Abstract: The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. A gate structure is disposed along a front-side of the substrate. A back-side of the substrate includes one or more first angled surfaces defining a central diffuser disposed over the image sensing element. The back-side of the substrate further includes second angled surfaces defining a plurality of peripheral diffusers laterally surrounding the central diffuser. The plurality of peripheral diffusers are a smaller size than the central diffuser.

Abstract: A server enclosure includes a chassis having a sidewall, a securing bracket secured to the chassis, a receiving member attached to the securing bracket, and a switch module for powering the server on/off. The securing bracket includes a first sidewall and a second sidewall perpendicularly extending therefrom. The receiving member is secured to the second sidewall of the securing bracket and includes a first sidewall abutting the first sidewall of the securing bracket. The switch module includes a printed circuit board. The switch module is received in the receiving member with the printed circuit board parallel to the first sidewall thereof. The second sidewall of the securing bracket abuts on the receiving member to enclose the switch module therein.

Abstract: A heat dissipating device used for dissipating heat from a heat generating device (100) in a computer. The heat dissipating device includes a fan bracket (20), a fan (27) received in the fan bracket, and an air duct (50). The fan bracket defines a fan opening (25), and has a supporting member (233). The supporting member has a flat board (2333). A pair of retaining portions (2335) is formed on opposite edges of the flat board respectively. The flat board defines a retaining hole (2337) therein. The air duct defines an airflow passageway and has a top wall (51) and two opposite sidewalls extending from the top wall. A securing member (553) extends from one of the sidewalls is retained between the two retaining portions. A post (5535) protruding from the securing member is engaged in the retaining hole for cooperatively retaining the air duct to the fan bracket.

Abstract: A server enclosure includes a chassis having a sidewall, a securing bracket secured to the chassis, a receiving member attached to the securing bracket, and a switch module for powering the server on/off. The securing bracket includes a first sidewall and a second sidewall perpendicularly extending therefrom. The receiving member is secured to the second sidewall of the securing bracket and includes a first sidewall abutting the first sidewall of the securing bracket. The switch module includes a printed circuit board. The switch module is received in the receiving member with the printed circuit board parallel to the first sidewall thereof. The second sidewall of the securing bracket abuts on the receiving member to enclose the switch module therein.

Abstract: A heat dissipating device used for dissipating heat from a heat generating device (100) in a computer. The heat dissipating device includes a fan bracket (20), a fan (27) received in the fan bracket, and an air duct (50). The fan bracket defines a fan opening (25), and has a supporting member (233). The supporting member has a flat board (2333). A pair of retaining portions (2335) is formed on opposite edges of the flat board respectively. The flat board defines a retaining hole (2337) therein. The air duct defines an airflow passageway and has a top wall (51) and two opposite sidewalls extending from the top wall. A securing member (553) extends from one of the sidewalls is retained between the two retaining portions. A post (5535) protruding from the securing member is engaged in the retaining hole for cooperatively retaining the air duct to the fan bracket.