Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a barrier structure is arranged directly over the interconnect wire. The integrated chip further includes an etch stop layer arranged over the barrier structure and surrounds outer sidewalls of the barrier structure. A second interconnect dielectric layer is arranged over the etch stop layer, and an interconnect via extends through the second interconnect dielectric layer, the etch stop layer, and the barrier structure to contact the interconnect wire.

Abstract: A compound is provided as having the structure of Formula I, where: A and B are each independently a substituted or unsubstituted aryl group or a substituted or unsubstituted heteroaryl group; L1, L2 are each independently a single bond, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group; Ar1, Ar2, Ar3, and Ar4 are each independently a hydrogen atom, a deuterium atom, a cyano group, a nitro group, an amino group, a hydroxy group, a halogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted heteroaryl group.

Abstract: A two-stage machine learning model is used to for categorization of a dataset, such as transactions. A plurality of complementary base machine learning models are used to generate initial inference results and associated measures of inference confidence from the dataset, which are collected as a meta dataset. Each of the complementary models is associated with a different part of the dataset in which it has a higher accuracy in that part than the other models. The meta dataset is provided as input to a meta machine learning model, which is trained to produce a final inference result, and a confidence score model, which is trained to produce a confidence score associated with the final inference result.

Abstract: The disclosed subject matter includes Aa conveying device, including a mounting seat, a moving assembly, a bearing platform, a rotating assembly, a driving assembly, and a transmission assembly. The mounting seat is configured to move under drive of the moving assembly. The bearing platform is rotatably provided on the mounting seat under drive of the rotating assembly. The transmission assembly is in transmission connection to the driving assembly, the moving assembly, and the rotating assembly, so that the moving assembly drives the mounting seat and the bearing platform to move, and so that the rotating assembly drives the bearing platform to rotate.

Abstract: A steering linkage assembly includes a support member; a connecting portion rotatably arranged on the support member and connected to an external steering member; a first steering linkage; a first ball head rod provided with one end connected to a ball head at a first end of the first steering linkage and the other end connected to the support member; a second steering linkage; and a steering rotating shaft mounted at a first end of the second steering linkage and rotatably connected to the support member. A rotating centerline of the steering rotating shaft is not parallel to that of the connecting portion. An included angle is formed between a connecting line of ball head centers of the first and second ball head rods and a connecting line of a rotating center of the steering rotating shaft and a ball head center of the third ball head rod.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: Provided are a circuit control method, a battery controller, a battery management system, a battery, an electrical apparatus, and a vehicle. The circuit control method includes: acquiring an apparatus wake-up signal; determining whether a power source terminal voltage of a charging circuit of a battery on the apparatus is greater than a first threshold and whether a change rate in a first time length is less than a second threshold, wherein the charging circuit is a circuit connecting the battery on the apparatus and a generator, and the power source terminal voltage is an output voltage of the generator; and issuing a first instruction when the power source terminal voltage of the charging circuit of the battery on the apparatus is greater than the first threshold and the change rate in the first time length is less than the second threshold, so that the charging circuit is turned on.

Abstract: A plasma-facing component of a fusion reactor divertor, including an inner target transition support and a dome transition support which are integrated into an inner target-dome transition support. The inner target-dome transition support and an outer horizontal target transition support are each prepared from two materials. The channel connection inside the inner target-dome transition support and the outer horizontal target transition support is realized through an S-shaped flow channel and a collector box. In V-shaped regions of inner and outer targets, a plasma-facing unit is connected to the collector box in the transition support via a bending tube, and is communicated with a coolant flowing through horizontal and vertical targets through an intermediate flow channel in the transition block. A method of preparing the plasma-facing component is further provided.

