Abstract: An anti-diffusion substrate structure includes a substrate, a substrate circuit layer, and a chip. The substrate has multiple through holes. Within each of the through holes includes a first metal layer and an anti-diffusion layer plated on the first metal layer. The anti-diffusion layer is an Electroless Palladium Immersion Gold (EPIG) layer or an Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) layer. The substrate circuit layer is mounted on the substrate and extended on the anti-diffusion layer within each of the through holes. The substrate circuit layer is made of a second metal layer, and a composition of the second metal layer is different from a composition of the first metal layer. The chip is electrically connected to the substrate circuit layer. The anti-diffusion layer is able to better prevent material of the first metal layer from migrating or diffusing to the second metal layer.

Abstract: A liquid-cooled cooling structure includes a cooling main body having a condensation chamber and an evaporation chamber arranged vertically therein; a separation member arranged between and separating the condensation chamber and the evaporation chamber, and having a first through hole and a second through hole communicating with the condensation chamber and the evaporation chamber, a dimension of the first through hole being greater than that of the second through hole; a longitudinal partition board received in the condensation chamber and arranged between the first through hole and the second through hole and separating the condensation chamber into a first channel and a second channel; cooling fins extended from an outer perimeter of the cooling main body.

Abstract: An arteriovenous fistula (AVF) stenosis detection system and method thereof and sensing device are provided. The AVF stenosis detection system includes: a sensing device including a microphone; and a server coupled to the sensing device. The sensing device contacts a first location of a patient body, wherein there is a first distance between the first location and a second location of an AVF of the patient body, and the first location is located on an extended path of an artery or a vein corresponding to the AVF. The sensing device receives a frequency spectrum signal through the microphone and transmits the frequency spectrum signal to the server. The server calculates a stenosis percentage of the AVF corresponding to the frequency spectrum signal through a machine learning module and transmits the stenosis percentage to the sensing device.

Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: An apparatus comprises a processing device that is configured to obtain information about driver installations of a given driver on a plurality of computing devices and to obtain information about system failures from the plurality of computing devices. The processing device is further configured to determine a correlation between the driver installations and the system failures and to determine that the given driver is likely to cause a system failure based at least in part on the determined correlation between the driver installations and the system failures. The processing device is further configured to provide an indication that the given driver is likely to cause a system failure to a given computing device. The indication is configured to cause the given computing device to inhibit a presentation of a recommendation to install the given driver to a user of the given computing device.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A luminescent material includes a particle of an irregular shape. The particle of an irregular shape includes a core of an irregular shape and quantum dots. The quantum dots distribute on the core.

Abstract: An apparatus comprises a processing device that is configured to obtain information about driver installations of a given driver on a plurality of computing devices and to obtain information about system failures from the plurality of computing devices. The processing device is further configured to determine a correlation between the driver installations and the system failures and to determine that the given driver is likely to cause a system failure based at least in part on the determined correlation between the driver installations and the system failures. The processing device is further configured to provide an indication that the given driver is likely to cause a system failure to a given computing device. The indication is configured to cause the given computing device to inhibit a presentation of a recommendation to install the given driver to a user of the given computing device.

Abstract: The present disclosure provides a quantum dot and a manufacturing method for the same, and a luminescent material, a light-emitting element and a display device applying the quantum dot. The quantum dot includes a core and a shell layer. The core is at least one selected from the group consisting of a XII-XV group compound semiconductor nano-crystal, a XII-XVI group compound semiconductor nano-crystal, a XIII-XV group compound semiconductor nano-crystal and a XIII-XVI group compound semiconductor nano-crystal. The core contains a cadmium element and a selenium element. The shell layer contains a zinc element and a sulfur element. The shell layer encloses the core.

Abstract: A luminescent material, a light emitting device, and a display device are disclosed. The luminescent material includes particles and a phosphor. The particles include quantum dots and have an average diameter of 0.06 ?m to 30 ?m.

Abstract: The present disclosure provides a quantum dot and a manufacturing method for the same, and a luminescent material, a light-emitting element and a display device applying the quantum dot. The quantum dot includes a core and a shell layer. The core is at least one selected from the group consisting of a XII-XV group compound semiconductor nano-crystal, a XII-XVI group compound semiconductor nano-crystal, a XIII-XV group compound semiconductor nano-crystal and a XIII-XVI group compound semiconductor nano-crystal. The core contains a cadmium element and a selenium element. The shell layer contains a zinc element and a sulfur element. The shell layer encloses the core.

Abstract: A manufacturing method of a quantum dot, a light-emitting material, a light-emitting device, and a display apparatus are provided. The manufacturing method of a quantum dot includes the following steps. A first solution including at least one element selected from the group consisting of an element in Group XII and an element in Group XIII is provided. A second solution including at least one element selected from the group consisting of an element in Group XV and an element in Group XVI is provided. The first solution and the second solution are mixed. A thermal treatment is performed on the mixed solution. A range of the heating rate of the thermal treatment is 2° C./min to 10° C./min.

Abstract: An arteriovenous fistula (AVF) stenosis detection system and method thereof and sensing device are provided. The AVF stenosis detection system includes: a sensing device including a microphone; and a server coupled to the sensing device. The sensing device contacts a first location of a patient body, wherein there is a first distance between the first location and a second location of an AVF of the patient body, and the first location is located on an extended path of an artery or a vein corresponding to the AVF. The sensing device receives a frequency spectrum signal through the microphone and transmits the frequency spectrum signal to the server. The server calculates a stenosis percentage of the AVF corresponding to the frequency spectrum signal through a machine learning module and transmits the stenosis percentage to the sensing device.

Abstract: A luminescent material includes a particle of an irregular shape. The particle of an irregular shape includes a core of an irregular shape and quantum dots. The quantum dots distribute on the core.

Abstract: A luminescent material, a light emitting device, and a display device are disclosed. The luminescent material includes particles and a phosphor. The particles include quantum dots and have an average diameter of 0.06 ?m to 30 ?m.

Abstract: A manufacturing method of a quantum dot, a light-emitting material, a light-emitting device, and a display apparatus are provided. The manufacturing method of a quantum dot includes the following steps. A first solution including at least one element selected from the group consisting of an element in Group XII and an element in Group XIII is provided. A second solution including at least one element selected from the group consisting of an element in Group XV and an element in Group XVI is provided. The first solution and the second solution are mixed. A thermal treatment is performed on the mixed solution. A range of the heating rate of the thermal treatment is 2° C./min to 10° C./min.

Abstract: A voltage level converter with reduced signal phase distortion is provided. The voltage level converter includes a level shifting circuit followed by a unit interval retrieval circuit. The level shifting circuit takes complementary input voltage signals and converts to signals with different voltage levels. The unit interval retrieval circuit responds to the output complementary signals from the level shifting circuit and generates one or more output signals that restore the period of the original input voltage signals with no or negligible phase distortion.