Patents by Inventor Wei-Ren LAI

Wei-Ren LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12105907
    Abstract: A display panel and an operation method of the display panel are provided. The display panel includes a display area and a frame area. The display area is configured to display an image. During a touch sensing period, the display area and the frame area emit an uplink signal to perform an active stylus touch detection operation.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: October 1, 2024
    Assignee: Novatek Microelectronics Corp.
    Inventors: Yu-Ying Tang, Wei-Ren Chang, Chih-Yang Ke, Chih-Chang Lai
  • Patent number: 10935646
    Abstract: A composite case of an airborne ultrasonic transducer for transmitting, receiving, or both of ultrasound in atmospheric environment at an ultrasound pressure level is disclosed. The case comprises a first case component and at least a second case component. The second case component is made of a material different from the first case component having an acoustic impedance smaller than that of said first case component and is structurally connected to the first case component for reducing said mechanical quality factor while maintaining said ultrasound pressure level. The connection between the first and second case components is by strong bonding at an interface between the components so that the strong bonding forms a composite structure for the case.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: March 2, 2021
    Assignee: SIMTRANS TECH INC
    Inventors: Wen-Jong Wu, Nai-Chang Wu, Yuan-Ping Liu, Wei-Ren Lai, Chao-Ting Wu
  • Publication number: 20190004162
    Abstract: A composite case of an airborne ultrasonic transducer for transmitting, receiving, or both of ultrasound in atmospheric environment at an ultrasound pressure level is disclosed. The case comprises a first case component and at least a second case component. The second case component is made of a material different from the first case component having an acoustic impedance smaller than that of said first case component and is structurally connected to the first case component for reducing said mechanical quality factor while maintaining said ultrasound pressure level. The connection between the first and second case components is by strong bonding at an interface between the components so that the strong bonding forms a composite structure for the case.
    Type: Application
    Filed: September 7, 2018
    Publication date: January 3, 2019
    Inventors: Wen-Jong WU, Nai-Chang WU, Yuan-Ping LIU, Wei-Ren LAI, Chao-Ting WU
  • Publication number: 20180240334
    Abstract: The present disclosure illustrates a code activation device used to transmit an activation signal to a back-end device, so as to activate the back-end device. The code activation device comprises a sensing module and a processing module. The sensing module comprises a sensor unit, and the sensor unit generates sensing signals according to a preset action of a trigger object. The processing module connected to the sensing module receives the sensing signals, generates a sensing beat according to interval periods between the sensing signals, and determines whether the sensing beat matches a preset beat, wherein the processing module generates the activation signal when the sensing beat matches the preset beat.
    Type: Application
    Filed: August 29, 2017
    Publication date: August 23, 2018
    Inventors: Yuan-Ping Liu, Chao-Ting Wu, Wei-Ren Lai, Kai-Wen Cheng, Chiao-Yu Hsiao, Wei-Hsun Wang
  • Publication number: 20150243273
    Abstract: A composite case of an ultrasonic transducer for transmitting, receiving, or both of ultrasound is disclosed. The case comprises a first case component and at least a second case component. The second case component is made of a material different from the first case component and is structurally connected to the first case component by strong bonding at an interface between the components so that the strong bonding forms a composite structure for the case.
    Type: Application
    Filed: February 25, 2015
    Publication date: August 27, 2015
    Inventors: Wen-Jong WU, Nai-Chang WU, Yuan-Ping LlU, Wei-Ren LAI, Chao-Ting WU
  • Patent number: D820264
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 12, 2018
    Assignee: MIEZO INC.
    Inventors: Wei-Ren Lai, Wei-Hsun Wang, Chao-Ting Wu, Yuan-Ping Liu, Kai-Wen Cheng, Chiao-Yu Hsiao
  • Patent number: D832217
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: October 30, 2018
    Assignee: MIEZO INC.
    Inventors: Wei-Ren Lai, Wei-Hsun Wang, Chao-Ting Wu, Yuan-Ping Liu, Kai-Wen Cheng, Chiao-Yu Hsiao