Abstract: A nail polish glue and a preparation method and application thereof are provided. The nail polish glue includes the following components in parts by weight: 15-57 parts of an acrylate prepolymer, 20-52 parts of an acrylate active monomer, 5-10 parts of a photoinitiator, 5-10 parts of mercaptan, 5-10 parts of an additive, and 3-8 parts of a colorant. The nail polish glue of the present disclosure has low odor and environmental friendliness, is convenient to operate and package, can be directly applied without using a primer and a seal, and has the adhesion of the primer and the gloss retention of the seal. Through reasonable collocation and mutual complement of the amount of components, excellent mechanical properties including hardness, adhesion and wear resistance, which are significantly improved, are effectively achieved.

Abstract: This application discloses a long-focus lens, a camera module, and an electronic device. The long-focus lens includes a first lens assembly, a second lens assembly, and a third lens assembly that are arranged from an object side to an image side. The first lens assembly and the third lens assembly are fixed lens assemblies, and the second lens assembly is a focusing lens assembly. In a focusing process in which the long-focus lens is switched from a long shot to a close-up, the second lens assembly moves toward the object side along an optical axis, a combined focal length of the first lens assembly and the second lens assembly decreases, and a combined focal length of the second lens assembly and the third lens assembly decreases. The foregoing long-focus lens has a strong focusing capability and high imaging quality.

Abstract: Patients diagnosed with a cancer harboring an IDH-1 mutation can be treated by the administration of a therapeutically effective amount of a pharmaceutical composition comprising Compound 1, a selective inhibitor of 2-HG production from mIDH-1 enzymes including the R132 mutations R132C, R132H, R132L, R132G, and R132S.

Abstract: An information handling system with modular riser components for receiving expansion cards having various requirements. The system includes a riser body assembly having a common support structure for receiving expansion cards. The common support structure may be coupled to different expansion structures to provide support of expansion cards having requirements that would not be met by the common support structure alone.

Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.

Abstract: Methods and systems for gesture-based control of a device are described. A virtual gesture-space is determined in a received input frame. The virtual gesture-space is associated with a primary user from a ranked user list of users. The received input frame is processed in only the virtual gesture-space, to detect and track a hand. Using a hand bounding box generated by detecting and tracking the hand, gesture classification is performed to determine a gesture input associated with the hand. A command input associated with the determined gesture input is processed. The device may be a smart television, a smart phone, a tablet, etc.

Abstract: A thin film transistor includes a gate electrode, a gate insulating layer, a carbon nanotube structure, a source electrode and a drain electrode. The gate insulating layer is located on the gate electrode. The carbon nanotube structure is located on the gate insulating layer. The source electrode and the drain electrode are arranged at intervals and electrically connected to the carbon nanotube structure respectively. The thin film transistor further includes an interface charge layer, and the interface charge layer is located between the carbon nanotube structure and the gate insulating layer.

Abstract: A system and method for jointly displaying an image and a map is disclosed. The method may including obtaining an image captured by a camera. The image may include a target in a surrounding environment of the camera. The method may further include obtaining a map of the surrounding environment. The map may at least include a location corresponding to the target and a location corresponding to the camera. The method may jointly display the image and the map, wherein a representation of the image is aligned with the location corresponding to the target and the location corresponding to the camera in the map.

Abstract: A device includes source circuitry comprising a first portion of a current mirror and a first transistor. The device also includes load circuitry comprising a second portion of the current mirror and a second transistor, wherein the load circuitry is disposed at a distance from the source circuitry. The device further includes a path coupled to a first gate of the first transistor and to a second gate of the second transistor, wherein the path provides a predetermined voltage to both of the first gate of the first transistor and to the second gate of the second transistor.

Abstract: A method includes forming a set of through-vias in a substrate, the set of through-vias partially penetrating a thickness of the substrate. First connectors are formed over the set of through-vias on a first side of the substrate. The first side of the substrate is attached to a carrier. The substrate is thinned from the second side to expose the set of through-vias. Second connectors are formed over the set of through-vias on the second side of the substrate. A device die is bonded to the second connectors. The substrate is singulated into multiple packages.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.