Patents by Inventor Wei Wu
Wei Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147711Abstract: The present disclosure provides a memory device, a semiconductor device, and a method of operating a memory device. A memory device includes a memory cell, a bit line, a word line, a select transistor, a fuse element, and a heater. The bit line is connected to the memory cell. The word line is connected to the memory cell. The select transistor is disposed in the memory cell. A gate of the select transistor is connected to the word line. The fuse element is disposed in the memory cell. The fuse element is connected to the bit line and the select transistor. The heater is configured to heat the fuse element.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Inventors: PERNG-FEI YUH, YIH WANG, MENG-SHENG CHANG, JUI-CHE TSAI, KU-FENG LIN, YU-WEI LIN, KEH-JENG CHANG, CHANSYUN DAVID YANG, SHAO-TING WU, SHAO-YU CHOU, PHILEX MING-YAN FAN, YOSHITAKA YAMAUCHI, TZU-HSIEN YANG
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Publication number: 20240145919Abstract: An antenna module includes a first metal plate and a frame body. The frame body surrounds the first metal plate. The frame body includes a first antenna radiator, a second antenna radiator, a third antenna radiator, a first breakpoint and a second breakpoint. The first antenna radiator includes a first feeding end and excites a first frequency band. The second antenna radiator includes a second feeding end and excites a second frequency band. The third antenna radiator includes a third feeding end and excites a third frequency band. The first breakpoint is located between the first antenna radiator and the second antenna radiator. The second breakpoint is located between the second antenna radiator and the third antenna radiator. An electronic device including the above-mentioned antenna module is also provided.Type: ApplicationFiled: September 6, 2023Publication date: May 2, 2024Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Shih-Keng Huang, Chao-Hsu Wu, Chih-Wei Liao, Sheng-Chin Hsu, Hao-Hsiang Yang, Tse-Hsuan Wang
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Publication number: 20240143791Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes a search circuitry and a substitution check circuitry. The key generation circuitry is arranged operably to convert a first value of one byte corresponding to a plaintext, an intermediate encryption result, or a round key into a second value of a K-bit according to an 8-to-K lookup table, where K is an integer ranging from 10 to 15 and the second value comprises (K minus 8) bits of a Hamming parity. The substitution check circuitry is arranged operably to employ check formulae corresponding to the 8-to-K lookup table to determine whether an error is occurred during a conversion of the first value of the one byte into the second value of the K-bit, and output an error signal when finding the error, where a total amount of the formulae is K minus 8.Type: ApplicationFiled: May 30, 2023Publication date: May 2, 2024Applicant: Silicon Motion, Inc.Inventors: Wun-Jhe WU, Po-Hung CHEN, Chiao-Wen CHENG, Jiun-Hung YU, Chih-Wei LIU
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Publication number: 20240144124Abstract: Embodiments of this specification disclose methods and systems for colocation of a plurality of business services. The method includes: for one of the business services, determining a target resource level corresponding to the business service; obtaining a target schedulable resource of each of one or more processing devices, where the target schedulable resource is a schedulable resource corresponding to the target resource level; and determining, based on whether the target schedulable resource satisfies a deployment condition corresponding to the business service, a method for deploying the business service on the one or more processing devices.Type: ApplicationFiled: October 25, 2023Publication date: May 2, 2024Inventors: Hao DAI, Tongkai YANG, Wei WU
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Publication number: 20240142829Abstract: An array substrate includes a first substrate; and a first electrode and a second electrode disposed on the first substrate and located in a sub-pixel region. At least one of the first electrode and the second electrode includes a plurality of electrode strips. Every two adjacent electrode strips in the first electrode and the second electrode have a slit therebetween. The slit includes a first end portion, a straight portion, and a second end portion connected in sequence. A bend is formed at a connection position of the first end portion and the straight portion, and the second end portion is formed by protruding from the straight portion. The straight portion includes a first edge and a second edge parallel to each other, and an average width of the first end portion in a direction perpendicular to the first edge is less than a width of the straight portion.Type: ApplicationFiled: July 5, 2022Publication date: May 2, 2024Applicants: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Jian WANG, Jinshuai DUAN, Xiaojuan WU, Hongliang YUAN, Zepeng SUN, Wei ZHAO, Yao BI, Jiaxing WANG, Xiaofeng YIN
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Publication number: 20240142748Abstract: An optical system is provided. The optical system is used for disposing on an electronic device. The optical system includes a movable portion, a fixed portion, a first driving assembly, and a support module. The movable portion is used for connecting to an optical module. The fixed portion is affixed on the electronic device, and the movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the support module.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Inventors: Ying-Jen WANG, Ya-Hsiu WU, Chen-Chi KUO, Chao-Chang HU, Yi-Ho CHEN, Che-Wei CHANG, Ko-Lun CHAO, Sin-Jhong SONG
