Patents by Inventor Wei-Kang Cheng
Wei-Kang Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11808436Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.Type: GrantFiled: February 21, 2022Date of Patent: November 7, 2023Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Patent number: 11515457Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.Type: GrantFiled: April 30, 2020Date of Patent: November 29, 2022Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Jai-Tai Kuo, Wei-Kang Cheng
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Publication number: 20220178527Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.Type: ApplicationFiled: February 21, 2022Publication date: June 9, 2022Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Patent number: 11255524Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.Type: GrantFiled: May 29, 2020Date of Patent: February 22, 2022Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Publication number: 20200292157Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.Type: ApplicationFiled: May 29, 2020Publication date: September 17, 2020Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Publication number: 20200259054Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.Type: ApplicationFiled: April 30, 2020Publication date: August 13, 2020Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Wei-Kang CHENG
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Patent number: 10670244Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: GrantFiled: March 26, 2019Date of Patent: June 2, 2020Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Patent number: 10644209Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.Type: GrantFiled: January 4, 2019Date of Patent: May 5, 2020Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Jai-Tai Kuo, Wei-Kang Cheng
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Patent number: 10586895Abstract: A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesseType: GrantFiled: March 6, 2019Date of Patent: March 10, 2020Assignee: Epistar CorporationInventors: Han-Zhong Liao, Chih-Hsuan Lu, Fang-I Li, Wei-Kang Cheng, Shyi-Ming Pan
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Publication number: 20190219252Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: ApplicationFiled: March 26, 2019Publication date: July 18, 2019Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Publication number: 20190207061Abstract: A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesseType: ApplicationFiled: March 6, 2019Publication date: July 4, 2019Inventors: Han-Zhong Liao, Chih-Hsuan Lu, Fang-I Li, Wei-Kang Cheng, Shyi-Ming Pan
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Patent number: 10340431Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.Type: GrantFiled: January 10, 2018Date of Patent: July 2, 2019Assignee: EPISTAR CORPORATIONInventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
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Patent number: 10306714Abstract: A semiconductor component including a Wheatstone bridge rectifying circuit and a transistor is provided, wherein the Wheatstone bridge rectifying circuit and the transistor are formed on a same growth substrate, and wherein the Wheatstone bridge rectifying circuit includes a first rectifying diode; a second rectifying diode electrically connected to the first rectifying diode; a third rectifying diode electrically connected to the second rectifying diode; and a fourth rectifying diode electrically connected to the third rectifying diode.Type: GrantFiled: May 22, 2017Date of Patent: May 28, 2019Assignee: EPISTAR CORPORATIONInventors: Chih-Shu Huang, Chun-Ju Tun, Shyi-Ming Pan, Wei-Kang Cheng, Keng-Ying Liao
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Publication number: 20190157529Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.Type: ApplicationFiled: January 4, 2019Publication date: May 23, 2019Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Wei-Kang CHENG
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Patent number: 10256371Abstract: A light-emitting diode (LED) chip including a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on said active layer; one or a plurality of indentations, comprising a bottom part extending downward through the second semiconductor layer and the active layer to reach the first semiconductor layer and exposing the first semiconductor layer; a plurality of metal layers, comprising a first metal layer connecting to the first semiconductor layer through the bottom part, and a second metal layer deposited on the first metal layer; and an insulating layer formed between the first and the second metal layers, disposed on the indentation and covering the first metal layer, wherein the second metal layer comprises one or a plurality of recesses at a top surface thereof corresponding to the one or plurality of indentations.Type: GrantFiled: August 14, 2015Date of Patent: April 9, 2019Assignee: EPISTAR CORPORATIONInventors: Han-Zhong Liao, Chih-Hsuan Lu, Fang-I Li, Wei-Kang Cheng, Shyi-Ming Pan
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Patent number: 10247395Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: GrantFiled: July 28, 2017Date of Patent: April 2, 2019Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Publication number: 20180130933Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.Type: ApplicationFiled: January 10, 2018Publication date: May 10, 2018Inventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
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Patent number: 9876153Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.Type: GrantFiled: December 23, 2015Date of Patent: January 23, 2018Assignee: EPISTAR CORPORATIONInventors: Jai-Tai Kuo, Min-Hsun Hsieh, Lung-Kuan Lai, Wei-Kang Cheng, Chien-Liang Liu, Yih-Hua Renn, Shou-Lung Chen, Tsun-Kai Ko, Chi-Chih Pu
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Publication number: 20170345983Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.Type: ApplicationFiled: May 26, 2016Publication date: November 30, 2017Inventors: Min-Hsun HSIEH, Jai-Tai KUO, Wei-Kang CHENG
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Publication number: 20170330868Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180° , and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.Type: ApplicationFiled: July 28, 2017Publication date: November 16, 2017Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG