Patents by Inventor Wei Mao

Wei Mao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980294
    Abstract: The lumbar support mechanism and an adjustable bed having the same. The lumbar support mechanism includes first and second lumbar lifting assemblies. Each lumbar lifting assembly has a fixing bracket, a first support leg, a second support leg, a bearing member, and a lifting support bracket. The first support leg is pivotally connected between the bearing member and the lifting support bracket. The second support leg is pivotally connected between the fixing bracket and the first support leg. A lumbar support member is connected to the lifting support brackets of the first and second lumbar lifting assemblies. A linkage member is pivotally connected to the bearing members of the first and second lumbar lifting assemblies such that the lumbar support member is operably movable between a retracted position and an ejected position when the linkage member moves between first and second positions.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: May 14, 2024
    Assignee: NISCO CO., LTD
    Inventors: Wei Wang, Fahuan Zhang, Jian Xie, Yifan Mao
  • Publication number: 20240153849
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a chip structure including a substrate and a wiring structure over a first surface of the substrate. The semiconductor device structure includes a first seed layer over the wiring structure, a first inner wall of the first enlarged portion, and a second inner wall of the neck portion. The semiconductor device structure includes a second seed layer over a second surface of the substrate, a third inner wall of the second enlarged portion, and the first seed layer over the second inner wall of the neck portion. The second seed layer is in direct contact with the first seed layer.
    Type: Application
    Filed: January 2, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Wen-Hsiung LU, Lung-Kai MAO, Fu-Wei LIU, Mirng-Ji LII
  • Patent number: 11974479
    Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 30, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Shun-Yuan Hu, Chin-Lung Ting, Li-Wei Mao, Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu, Ker-Yih Kao
  • Publication number: 20240136076
    Abstract: A plasma-facing component of a fusion reactor divertor, including an inner target transition support and a dome transition support which are integrated into an inner target-dome transition support. The inner target-dome transition support and an outer horizontal target transition support are each prepared from two materials. The channel connection inside the inner target-dome transition support and the outer horizontal target transition support is realized through an S-shaped flow channel and a collector box. In V-shaped regions of inner and outer targets, a plasma-facing unit is connected to the collector box in the transition support via a bending tube, and is communicated with a coolant flowing through horizontal and vertical targets through an intermediate flow channel in the transition block. A method of preparing the plasma-facing component is further provided.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Xin MAO, Xuebing PENG, Yuntao SONG, Kun LU, Wei SONG, Peng LIU, Xinyuan QIAN
  • Patent number: 11966085
    Abstract: An optical transceiver includes an input assembly, an output port, a fiber patch panel, multiple first optical fibers and multiple second optical fibers. The input assembly is arranged on a circuit board and has a first input port and a second input port. The fiber patch panel is arranged between the input assembly and the output port, and has multiple first fiber patch slots and multiple second fiber patch slots. The first optical fibers are connected to the first input port and the output port. The first optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second optical fibers are connected to the second input port and the output port. The second optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second fiber patch slot accommodates the first optical fiber and the second optical fiber.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chen-Mao Lu, Wei-Chan Hsu, Chun-Yen Chen
  • Patent number: 11961637
    Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Wei Sheng Chen, Ching Mao Huang, Jia Hui Zhou, Huan Ran Yu, Shu Xiong Wang, Chin Hui Lee
  • Publication number: 20240119735
    Abstract: Systems and methods of monitoring inventory of a product storage facility include an image capture device configured to move about the product storage areas of the product storage facility and capture images of the product storage areas from various angles. A computing device coupled to the image capture device obtains the images of the product storage areas captured by the image capture device and processes the obtained images of the product storage areas to detect individual products captured in the obtained images. Based on detection of the individual products captured in the images, the computing device analyzes each of the obtained images to detect one or more adjacent product storage structures (shelves, pallets, etc.) and identifies and selects a single image that fully shows a product storage structure of interest and fully shows each of the products stored on the product storage structure of interest.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 11, 2024