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Publication number: 20240145898Abstract: An electronic device including a metal casing and at least one antenna module is provided. The metal casing includes at least one window. The at least one antenna module is disposed in the at least one window. The at least one antenna module includes a first radiator and a second radiator. The first radiator includes a feeding end, a first ground end joined to the metal casing, a second ground end, a first portion extending from the feeding end to the first ground end, and a second portion extending from the feeding end to the second ground end. A first coupling gap is between the second radiator and the first portion. A second coupling gap is between at least part of the second radiator and the metal casing, and the second radiator includes a third ground end joined to the metal casing.Type: ApplicationFiled: September 8, 2023Publication date: May 2, 2024Applicant: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Chao-Hsu Wu, Sheng-Chin Hsu, Chih-Wei Liao, Hau Yuen Tan, Cheng-Hsiung Wu, Shih-Keng Huang
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Publication number: 20240143332Abstract: This application provides an exception locating method includes: A first device receives a first exception signal which changes abruptly from a first communication signal when the first communication signal passes through a location of an exception on a first line. The first device receives exception alarm information which is sent by the second device after the second device receives a second exception signal, the second exception signal is a signal that changes abruptly from a second communication signal when the second communication signal passes through the location of the exception. The first device determines the location of the exception based on a first time interval, where the first time interval is an interval between time at which the first exception signal is received and time at which the exception alarm information is received.Type: ApplicationFiled: December 19, 2023Publication date: May 2, 2024Inventors: Wei WU, Jianfeng WANG, Jinhui WANG, Hao LI
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Publication number: 20240146091Abstract: A vehicle power management system and a power management method thereof are provided. The power management method includes: determining, by a microcontroller, whether or not a voltage of an ignition-off signal is less than a voltage threshold when the microcontroller receives the ignition-off signal; stopping a vehicle power supply from charging a backup battery, and using the vehicle power supply to charge a back-end load; activating a counter of the microcontroller; stopping the vehicle power supply from charging the back-end load, and using the backup battery to charge the back-end load when a counting time of the counter reaches a first time threshold; sending, by the microcontroller, the ignition-off signal to the back-end load when the counting time of the counter reaches a second time threshold; and stopping the backup battery from charging the back-end load when the counting time of the counter reaches a third time threshold.Type: ApplicationFiled: April 17, 2023Publication date: May 2, 2024Inventors: MING-ZONG WU, CHUN-KAI CHANG, LI-WEI CHENG
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Publication number: 20240142175Abstract: Disclosed are an unblocking apparatus for a furnace discharging pipe and a use method. The unblocking apparatus includes a rail, a rail car that may move along the rail, an unblocking drive mechanism arranged on the rail car, a heat-unblocking component, a cold-unblocking component, and a material receiving component that is used to receive a blocking material in the discharging pipe, and a drive end of the unblocking drive mechanism is detachably connected with one end of the heat-unblocking component and the cold-unblocking component respectively. The present application effectively handles different blockage situations of the furnace discharging pipe by connecting the unblocking drive mechanism with an unblocking rod capable of heat-unblocking and a drilling rod capable of cold-unblocking, thereby two modes of heat-unblocking and cold-unblocking are performed on the furnace discharging pipe; and the discharging pipe may be unblocked by a remote operation.Type: ApplicationFiled: October 23, 2023Publication date: May 2, 2024Applicants: China Nuclear Sichuan Environmental Protection Engineering Co., Ltd., China Building Materials Academy, China Nuclear Power Engineering Co., Ltd.Inventors: Weidong XU, Yu CHANG, Yongchang ZHU, Hong DUAN, Chunyu TIAN, Wei WU, Debo YANG, Qingbin ZHAO, Shuaizhen WU, Lin WANG, Zhu CUI, Heyi GUO, Maosong FAN, Yuancheng SUN, Jie MEI, Xiaoli AN, Yongxiang ZHAO, Qinda LIU
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Publication number: 20240142181Abstract: A two-phase immersion-type heat dissipation structure having skived fin with high porosity is provided. The two-phase immersion-type heat dissipation structure having skived fin with high porosity includes a porous heat dissipation structure having a total porosity that is equal to or greater than 5%. The porous heat dissipation structure includes a porous substrate and a plurality of porous and skived fins. The porous substrate has a first surface and a second surface that face away from each other. The second surface of the porous substrate is configured to be in contact with a heating element that is immersed in a two-phase coolant. The plurality of porous and skived fins are integrally formed on the first surface of the porous substrate by skiving. A first porosity of the plurality of porous and skived fins is greater than a second porosity of the porous substrate.Type: ApplicationFiled: October 27, 2022Publication date: May 2, 2024Inventors: CHUN-TE WU, CHING-MING YANG, YU-WEI CHIU, TZE-YANG YEH
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Publication number: 20240145421Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.Type: ApplicationFiled: October 27, 2023Publication date: May 2, 2024Inventors: Kuan-Neng CHEN, Zhong-Jie HONG, Chih-I CHO, Ming-Wei WENG, Chih-Han CHEN, Chiao-Yen WANG, Ying-Chan HUNG, Hong-Yi WU, CHENG-YEN HSIEH
