Patents by Inventor Wei Yu Nien

Wei Yu Nien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and method of manufacturing the same
    Patent number: 9553072
    Abstract: A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: January 24, 2017
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tau-Jing Yang, Kuo-Feng Huang, Wei Yu Nien
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160343672
    Abstract: A semiconductor device package includes a substrate, electrical components disposed on the substrate, and a conductive frame disposed on the substrate. The conductive frame includes a top portion including at least one opening, a rim connected to the top portion and surrounding the electrical components, and a compartment extending from the top portion of the conductive frame and separating one or more of the electrical components from others of the electrical components. The semiconductor device package further includes an electromagnetic interference shield in contact with the top portion and the rim of the conductive frame.
    Type: Application
    Filed: August 4, 2016
    Publication date: November 24, 2016
    Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Wei Yu NIEN
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160284665
    Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 29, 2016
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tau-Jing YANG, Kuo-Feng HUANG, Wei Yu NIEN
  • Semiconductor device package and method of manufacturing the same
    Patent number: 9437576
    Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 6, 2016
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Tau-Jing Yang, Kuo-Feng Huang, Wei Yu Nien