Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.

Abstract: A mechanical device includes a working medium, a hot end, a cold end, and first and second volume regulating units. The hot and cold ends are in thermal contact with the working medium during circulation thereof. The first and second volume regulating units are disposed between the hot and cold ends, and are configured to allow passage of the working medium therethrough to perform compression and expansion of the working medium. The volume of the working medium exiting the first volume regulating unit differs from that of the working medium entering the second volume regulating unit. The volume of the working medium entering the first volume regulating unit differs from that of the working medium exiting the second volume regulating unit.