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Publication number: 20240139262Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.Type: ApplicationFiled: October 13, 2023Publication date: May 2, 2024Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
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Patent number: 11969264Abstract: An adaptive controller used in a photoplethysmography sensing system, comprises a plurality of hardware circuits which are configured to: receive a photoplethysmography signal (hereinafter, “PPG signal”) processed; determine whether the PPG signal processed satisfies with a requirement; output the PPG signal processed if the PPG signal processed satisfies with a requirement; and adjust a gain of an amplifier for amplifying the PPG signal and/or a driving signal of a light source if the PPG signal processed does not satisfy with a requirement.Type: GrantFiled: October 16, 2020Date of Patent: April 30, 2024Assignee: Amengine CorporationInventors: Paul C. P. Chao, Tse-Yi Tu, Bo-Wei Pan, Yan-Hwa Wu
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Patent number: 11971555Abstract: An optical system including an enclosure including a front end and a rear end, a first pair of apertures configured to be disposed on a front plane on the front end of the enclosure and a single optical lens system disposed between the front end and the rear end of the enclosure, wherein the first pair of apertures are configured to allow sets of light rays into the enclosure through the single optical lens system to be cast on an image plane as first and second spots, the image plane being parallel to the front plane, if the first and second spots are concentrically disposed, the sets of light rays are determined to be parallelly disposed with respect to one another, otherwise the sets of light rays are determined to not be parallelly disposed with one another.Type: GrantFiled: October 30, 2023Date of Patent: April 30, 2024Assignee: MLOptic Corp.Inventors: Pengfei Wu, Siyuan Liang, Wei Zhou
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Publication number: 20240132925Abstract: The invention provides a method for preparing pyrrolidone, and the invention provides a method for catalytically preparing pyrrolidone with ?-aminobutyric acid in the presence of carnitine-CoA ligase CaiC. The carnitine-CoA ligase CaiC has an amino acid sequence as shown in SEQ ID NO:1. The ligase has catalytic activity in the cyclization of ?-aminobutyric acid to produce pyrrolidone. The carnitine-CoA ligase provided in the present invention affords a yield of pyrrolidone of 3.26 g/L and a molar yield of 39.53% in 24 h when ?-aminobutyric acid is used as a substrate, thus reducing the production period, improving the production of pyrrolidone, and accelerating the industrialization process of producing pyrrolidone by enzymatic conversion method.Type: ApplicationFiled: October 18, 2022Publication date: April 25, 2024Inventors: Jing WU, Xuling JIANG, Liming LIU, Wei SONG, Yiwen ZHOU, Xiulai CHEN, LIU Jia, Cong GAO
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Publication number: 20240131612Abstract: Disclosed are a special tooling and method for electron beam welding of a cavity body and a beam tube of a superconducting niobium cavity. The special tooling includes a first clamping device for fixing a flange and a second clamping device for fixing a semi-cavity body, wherein the first clamping device and the second clamping device are fixedly connected. A pressing ring of the first clamping device is disposed around a beam tube of a superconducting niobium cavity and cooperates with a base plate to clamp and fix the flange. The second clamping device includes clamping arms evenly distributed along a circumference of the semi-cavity body, and each clamping arm includes a second pressing plate axially disposed along the beam tube and a pressing block that is disposed on an end portion of the second pressing plate and fixes an edge of the semi-cavity body.Type: ApplicationFiled: October 18, 2023Publication date: April 25, 2024Inventors: Jianguo Ma, Wei Wen, Zhihong Liu, Jia Tao, Zhenfei Liu, Liming Peng, Nian Liu, Jiefeng Wu
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Publication number: 20240133639Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Inventors: CHUN-LI HSIUNG, KUO-WEI LEE, CHIEN-CHENG WU, CHUN-LUNG WU
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Publication number: 20240130362Abstract: A composite solution for enhancing induced disease resistance of lentinan (LNT) to a plant, a preparation method of the composite solution, and a method for enhancing induced disease resistance of LNT to a plant are provided. The composite solution for enhancing induced disease resistance of LNT to a plant includes: an LNT-containing solution and an SPc-containing solution, where SPc is a dendritic macromolecule functionalized by an amino functional group, and has a structural formula shown in formula I, where n=1 to 100. An LNT/SPc complex is produced in the composite solution. SPc spontaneously combines with LNT through hydrogen bonding, such that an agglomerate structure formed by LNT in an aqueous solution is broken and reduced to a nano-scale particle size, and a spherical particle is produced, which can significantly reduce a contact angle of the LNT aqueous solution, and promote the distribution and diffusion of LNT.Type: ApplicationFiled: August 15, 2023Publication date: April 25, 2024Applicants: KUNMING CO YUNNAN TOBACCO CO, China Agricultural UniversityInventors: Yonghui XIE, Dekai NING, Zhijiang WANG, Shuo YAN, Wei LI, Jie SHEN, Zhengling LIU, Qinhong JIANG, Youguo ZHAN, Yuanshen WANG, Cun GUO, Sihao WU, Haohao LI
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Publication number: 20240136291Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.Type: ApplicationFiled: January 12, 2023Publication date: April 25, 2024Inventors: Hsiang-Ku SHEN, Chen-Chiu HUANG, Chia-Nan LIN, Man-Yun WU, Wen-Tzu CHEN, Sean YANG, Dian-Hao CHEN, Chi-Hao CHANG, Ching-Wei LIN, Wen-Ling CHANG