Patents by Inventor Wei Tuo

Wei Tuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961826
    Abstract: Bonded wafer device structures, such as a wafer-on-wafer (WoW) structures, and methods of fabricating bonded wafer device structures, including an array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure. The array of contact pads formed in an interconnect level of at least one wafer may have an array pattern that corresponds to an array pattern of contact pads that is subsequently formed over a surface of the bonded wafer structure. The array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure may enable improved testing of individual wafers, including circuit probe testing, prior to the wafer being stacked and bonded to one or more additional wafers to form a bonded wafer structure.
    Type: Grant
    Filed: March 22, 2023
    Date of Patent: April 16, 2024
    Inventors: Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang
  • Publication number: 20240071911
    Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.
    Type: Application
    Filed: January 31, 2023
    Publication date: February 29, 2024
    Inventors: Harry-Haklay Chuang, Wen-Tuo Huang, Li-Feng Teng, Wei-Cheng Wu, Yu-Jen Wang
  • Publication number: 20210392299
    Abstract: A method for handling image data of an unmanned aerial vehicle (UAV) includes an imaging device carried by a carrier of the UAV acquiring a plurality of images while the UAV being in flight, continuing to acquire additional images by the imaging device, a processor of the UAV applying a first compression and a second compression to the plurality of images to generate first image data and second image data, respectively, storing the first image data to a storage device configured on the UAV without transmitting the first image data to any devices remote from the UAV, transmitting the second image data to a remote device through a direct connection between the UAV and the remote device for a real-time display at the remote device, and controlling an actuation mechanism of the carrier to cause an angular movement and a linear movement of the imaging device relative to the UAV.
    Type: Application
    Filed: August 30, 2021
    Publication date: December 16, 2021
    Inventors: Wei TUO, Hui SUN, Zisheng CAO, Qiang ZHANG
  • Patent number: 11108997
    Abstract: A method for handling image data of an electronic device includes an imaging device of the electronic device acquiring a plurality of images and continuing to acquire additional images after acquiring the plurality of images, and, while the additional images are continuously acquired by the imaging device, one or more processors of the electronic device storing first image data that correspond to the acquired plurality of images to a storage device of the electronic device, processing the plurality of images to generate second image data, and transmitting the second image data to a remote device. The second image data has a smaller data size than the first image data.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: August 31, 2021
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Wei Tuo, Hui Sun, Zisheng Cao, Qiang Zhang
  • Publication number: 20210149280
    Abstract: An image capturing apparatus comprises an apparatus body including an adapter; a gimbal including a rotation shaft mechanism detachably connected to the apparatus body, the rotation shaft mechanism including a connection terminal detachably connected to the adapter and electrically connected to the adapter; a sensor imaging device disposed at the rotation shaft mechanism and electrically connected to the connection terminal; and an image processing device disposed at the apparatus body and electrically connected to the sensor imaging device via the connection terminal and the adapter.
    Type: Application
    Filed: December 31, 2020
    Publication date: May 20, 2021
    Inventors: Wei TUO, Zhiwei LIU, Qiang ZHANG, Zisheng CAO, Yunyou LU
  • Publication number: 20210012459
    Abstract: A method for image processing includes determining an upsample region based on a region excluding a region of interest in an image; and performing an upsampling operation in the upsample region without performing the upsampling operation in the region of interest.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 14, 2021
    Inventors: Xing CHEN, Zisheng CAO, Wei TUO, Junping MA, Qiang ZHANG
  • Publication number: 20200193135
    Abstract: An image processing method is provided for an image device. The method includes obtaining type information of an image sensor of the image device; obtaining multi-path serial image signals outputted by the image sensor; converting the multi-path serial image signals into effective pixels according to the type information; and outputting the effective pixels.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Inventors: Junping MA, Wei TUO, Qiang ZHANG, Zisheng CAO
  • Patent number: 10635633
    Abstract: The invention provides systems, methods, and devices related to writing and reading a file. A block area having a plurality of idle storage blocks is provided. Each idle block of said plurality of idle storage blocks is associated with a block identifier of a plurality of block identifiers. Additionally, each block identifier of the plurality of block identifiers is listed in a block index. Each block identifier has content that stores a unique block identifier of the plurality of block identifiers that links the block identifier with the unique block identifier, thereby linking the plurality of block identifiers.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: April 28, 2020
    Assignee: SZ DJI TECHNOLOGY CO., LTD.
    Inventors: Ke Wang, Qiang Zhang, Wei Tuo, Taiwen Liang
  • Publication number: 20190166334
    Abstract: A method for handling image data of an electronic device includes an imaging device of the electronic device acquiring a plurality of images and continuing to acquire additional images after acquiring the plurality of images, and, while the additional images are continuously acquired by the imaging device, one or more processors of the electronic device storing first image data that correspond to the acquired plurality of images to a storage device of the electronic device, processing the plurality of images to generate second image data, and transmitting the second image data to a remote device. The second image data has a smaller data size than the first image data.
    Type: Application
    Filed: February 1, 2019
    Publication date: May 30, 2019
    Inventors: Wei TUO, Hui SUN, Zisheng CAO, Qiang ZHANG
  • Publication number: 20190138241
    Abstract: Systems, methods, and/or devices are used for storing images. An electronic device includes an image sensor, a solid-state drive (SSD) that includes a Peripheral Component Interconnect Express (PCIe) compatible electrical interface, and a field-programmable gate array (FPGA) coupled to the image sensor and the SSD. The FPGA implements a PCIe intellectual property (IP) core. The FPGA is configured to: receive raw image data from the image sensor; process the raw image data to obtain processed image data; and transfer the processed image data to the SSD through the PCIe compatible electrical interface of the SSD, wherein the transfer through the PCIe compatible electrical interface is driven by the PCIe IP core of the FPGA.
    Type: Application
    Filed: January 8, 2019
    Publication date: May 9, 2019
    Inventors: Wei TUO, Qiang ZHANG, Zhiwei LIU, Ke WANG
  • Publication number: 20170052963
    Abstract: The invention provides systems, methods, and devices related to writing and reading a file. A block area having a plurality of idle storage blocks is provided. Each idle block of said plurality of idle storage blocks is associated with a block identifier of a plurality of block identifiers. Additionally, each block identifier of the plurality of block identifiers is listed in a block index. Each block identifier has content that stores a unique block identifier of the plurality of block identifiers that links the block identifier with the unique block identifier, thereby linking the plurality of block identifiers.
    Type: Application
    Filed: October 20, 2016
    Publication date: February 23, 2017
    Inventors: Ke Wang, Qiang Zhang, Wei Tuo, Taiwen Liang