    Inventors: Lingfeng Zhang, Mingquan Yuan, Paul Lewis Lobo, Avinash M. Jade, Zhichun Xiao, William Craig Robinson, JR., Zhaoliang Duan, Wei Wang, Han Zhang, Raghava Balusu, Tianyi Mao
  • Publication number: 20240120207
    Abstract: A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lung-Kai Mao, Wen-Hsiung Lu, Pei-Wei Lee, Szu-Hsien Lee, Chieh-Ning Feng
  • Publication number: 20240121050
    Abstract: This application provides a communication method and apparatus. According to the method, a first terminal apparatus can determine, based on second information, information that is in first demodulation information and second demodulation information and that is used to demodulate a first data stream, and determine information that is used to demodulate a second data stream. The first data stream is a common stream, and the second data stream is a private stream of the first terminal apparatus. The first terminal apparatus may first demodulate, based on the information that is used to demodulate the first data stream, a signal received by the first terminal apparatus on a first resource, to obtain the first data stream, and then may obtain the second data stream based on the first data stream, the information that is used to demodulate the second data stream, and the signal received on the first resource.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Yunhao ZHANG, Yiqun WU, Wei HAN, Bruno CLERCKX, Onur DIZDAR, Yijie MAO
  • Patent number: 11948001
    Abstract: Methods and apparatus consistent with the present disclosure may be used in environments where multiple different virtual sets of program instructions are executed by shared computing resources. These methods may allow actions associated with a first set of virtual software to be paused to allow a second set of virtual software to be executed by the shared computing resources. In certain instances, methods and apparatus consistent with the present disclosure may manage the operation of one or more sets of virtual software at a point in time. Apparatus consistent with the present disclosure may include a memory and one or more processors that execute instructions out of the memory. At certain points in time, a processors of a computing system may pause a virtual process while allowing instructions associated with another virtual process to be executed.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: April 2, 2024
    Assignee: SONICWALL INC.
    Inventors: Miao Mao, Wei Zhou, Zhong Chen
  • Publication number: 20240096878
    Abstract: The semiconductor device includes a substrate, a first nitride semiconductor layer disposed on the substrate, a second nitride semiconductor layer disposed on the first nitride semiconductor layer and having a bandgap greater than that of the first nitride semiconductor layer. The semiconductor device further includes a first gate conductor disposed on a first region of the second nitride semiconductor layer, a first source electrode disposed on a first side of the first gate conductor, a first field plate disposed on a second side of the first gate conductor, a first conductive terminal and a second conductive terminal disposed on a second region of the second nitride semiconductor layer, and a resistor formed in the first nitride semiconductor layer and electrically connected between the first conductive terminal and the second conductive terminal, wherein the resistor comprises at least one conductive region.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
    Inventors: Danfeng MAO, King Yuen WONG, Jinhan ZHANG, Xiaoyan ZHANG, Wei WANG, Jianjian SHENG
  • Publication number: 20240087964
    Abstract: An apparatus for detecting an endpoint of a grinding process includes a connecting device, a timer and a controller. The connecting device is connected to a sensor that periodically senses an interface of a reconstructed wafer comprising a plurality of dies of at least two types to generate a thickness signal comprising thicknesses from a surface of an insulating layer of the reconstructed wafer to the interface of the reconstructed wafer. The timer is configured to generate a clock signal having a plurality of pulses with a time interval. The controller is coupled to the sensor and the timer, and configured to filter the thickness signal according to the clock signal to output a thickness extremum among the thicknesses in the thickness signal within each time interval, wherein the thickness signal after the filtering is used to determine the endpoint of the grinding process being performed on the reconstructed wafer.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu
  • Publication number: 20240089662
