs of the multiple DCIs end at a common symbol and determine, based on one or more predetermined rules, when the UE may be scheduled to receive PDSCHs, transmit PUSCHs, and/or transmit ACK/NACKs from CORESETs associated with the at least two DCIs.

Abstract: An optical system is provided. The optical system includes a light source assembly, a light guiding element, and a first optical assembly. The light source assembly is used for generating first light and second light. The light guiding element is used for transporting the first light and the second light. The first optical assembly is disposed between the light guiding element and the light source assembly and used for transporting the first light and the second light. Wavelengths of the first light and the second light are different.

Abstract: An optical system is provided. The optical system includes a light source used for generating light, a fixed portion, an optical assembly having an equivalent focal length to the light and including a first optical element and a second optical element, and a driving assembly used for driving the second optical element to move relative to the first optical element. The driving assembly includes a first driving element used for driving the second optical element to move relative to the first optical element in a first axis, and a second driving element used for driving the second optical element to move relative to the first optical element in a second axis. The first axis and the second axis are different.

Abstract: A mounting frame for being mounted with either one of first and second screwdrivers, includes a main frame, a mounting seat, and first and second mounting plates. The mounting seat has a plate attachment hole set. The first mounting plate has a first seat attachment hole set operable to be connected to the plate attachment hole set, and a first driver attachment hole set for the first screwdriver to be attached thereto. The second mounting plate has a second seat attachment hole set operable to be connected to the plate attachment hole set, and a second driver attachment hole set for the second screwdriver to be attached thereto.

Abstract: The present application relates to devices and components including apparatus, systems, and methods to provide reduced sensing schemes to facilitate sidelink transmissions.

Abstract: Apparatuses, systems, and methods for multi-TRP by a UE, including out of order delivery of PDSCH, PUSCH, and/or DL ACK/NACK. The UE may receive, from a base station, a configuration that may include multiple control resource set (CORESET) pools and each CORESET pool may be associated with an index value. The UE may determine that at least two DCIs of the multiple DCIs end at a common symbol and determine, based on one or more predetermined rules, when the UE may be scheduled to receive PDSCHs, transmit PUSCHs, and/or transmit ACK/NACKs from CORESETs associated with the at least two DCIs.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: This disclosure relates generally to wireless communications and, more particularly, to systems and methods for determining an adaptive random access response window length in non-terrestrial networks. In one embodiment, a method performed by a communication device includes: receiving system information from a communication node, wherein the communication node communicates using a satellite in orbit or a high altitude platform station (HAPS); and determining an adaptive random access response window length based on the system information and whether the communication device has access to situation information that: characterizes a location of the communication device, an ephemeris of the satellite or a trajectory of the HAPS, and a payload type of the satellite or the HAPS.

Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer. The processing devices are configured to execute the MoE layer at least in part by receiving an input tensor including input tokens. Executing the MoE layer further includes computing a gating function output vector based on the input tensor and computing a sparse encoding of the input tensor and the gating function output vector. The sparse encoding indicates one or more destination expert sub-models. Executing the MoE layer further includes dispatching the input tensor for processing at the one or more destination expert sub-models, and further includes computing an expert output tensor. Executing the MoE layer further includes computing an MoE layer output at least in part by computing a sparse decoding of the expert output tensor. Executing the MoE layer further includes conveying the MoE layer output to an additional computing process.

Abstract: Certain aspects of the present disclosure relate to wireless communications, and more particularly, to techniques for beam determination, multi-user transmission, and channel state variance information (CSVI) reporting in a holographic multiple input multiple output (MIMO) system.

Abstract: An ultraviolet (UV) lamp assembly of a UV curing tool is provided for curing a low dielectric constant (low-k) material layer of a semiconductor wafer. The UV lamp assembly includes: a UV lamp which emits UV light; a first reflector arranged proximate to a first side of the UV lamp, the first reflector including a first surface facing the UV lamp from which UV light emitted by the UV lamp is at least partially reflected; and a UV reflective coating partially coating the first surface of the reflector. Suitably, a plurality of areas of the first surface of the reflector remain uncoated with the UV reflective coating and the plurality of uncoated areas are arranged to promote a uniform exposure of the semiconductor wafer to UV irradiation.

Abstract: An assembly system is provided for automotive lamps and an operation method thereof. The assembly system includes two kinds of functional robots and many functional stations, and it uses the functional robots to transfer workpieces between the various functional stations to realize automatic gluing, fastening and whole lamp performance testing, etc., thereby reducing the amount of manual intervention and improving process integration. Further, the assembly system may provide an assembly system with a two-sided assembly line operating simultaneously, which greatly improves the working efficiency of thereof.

Abstract: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.