Abstract: A system and method for a configurable computer system architecture is disclosed. The computer system architecture includes a power distribution board including a configuration identification strapping. The architecture includes a first node having a first processor and a first baseboard management controller (BMC) coupled to the power distribution board via an internal communication channel. A second node, identical to the first node, has a second processor and a second BMC coupled to the power distribution board via the internal communication channel. The configuration identification strapping is one of a first configuration readable by the first and second BMCs with two nodes operating as independent devices, or a second configuration readable by the first and second BMCs with two nodes operating as a single device. The first BMC serves as a master BMC and the second BMC serves as a slave BMC in the second configuration.

Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: The present invention provides a test phantom for X-ray imaging, which comprises a prosthetic fin and an edge patch; wherein the prosthetic fin has a plurality of different arithmetical series sizes of circular grooves and plurality of different arithmetical series thickness of the line pairs; wherein the edge patch connects on one side of the prosthetic fin. The present invention further provides a test phantom combination for X-ray imaging and a method for measuring parameters and focal spot.

Abstract: The present invention provides a test phantom for X-ray imaging, which comprises a prosthetic fin and an edge patch; wherein the prosthetic fin has a plurality of different arithmetical series sizes of circular grooves and plurality of different arithmetical series thickness of the line pairs; wherein the edge patch connects on one side of the prosthetic fin. The present invention further provides a test phantom combination for X-ray imaging and a method for measuring parameters and focal spot.

Abstract: An orthodontic bracket and an orthodontic assembly are provided. The orthodontic bracket includes a bottom base, a first sidewall, a second sidewall and two blocks. The bottom base has a first surface and a second surface opposite to each other. The first sidewall is disposed on the first surface. The second sidewall is disposed on the first surface and is opposite to the first sidewall. The blocks are disposed on the first surface between the first sidewall and the second sidewall. A bending space is defined and formed between the blocks, a first path is defined and formed between the first sidewall and the blocks, and a second path is defined and formed between the second sidewall and the blocks. An orthodontic wire is configured to be disposed in the first path or the second path, or to extend through the first path, the bending space and the second path.

Abstract: A radiation generating apparatus includes a target base, a target, an electronic beam generating device, a tube, a tank, and a porous structure. The target is disposed on the target base. The electronic beam generating device is adapted to generate an electronic beam, and the electronic beam is emitted to the target to generate a radiation. The tube accommodates the target and the electronic beam generating device. The tank is connected to the target base and is accommodated by the tube. The porous structure is disposed in the tank and contacts the target base. A cooling fluid flows through the porous structure to dissipate the heat of the porous structure.

Abstract: A radiation generating apparatus includes a target base, a target, an electronic beam generating device, a tube, a tank, and a porous structure. The target is disposed on the target base. The electronic beam generating device is adapted to generate an electronic beam, and the electronic beam is emitted to the target to generate a radiation. The tube accommodates the target and the electronic beam generating device. The tank is connected to the target base and accommodates the tube. The porous structure is roundly disposed between the tank and the tube and contacts an inner wall of the tank and an outer wall of the tube. A cooling fluid flows through the porous structure to dissipate the heat of the porous structure.

Abstract: A radiation generating apparatus includes a target base, a target, a holding assembly and an electronic beam generating device. The target is disposed on the target base. The holding assembly holds the target base. The electronic beam generating device is adapted to generate an electronic beam, wherein the electronic beam is emitted to the target to generate a radiation. The target, the holding assembly and the electronic beam generating device are located at the same side of the target base.

Abstract: A dental bracket is adapted to connect with a wire for repositioning of a tooth in a mouth of a patient, and includes a base member, a cap, and an adjustable unit. The cap is connected removably to the base member to define an accommodating chamber therebetween, and is formed with an opening in spatial communication with the accommodating chamber. The adjustable unit includes an inner end portion disposed within the accommodating chamber and retained at a selected one of a plurality of angular positions, and an outer end surface formed with at least one wire engaging groove that is disposed outwardly of the opening in the cap. The cap is removable from the base member to allow for angular position adjustment of the inner end portion of the adjusting member relative to the base member.

Abstract: The disclosure provides a heat transferring device and a method for manufacturing the heat transferring device. The heat transferring device includes: a flexible heat transfer substrate including a first surface, a second surface, at least one solid portion and at least one characteristic hole portion. The at least one solid portion is formed between the first surface and the second surface. The at least one characteristic hole portion includes several characteristic holes penetrating through the first surface and the second surface. The flexible heat transfer substrate further includes: a first end and a second end, and the second end is corresponding to the first end. The flexible heat transfer substrate is rolled from the first end towards the second end to form the heat transferring device with a predetermined shape.

Abstract: A microfluidic driving system includes a first planar electrode, a second planar electrode, a third planar electrode, a fourth planar electrode, a power supply unit and a detection module. The second, third and fourth planar electrodes are disposed parallel to the first planar electrode and face-to-face with the first planar electrode to form an accommodation space for accommodating a fluid. An AC power is provided by the power supply unit and an AC electrical field is applied by alternately connecting the third planar electrode and the fourth planar electrode with the first planar electrode for driving the first fluid and the second fluid to flow; and then AC electrical field is also applied by connecting the second planar electrode to the first planar electrode to mix the first fluid and the second fluid. Finally, a detection is performed upon a mixture of the fluids through the detection module.

Abstract: A microfluidic driving system includes a first planar electrode, a second planar electrode, a third planar electrode, a fourth planar electrode, a power supply unit and a detection module. The second, third and fourth planar electrodes are disposed parallel to the first planar electrode and face-to-face with the first planar electrode to form an accommodation space for accommodating a fluid. An AC power is provided by the power supply unit and an AC electrical field is applied by alternately connecting the third planar electrode and the fourth planar electrode with the first planar electrode for driving the first fluid and the second fluid to flow; and then AC electrical field is also applied by connecting the second planar electrode to the first planar electrode to mix the first fluid and the second fluid. Finally, a detection is performed upon a mixture of the fluids through the detection module.