Abstract: A method for multi-link operation (MLO) is provided. The method for MLO may be applied to an apparatus. The method for MLO may include the following steps. A multi-chip controller of the apparatus may assign different data to a plurality of chips of the apparatus, wherein each chip corresponds to one link of multi-links. Each chip may determine whether transmission of the assigned data has failed. A first chip of the chips may transmit the assigned data to an access point (AP) in response to the first chip determining that the transmission of the assigned data has not failed.

Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: A color conversion panel and a display device are provided. The color conversion panel includes an opaque substrate and a sapphire substrate. The opaque substrate includes a plurality of first pixel openings, a plurality of second pixel openings and a plurality of third pixel openings. The first pixel openings are filled with red quantum dot material, and the second pixel openings are filled with green quantum dot material. The sapphire substrate is on the opaque substrate. A first surface of the sapphire substrate that faces the opaque substrate has a plurality of first arc surfaces corresponding to the first pixel openings, a plurality of second arc surfaces corresponding to the second pixel openings, and a plurality of third arc surfaces corresponding to the third pixel openings.

Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: A display device and a projector are provided. The display device includes a pixel light-emitting panel and multiple color conversion panels. The pixel light-emitting panel includes an N1 number of light-emitting pixel units distributed in an array, and the light-emitting pixel units are driven to emit light through a driver. A first color conversion panel includes an N2 number of first color pixels and an N3 number of first transparent pixels. The first color pixels and the first transparent pixels are disposed relative to the light-emitting pixel units. A second color conversion panel includes an N4 number of second color pixels and an N5 number of second transparent pixels. The second color pixels and the second transparent pixels are disposed relative to the light-emitting pixel units. The lights generated by at least part of the light-emitting pixel units sequentially pass through the first color pixels and the second transparent pixels to achieve the color conversion.

Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: The present invention generally relates to a hydroponic culture medium and a hydroponic planting system, more particularly to a Houttuynia cordata hydroponic culture medium, a Houttuynia cordata hydroponic planting system, Houttuynia cordata extracts, a method, and applications thereof.

Abstract: A touch device includes a touch sensing unit, a vibrator and a vibration transmitting unit. The vibrator is used for generating vibration energy. The vibration transmitting unit is installed on a backside of the touch sensing unit and connected with the vibrator for transmitting the vibration energy to the touch sensing unit. The vibration transmitting unit includes a vibration-homogenizing plate. The rigidity of the vibration-homogenizing plate decreases as the distance from the vibrator increases.

Abstract: A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line.

Abstract: A light-emitting diode light bar includes a printed circuit board and a light-emitting diode. The printed circuit board has a protective layer, a first signal line, and a first extension line. The LED is disposed on the first signal line and the first extension line. The protective layer is formed above the first signal line and the first extension line, and has an opening that exposes a portion of the first signal line, and a portion of the extension line, such that a first exposed length of the first signal line is substantially equal to a second exposed length of the first extension line.

Abstract: A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.

Abstract: An optical engine of a light emitting diode (LED) light module comprises a heat dissipation device, an LED light bar and an optical component. The heat dissipation device comprises a base plate and a plurality of fin plates vertically welded onto a surface of the base plate. The LED light bar is disposed on an opposite surface of the base plate so that the LED light bar can dissipate heat through the fin plates. The optical component having a space for accommodating the LED light is provided to form a desired light distribution pattern.

Abstract: An LED lamp includes an illumination apparatus and a heat-dissipating waterproof cover. The illumination apparatus includes LED modules; and the heat-dissipating waterproof cover is configured to cover the LED modules. The heat-dissipating waterproof cover includes a plurality of drain members, and a gap is formed between every two drain members so as to increase the air convection, thereby increasing heat dissipation efficiency of the LED modules. Every two adjacent drain members are partially overlapping in vertical to prevent the intrusion of water.

Abstract: A light emitting diode (LED) module including a circuit board and at least one LED package is provided. The circuit board has a plurality of driving signal wirings and at least one ground wiring. The LED package is disposed on the circuit board and is electrically connected to the driving signal wirings. The LED package includes at least one LED chip, a plurality of signal leads, and at least one ground lead. The signal leads are electrically connected to the LED chip. The ground lead is electrically insulated from the signal lead and is electrically connected to the ground wiring. The ground lead is electrically insulated from the LED chip and has favorable electrostatic discharge (ESD) protection performance.

Abstract: A touch device includes a touch sensing unit, a vibrator and a vibration transmitting unit. The vibrator is used for generating vibration energy. The vibration transmitting unit is installed on a backside of the touch sensing unit and connected with the vibrator for transmitting the vibration energy to the touch sensing unit. The vibration transmitting unit includes a vibration-homogenizing plate. The rigidity of the vibration-homogenizing plate decreases as the distance from the vibrator increases.

Abstract: An optical engine of a light emitting diode (LED) light module comprises a heat dissipation device, an LED light bar and an optical component. The heat dissipation device comprises a base plate and a plurality of fin plates vertically welded onto a surface of the base plate. The LED light bar is disposed on an opposite surface of the base plate so that the LED light bar can dissipate heat through the fin plates. The optical component having a space for accommodating the LED light is provided to form a desired light distribution pattern.

Abstract: An LED lamp includes an illumination apparatus and a heat-dissipating waterproof cover. The illumination apparatus includes LED modules; and the heat-dissipating waterproof cover is configured to cover the LED modules. The heat-dissipating waterproof cover includes a plurality of drain members, and a gap is formed between every two drain members so as to increase the air convection, thereby increasing heat dissipation efficiency of the LED modules. Every two adjacent drain members are partially overlapping in vertical to prevent the intrusion of water.

Abstract: A light box apparatus comprises at least one light source, a frame, and a light guide plate. The frame, the side frames of which are made of metallic formed bars, has an accommodation space. The light guide plate, disposed in the accommodation space, has a lateral side. The frame has at least one side frame edge, which has an inlay groove adjacent to the lateral side, and the light, emitted from the light source disposed in the inlay groove, passes through the lateral side and transmits in the light guide plate.