Abstract: A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates 40. Each heat pipe 20 has a horizontal heat absorbing portion 22 attached to the base 10, and two heat dissipation portions 24 extending perpendicularly from opposite ends of the heat absorbing portion 22 and through the side plates 40.

Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.

Abstract: A fastener for mounting a heat sink on a chip mounted on a printed circuit board includes a cylindrical spring member and a locking member. The locking member includes a pair of action portions extending through the spring member, an elastic insertion portion formed at the bottom of the action portions and located beneath the spring member, and a pair of spaced hooking portions formed from the action portions and engaged with the spring member.

Abstract: A heat sink for dissipating heat generated by an integrated circuit package includes a flat base 10, two vertical U-shaped heat pipes 20 and a heat dissipation body. The heat dissipation body includes a pair of side plates 40 and a plurality of fins 50 sandwiched between the side plates 40. Each heat pipe 20 has a horizontal heat absorbing portion 22 attached to the base 10, and two heat dissipation portions 24 extending perpendicularly from opposite ends of the heat absorbing portion 22 and through the side plates 40.

Abstract: A heat sink clip includes a main body (20), and an operating body (40) rotatably attached to the main body. The main body includes a central portion (21), and two clipping portions (23) depending from opposite ends thereof. Two mounting portions (27) depend from the main body. A claw (25) is formed on each mounting portion. The operating body includes a shaft (41) rotatably received in the claws of the main body, and a handle (43) perpendicularly extending from one end of the shaft. A cam (45) is formed on the shaft. Two annular recesses (47) are defined in the shaft at opposite sides of the cam, the recesses rotatably receiving the claws. If the operating body needs to be replaced with another operating body having a different sized cam, the operating body is easily pulled out from the claws.

Abstract: A heat dissipation device includes a heat sink (10) and a pair of heat pipes (20). The heat sink includes a base (12), a top plate (18), and a plurality of fins (16) thermally connecting the base and the plate through solder. Opposite ends of each heat pipe are engaged with the base and the plate respectively, for transferring heat accumulated at the base to the plate.

Abstract: A heat sink clip includes a main body (20), and an operating body (40) rotatably attached to the main body. The main body includes a central portion (21), and two clipping portions (23) depending from opposite ends thereof. Two mounting portions (27) depend from the main body. A claw (25) is formed on each mounting portion. The operating body includes a shaft (41) rotatably received in the claws of the main body, and a handle (43) perpendicularly extending from one end of the shaft. A cam (45) is formed on the shaft. Two annular recesses (47) are defined in the shaft at opposite sides of the cam, the recesses rotatably receiving the claws. If the operating body needs to be replaced with another operating body having a different sized cam, the operating body is easily pulled out from the claws.

Abstract: A method for making a heat dissipation device (3) includes the steps of: providing a metal plate (2) and a fin member (1), bending the metal plate to form a body (2′), and attaching the fin member to the body. The metal plate includes a central portion (22) and a pair of end portions (24). The central portion is thicker than the end portions. The body includes a chassis (22′) originating from the central portion of the metal plate, and a pair of side walls (24′) originating from the end portions of the metal plate. The fin member is attached to the chassis between the side walls.

Abstract: A clip (40) adapted to attach a heat sink (30) to an electronic device (20) includes a body (50) and a lever (70). The lever is fastened to the body with a pivot (96). The lever includes a pressing portion (74) and a bore (80). First and second contact points (76, 78) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove (36) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.

Abstract: A heat dissipating assembly includes a heat sink (12) and a pair of clips (14). The heat sink has a base (20) defining a pair of slots (24) spaced from each other, and a plurality of fins (22) extending from a top surface of the base between the slots. The clip defines a pressing body (40) and two legs (50) extending from opposite ends of the pressing body, each leg defining an aperture (52). A horizontal portion (48) formed at the middle of the pressing body forms a U-shaped hook (42) extending downward from one side edge thereof. The hook is elastically deformable to be engagingly and interferentially received in the slot of the base of the heat sink for attaching the clip to the heat sink. The assembly is a singe unit ready to be conveniently mounted onto an electronic device.

Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Abstract: A method for making a heat dissipation device (3) includes the steps of: providing a metal plate (2) and a fin member (1), bending the metal plate to form a body (2′), and attaching the fin member to the body. The metal plate includes a central portion (22) and a pair of end portions (24). The central portion is thicker than the end portions. The body includes a chassis (22′) originating from the central portion of the metal plate, and a pair of side walls (24′) originating from the end portions of the metal plate. The fin member is attached to the chassis between the side walls.

