Abstract: A package comprises a substrate including a first surface, and an upper conductive layer arranged on the first surface, a first light-emitting unit arranged on the upper conductive layer, and comprises a first semiconductor layer, a first substrate, a first light-emitting surface and a first side wall, a second light-emitting unit, which is arranged on the upper conductive layer, and comprises a second light-emitting surface and a second side wall, a light-transmitting layer arranged on the first surface and covers the upper conductive layer, the first light-emitting unit, and the second light-emitting unit, a light-absorbing layer, which is arranged between the substrate and the light-transmitting layer in a continuous configuration of separating the first light-emitting unit and the second light-emitting unit from each other, and a reflective wall arranged on the first side wall, wherein a height of the reflective wall is lower than that of the light-absorbing layer.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.

Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.

Abstract: A method includes etching a dielectric layer of a substrate to form an opening in the dielectric layer, forming a metal layer extending into the opening, performing an anneal process, so that a bottom portion of the metal layer reacts with a semiconductor region underlying the metal layer to form a source/drain region, performing a plasma treatment process on the substrate using a process gas including hydrogen gas and a nitrogen-containing gas to form a silicon-and-nitrogen-containing layer, and depositing a metallic material on the silicon-and-nitrogen-containing layer.

Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.

Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.

Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A foot sensor and analysis device, which includes a pressure sensing layer arranged inside the insole and a sensing module installed inside the insole. The sensing module is electrically coupled with the pressure sensing layer for receiving and processing detected electronic signals, where sensing module includes an inductance coil to perform wireless charging to the battery. The pressure sensing layer and the sensing module are integrally formed inside the insole.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A method for manufacturing a package structure includes providing a carrier board; providing at least one die having a top surface, a bottom surface, and a side surface on the carrier board; and forming a protective layer to cover at least a portion of the side surface of the die. The die includes a substrate, a semiconductor layer, a gate structure, a source structure and a drain structure, at least one dielectric layer, and at least one pad. The semiconductor layer is disposed on the substrate. The gate structure is disposed on the semiconductor layer. The source and the drain structures are disposed on opposite sides of the gate structure. The dielectric layer covers the gate, source, and drain structures. The pad is disposed on the dielectric layer and penetrates through the dielectric layer to electrically contact with the gate, source or drain structure.

Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.

Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.

Abstract: A flexible display input device includes a flexible display layer and a keyswitch layer. The keyswitch layer is disposed under the flexible display layer and includes a first elastic film, a first electrode, a second elastic film, and a second electrode. The first electrode is disposed on a side of the first elastic film facing toward the flexible display layer. The second elastic film is located between the flexible display layer and the first elastic film. The second electrode is disposed on a side of the second elastic film facing toward the first elastic film and is opposite to the first electrode.

Abstract: A flexible display input device includes a flexible display layer and a keyswitch layer. The keyswitch layer is disposed under the flexible display layer and includes a first elastic film, a first electrode, a second elastic film, and a second electrode. The first electrode is disposed on a side of the first elastic film facing toward the flexible display layer. The second elastic film is located between the flexible display layer and the first elastic film. The second electrode is disposed on a side of the second elastic film facing toward the first elastic film and is opposite to the first electrode.

Abstract: A three-dimensional sensing module includes a touch pressure sensing structure. The touch pressure sensing structure includes a first functional spacer layer, a first light-transmitting electrode layer coated on the first functional spacer layer, a second functional spacer layer coated on the first light-transmitting electrode layer, a second light-transmitting electrode layer coated on the second functional spacer layer, and a third functional spacer layer coated on the second light-transmitting electrode layer. Resistivities of the first, second, and third functional spacer layers are greater than resistivities of the first and second light-transmitting electrode layers.

Abstract: A key structure includes a keycap and a connecting member. The keycap has a bottom surface and includes a fixing portion and an elastic arm. The fixing portion is disposed on the bottom surface, and the fixing portion has a connection hole and a first opening communicating with each other. At least one end of the elastic arm connects to a side surface of the fixing portion, and the elastic arm is adjacent to the first opening. The elastic arm has an open end communicating with the opening and a limiting surface toward the bottom surface. The connecting member includes a connection pin, one end of which connects to the connection hole and the other end of which has an extension portion. The connection pin is disposed in the connection hole, and the extension portion is disposed between the bottom surface and the limiting surface.

Abstract: A foldable electronic device includes a first housing, a second housing, a pivot structure, a heat conducting member, a first heat pipe and a second heat pipe. The pivot structure pivotally connects the first housing to the second housing. The heat conducting member is disposed in the pivot structure. An end of the first heat pipe is pivotally connected to the heat conducting member and another end of the first heat pipe is fixed on the first housing. An end of the second heat pipe is pivotally connected to the heat conducting member and another end of the second heat pipe is fixed on the second housing.

Abstract: A three-dimensional sensing module includes a touch pressure sensing structure. The touch pressure sensing structure includes a first functional spacer layer, a first light-transmitting electrode layer coated on the first functional spacer layer, a second functional spacer layer coated on the first light-transmitting electrode layer, a second light-transmitting electrode layer coated on the second functional spacer layer, and a third functional spacer layer coated on the second light-transmitting electrode layer. Resistivities of the first, second, and third functional spacer layers are greater than resistivities of the first and second light-transmitting electrode layers.

Abstract: The present disclosure discloses a key structure including a keycap and a connecting member. The keycap has a bottom surface and includes a fixing portion and an elastic arm. The fixing portion is disposed on the bottom surface, and the fixing portion has a connection hole and a first opening communicating with each other. At least one end of the elastic arm connects to a side surface of the fixing portion, and the elastic arm is adjacent to the first opening. The elastic arm has an open end communicating with the opening and a limiting surface toward the bottom surface. The connecting member includes a connection pin, one end of which connects to the connection hole and the other end of which has an extension portion. The connection pin is disposed in the connection hole, and the extension portion is disposed between the bottom surface and the limiting surface.