Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A projection lens includes a first lens group, a second lens group and an aperture stop. The first lens group is disposed between a reduced side and a magnified side. The second lens is disposed between the first lens group and the magnified side. The second lens group has a light incident surface, a reflective surface and a light emitting surface, the light incident surface faces the first lens group, the light emitting surface faces a projection surface, the light incident surface, the light emitting surface and the first lens group are disposed at a single side of the reflective surface, and at least one of the light incident surface, the reflective surface and the light emitting surface is a freeform surface. The aperture stop is disposed between the first lens group and the second lens group. Moreover, a projection apparatus including the projection lens is also provided.

Abstract: In some embodiments, the present disclosure relates to an integrated circuit (IC) in which a memory structure comprises an inhibition layer inserted between two ferroelectric layers to create a tetragonal-phase dominant ferroelectric structure. In some embodiments, the ferroelectric structure includes a first ferroelectric layer, a second ferroelectric layer overlying the first ferroelectric layer, and a first inhibition layer disposed between the first and second ferroelectric layers and bordering the second ferroelectric layer. The first inhibition layer is a different material than the first and second ferroelectric layers.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

Abstract: A watermark embedding method includes the following steps. The input video signal is received by a processing circuit. Grayscale information of a watermark signal is generated by the processing circuit according to a time series data and a predetermined plane. During a dark sate and a bright state in each of a plurality of consecutive periods, phases of the time series data are opposite and integral values of the grayscales of the predetermined plane are the same. The processing circuit embeds the watermark signal into the input video signal to generate an output video signal with the watermark information. The display panel displays an image according to the output video signal.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.

Abstract: Examples of providing access to a switch of an electronic device are described herein. In an example, a housing of the electronic device includes a sidewall having an opening to receive an external actuator to access a switch of the electronic device. The housing further includes a first bracket and a second bracket, both movably coupled to the sidewall. The first bracket includes an actuator opening, which when aligned with the opening of the sidewall, allows the external actuator to access the switch. Further, the second bracket is moveable to co-operate with the first bracket to align the actuator opening with the opening to provide access to the switch.

Abstract: Examples of providing access to a switch of an electronic device are described herein. In an example, a housing of the electronic device includes a sidewall having an opening to receive an external actuator to access a switch of the electronic device. The housing further includes a first bracket and a second bracket, both movably coupled to the sidewall. The first bracket includes an actuator opening, which when aligned with the opening of the sidewall, allows the external actuator to access the switch. Further, the second bracket is moveable to co-operate with the first bracket to align the actuator opening with the opening to provide access to the switch.

Abstract: In an example, an enclosure lock may include a lock port disposed in a device enclosure, the lock port to receive a device lock. The enclosure lock may also include a lock latch, which may be disposed within such a device enclosure. The lock latch may be movable from a released position to a locked position by the device lock if the device lock is engaged with the lock port. The lock latch may engage with an enclosure ledge of the device enclosure if the lock latch is disposed in the locked position such that the device enclosure is not able to be disassembled.

Abstract: A camera module includes a base and at least one camera unit. The camera unit is mounted on the base, and the camera unit includes a circuit substrate, an image sensor, a lens assembly, a circuit board, a plurality of metal wires. The circuit substrate is rectangular, and has four edges and a plurality of first pads. The first pads are located along two adjacent edges of the circuit substrate. The image sensor and the lens assembly are mounted on the circuit substrate. The circuit board has two notched edges and a plurality of second pads. The second pads are located along the two notched edges of the circuit board. The second pads correspond to the first pads. Each second pad is connected to a corresponding first pad by one of the metal wires. The camera module uses wire bonding to connect the circuit substrate to the circuit board.

Abstract: A method for screening samples for building a prediction model and a computer program product thereof are provided. When a set of new sample data is added to a dynamic moving window (DMW), a clustering step is performed with respect to all of the sets of sample data within the window for grouping the sets of sample data with similar properties as one group. If the number of the sets of sample data in the largest group is greater than a predetermined threshold, it means that there are too many sets of sample data with similar properties in the largest group, and the oldest sample data in the largest group can be deleted; if smaller than or equal to a predetermined threshold, it means that the sample data in the largest group are quite unique, and should be kept for building or refreshing the prediction model.

Abstract: A method for searching, analyzing, and optimizing process parameters and a computer product thereof are provided. At first, sets of process data that are generated when a process tool processes workpieces are obtained respectively, each set of process data including process parameters. Then, sets of metrology data measured by a metrology tool are obtained, wherein the sets of metrology data are corresponding to the sets of the process data in a one-to-one manner, each workpiece having at least one measurement point, each set of metrology data including at least one actual measurement value of at least one measurement item at the at least one measurement point. Thereafter, critical parameters are selected from the process parameters. Then, values of the critical parameters are adjusted to enable predicted measurement values of the measurement points of one workpiece to meet a quality target value.

Abstract: An advanced process control (APC) system, an APC method, and a computer program product, which, when executed, performs an APC method are provided for incorporating virtual metrology (VM) into APC. The present inventions uses a reliance index (RI) and a global similarity index (GSI) to adjust at least one controller gain of a run-to-run (R2R) controller when the VM value of a workpiece is adopted to replace the actual measurement value of the workpiece. The RI is used for gauging the reliability of the VM value, and the GSI is used for assessing the degree of similarity between the set of process data for generating the VM value and all the sets of historical process data used for building the conjecturing model.

Abstract: A method of handling packet loss uses error-correcting codes and block rearrangement. This method divides the original data stream into data blocks, then codes the blocks by error-correcting codes. After coding the blocks, rearranges the coding blocks for spreading original data into new blocks and then transmitting the new blocks. After receiving the transmitted blocks, reverse-rearrangs the received blocks and decode the blocks. Combine the decoded blocks into original data stream in the end.

Abstract: The present invention provides a stand assembly for supporting an electronic device. The stand assembly includes a main stand member and an auxiliary stand member. The main stand member includes a first stand and a second stand. The first stand is pivotally connected to the electronic device. The second stand is pivotally connected to the first stand and capable of sliding relative to the electronic device. The auxiliary stand member is pivotally connected to the electronic device.

Abstract: An advanced process control (APC) system, an APC method, and a computer program product, which, when executed, performs an APC method are provided for incorporating virtual metrology (VM) into APC. The present inventions uses a reliance index (RI) and a global similarity index (GSI) to adjust at least one controller gain of a run-to-run (R2R) controller when the VM value of a workpiece is adopted to replace the actual measurement value of the workpiece. The RI is used for gauging the reliability of the VM value, and the GSI is used for assessing the degree of similarity between the set of process data for generating the VM value and all the sets of historical process data used for building the conjecturing model.

Abstract: A method of handling packet loss uses errorcorrecting codes and block rearrangement. This method divides the original data stream into data blocks, then codes the blocks by errorcorrecting codes. After coding the blocks, rearranges the coding blocks for spreading original data into new blocks and then transmitting the new blocks. After receiving the transmitted blocks, reverserearrangs the received blocks and decode the blocks. Combine the decoded blocks into original data stream in the end.