Abstract: A heat sink assembly (1) includes a heat sink (10), and a fan (20) attached to the heat sink. The fan is box-shaped, and defines two recesses (24) in each of two opposite side walls (22) thereof. The heat sink includes a base (12) and a plurality of parallel fins (14) extending upwardly therefrom. The fins include two engaging fins (16) at each of two opposite lateral sides of the heat sink. A wedge-shaped inside catch (18) is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan. In assembly, the fan is pressed downwardly so that the engaging fins elastically deform, and the catches enter the recesses of the fan. Thus the fan is readily and securely attached to the heat sink. In an alternative embodiment, catches (18′) of the heat sink (10′) engage in through holes (26) of the fan.

Abstract: A heat sink assembly (1) includes a heat sink (10), and a fan (20) attached to the heat sink. The fan is box-shaped, and defines two recesses (24) in each of two opposite side walls (22) thereof. The heat sink includes a base (12) and a plurality of parallel fins (14) extending upwardly therefrom. The fins include two engaging fins (16) at each of two opposite lateral sides of the heat sink. A wedge-shaped inside catch (18) is formed at a distal end of each engaging fin, for engaging with the corresponding recess of the fan. In assembly, the fan is pressed downwardly so that the engaging fins elastically deform, and the catches enter the recesses of the fan. Thus the fan is readily and securely attached to the heat sink. In an alternative embodiment, catches (18′) of the heat sink (10′) engage in through holes (26) of the fan.

Abstract: A heat removal system of the present invention includes a fan (30) of a power supply (20), a heat sink (50) mounted to the fan, and a heat pipe (60) connecting the heat sink to a CPU (24). The heat sink includes a cylindrical base (52) and a plurality of radial fins (54) around the base. Four bolts (40) attach the heat sink and the fan to the power supply. A central bore (58) is defined in the base of the heat sink, for receiving one end of the heat pipe. The other end of the heat pipe is attached to a top surface of the CPU. Heat generated by the CPU is thereby conducted to the heat sink via the heat pipe, and then dissipated outside of a computer enclosure by forced convection of the fan.

Abstract: A heat removal system of the present invention includes a fan (30) of a power supply (20), a heat sink (50) mounted to the fan, and a heat pipe (60) connecting the heat sink to a CPU (24). The heat sink includes a cylindrical base (52) and a plurality of radial fins (54) around the base. Four bolts (40) attach the heat sink and the fan to the power supply. A central bore (58) is defined in the base of the heat sink, for receiving one end of the heat pipe. The other end of the heat pipe is attached to a top surface of the CPU. Heat generated by the CPU is thereby conducted to the heat sink via the heat pipe, and then dissipated outside of a computer enclosure by forced convection of the fan.

Abstract: A heat dissipation assembly (20) includes a heat sink (10) and a metal plate (30). The heat sink includes a chassis (14) and a plurality of fins (12). The chassis forms a pair of tabs (17) depending from each of two opposite sides of a bottom surface (15) of the chassis. First and second flanges (18, 19) respectively depend from the opposite sides, between the tabs. A material (45) with low thermal resistance is arranged between the metal plate and the chassis. The metal plate is attached to the bottom surface of the chassis. The flanges are bent inwardly to fasten the metal plate to the chassis.

Abstract: A heat sink clip (30) includes a spring portion (31) and two arms (36) extending from respective opposite ends of the spring portion. The spring portion has a horizontal portion (35) which forms a tab (33) extending horizontally and then downwardly from a side edge of the horizontal portion. The tab defines a positioning hole (34) for engaging with a catch (62) formed on a side wall of a retention module (60). Each arm defines an aperture (37) for engaging with a beam (61) formed on each end of the retention module. The end of each arm extends outward to form a T-shaped handle (40). The handle includes an L-shaped connecting portion (41) and an L-shaped operation portion (42).

Abstract: A clip (40) adapted to attach a heat sink (30) to an electronic device (20) includes a body (50) and a lever (70). The lever is fastened to the body with a pivot (96). The lever includes a pressing portion (74) and a bore (80). First and second contact points (76, 78) are defined at a lower edge of the pressing portion at different distances from the bore. The clip is initially placed in a groove (36) of the heat sink, whereupon the first contact point abuts a top surface of the groove. When the lever is fully depressed, the second contact point firmly abuts the top surface of the groove. Thus the clip securely attaches the heat sink to the electronic device.

Abstract: A heat dissipating assembly (10) includes a heat sink (12), a pair of clips (14), and a pair of holders (16). The heat sink includes a chassis (20) defining a pair of slots (24) spaced from each other and a plurality of fins (22) extending from the chassis between the slots. Each clip includes a central horizontal portion (42), two pressing bodies (40) extending from respective sides of the horizontal portion, and two legs (44) extending from respective distal ends of the pressing bodies. Each leg defines an aperture (46). Each holder has a tab (62) and a U-shaped hook (64) depending perpendicularly from respective opposite ends thereof. Each hook is elastically deformable to be engagingly received in the slot of the chassis. The horizontal portion of each clip is located between the tab and the hook of the holder, whereby the clip is attached to the heat sink by the holder.