    Abstract: A multifunctional sound device includes a housing, a sound unit, a vibrator, and coils. The housing includes an accommodating cavity, and the sound unit is accommodated in the accommodating cavity and is fixedly connected to the housing. The sound unit includes a frame, a vibration system, and a magnetic circuit system. The vibration system is disposed in the frame, and the magnetic circuit system drives the vibration system to reciprocally vibrate and generate sound along a first direction. The sound unit and the vibrator are assembled in the housing and share one magnetic system, which saves space and greatly reduces occupied space. Moreover, the magnetic circuit system interacts with the coils to drive the vibrator to vibrate in the second direction and the third direction, thereby enhancing vibration effect.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Yun Tang, Lubin Mao, Jie Ma, Ziang Li, Xingzhi Huang, Wei Song
  • Publication number: 20240089663
    Abstract: A multifunctional sound device includes a housing, a sound unit, a vibrator, and a coil. The housing includes an accommodating cavity, and the sound unit is suspended in the accommodating cavity. The sound unit includes a frame, a vibration system, and a magnetic circuit system. The vibration system is fixed in the frame, and the magnetic circuit system drives the vibration system to vibrate and generate sound along a first direction, where the magnetic circuit system includes a magnetic gap. Since the speaker and the motor share one magnetic system, the sound unit and the vibrator are assembled in the housing, which greatly reduces occupied space. The sound unit and the vibrator form a dual-vibration system, and the sound unit cooperatively vibrates with the vibrator in addition to generating sound, which improves vibration effects and further avoids adding other components, thereby saving space.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Yun Tang, Lubin Mao, Jie Ma, Ziang Li, Xingzhi Huang, Wei Song
  • Patent number: 11926678
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: March 12, 2024
    Assignee: Immunwork Inc.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Wei-Ting Tian, Yueh-Hsiang Yu
  • Publication number: 20240076277
    Abstract: A system and method for preparing epoxy chloropropane is provided in that by coupling three stages of high gravity reactors, the product epoxy chloropropane and water vapor are distilled from a reaction system in form of an azeotrope by adopting a water vapor steam stripping method. Further, by combining the azeotrope with the multiples stages of high gravity reactors, the gas phase mass transfer and the liquid phase mass transfer of the azeotrope are improved aiming at the features of the azeotrope in the reaction system, thus making the overall conversion rate higher. In addition, by combining steam stripping and high gravity, dichloropropanol and alkali solution are rapidly mixed for mass transfer, and the product epoxy chloropropane is rapidly distilled from the reaction system in the form of the azeotrope, such that the reaction proceeds continuously towards the direction of producing epoxy chloropropane, thus significantly improving the conversion rate.
    Type: Application
    Filed: December 24, 2021
    Publication date: March 7, 2024
    Inventors: Liangliang ZHANG, Liyang ZHOU, Guangwen CHU, Bibo XIA, Jianfeng CHEN, Yutu JIANG, Jihong TONG, Baochang SUN, Wei MAO, Yanchun ZHENG
  • Publication number: 20240064716
    Abstract: This disclosure describes systems, methods, and devices related to enhanced transmission. A device may generate an aggregated medium access control protocol data unit (A-MPDU) frame, wherein the A-MPDU is associated with transmission of n Network Coding (NC) encoded frames. The device may divide the A-MPDU frame into k data frames and (n?k) parity frames within the A-MPDU frame. The device may transmit the k data frames. The device may transmit to a station device (STA) at least one of the (n?k) parity frames separately after the data frames in response to packet drops in the k data frames.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Minyoung PARK, Wei MAO, Laurent CARIOU, Ehud RESHEF, Danny ALEXANDER, Daniel BRAVO, Chen KOJOKARO, Hosein NIKOPOUR
  • Patent number: 11888523
    Abstract: Systems and methods to implement a USB and Thunderbolt optical signal transceiver are described. One method includes detecting presence of a USB sideband signal received over an optical communication channel and associated with a USB communication request. Responsive to the detecting, the method may determine that the USB communication request corresponds to a USB communication mode and perform a sideband negotiation. The USB communication mode may be enabled. A specified number of channels associated with the USB communication request may be determined. USB communication may be performed using the specified number of channels over the optical communication channel in the USB communication mode.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: January 30, 2024
    Assignee: WINGCOMM CO. LTD.
    Inventors: Jianming Yu, Zuodong Wang, Wei Mao, Yun Bai
  • Patent number: D1013455
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: February 6, 2024
    Assignee: Equra Industrial (Shenzhen) Co., Ltd
    Inventor: Wei Mao
  • Patent number: D1026520
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: May 14, 2024
    Assignee: Equra Industrial (Shenzhen) Co., Ltd
    Inventor: Wei Mao