Patents by Inventor Wei-Lun Tai

Wei-Lun Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10675655
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: June 9, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng Zhuang, Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng
  • Publication number: 20170036238
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Application
    Filed: October 14, 2016
    Publication date: February 9, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng ZHUANG, Ching-Chih LIN, Steven LIN, Wei-Lun TAI, Wen-Peng TSENG, Ji-Bin HORNG
  • Patent number: 9533350
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: January 3, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng Zhuang, Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng
  • Publication number: 20130329386
    Abstract: A manufacturing method of a package carrier is provided. A supporting plate is provided, wherein a metal layer is already disposed on the supporting plate. A patterned dry film layer is formed on the metal layer. A portion of the metal layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a surface treatment layer on the portion of the metal layer exposed by the patterned dry film layer. The patterned dry film layer is removed so as to expose the portion of the metal layer. The surface treatment layer is used as an etching mask to etch the portion of the metal layer not covered by the surface treatment layer so as to form a patterned metal layer.
    Type: Application
    Filed: August 27, 2012
    Publication date: December 12, 2013
    Applicant: SUBTRON TECHNOLOGY CO. LTD.
    Inventors: Chin-Sheng Wang, Wei-Lun Tai
  • Publication number: 20130186514
    Abstract: The present disclosure provides a device and method for powder distribution and an additive manufacturing method, wherein different size or kind of powders could be chosen to be accommodated within a receptacle. The receptacle can uniformly mix the powder by a rotation movement, pour out the powders by the rotation movement and distribute the powders for forming a layer by a translation movement. In another embodiment, the receptacle further comprises a heating element for preheating the powders. Not only can the present disclosure uniformly mix the powders so as to reduce the thermal deformation and distribute the powder layer compactly, but also can the present disclosure distribute different kinds of powder in different layer so as to increase the diversity in additive manufacturing.
    Type: Application
    Filed: April 30, 2012
    Publication date: July 25, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chuan-Sheng Zhuang, Ching-Chih Lin, Steven Lin, Wei-Lun Tai, Wen-Peng Tseng, Ji-Bin Horng