Patents by Inventor Wei-Te Chu

Wei-Te Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package, packaging method and substrate thereof for sliding type thin fingerprint sensor
    Patent number: 8050467
    Abstract: A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.
    Type: Grant
    Filed: September 19, 2007
    Date of Patent: November 1, 2011
    Assignee: Chipbond Technology Corporation
    Inventors: Charles Yang, Yeh-Shun Chen, Yung-Jen Chen, Wei-Te Chu, Tun-Yu Chen
  • Package, packaging method and substrate thereof for sliding type thin fingerprint sensor
    Publication number: 20090073632
    Abstract: A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 19, 2009
    Inventors: Charles Yang, Yeh-Shun Chen, Yung-Jen Chen, Wei-Te Chu, Tun-Yu Chen