Abstract: Embodiments include a Schottky barrier diode (SBD) structure and method of forming the same, the SBD structure including a current blockage feature to inhibit current from leaking at an interface with a shallow trench isolation regions surrounding an anode region of the SBD structure.

Abstract: This disclosure is directed to a liquid cooling device having at least two collecting tanks and at least one pair of heat-exchange plates. The tanks are separated from each other. Each of the collecting tanks has a joint tube. Each of the heat-exchange plates is in elongated shape and the collecting tanks are connected serially by the heat-exchange plates. The two collecting tanks are connected by the pair of heat-exchange plates. Each of the heat-exchange plates has a channel extended along the longitudinal direction thereof. The channels in the heat-exchange plates are connected to the collecting tanks at two ends of the heat-exchange plates, respectively. The longitudinal directions of the channels of the heat-exchange plates between the collecting tanks are parallel to each other.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first pixel region and a second pixel region within a substrate. A first recess region is disposed along a back-side of the substrate within the first pixel region. The back-side of the substrate within the first pixel region is asymmetric about a center of the first pixel region in a cross-sectional view. A second recess region is disposed along the back-side of the substrate and within the second pixel region. The back-side of the substrate within the second pixel region is asymmetric about a center of the second pixel region in the cross-sectional view. The first recess region and the second recess region are substantially symmetric about a vertical line laterally between the first pixel region and the second pixel region.

Abstract: A surface light emitting element with high heat dissipation and uniform light emission includes a metal reflective layer, a first metal conductive layer, an omnidirectional reflecting current isolation layer, a first-type semiconductor current spreading layer, a light emitting diode layer, a second-type semiconductor current spreading layer and a second metal conductive layer. The metal reflective layer includes at least one surrounding wall structure. The omnidirectional reflecting current isolation layer is arranged on the metal reflective layer and entirely covers the two sides of the at least one surrounding wall structure to form at least one cylindrical channel. The light emitting diode layer is located in the at least one cylindrical channel.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An integrated circuit includes a T-coil circuit, a silicon-controlled rectifier (SCR), and a signal-loss prevention circuit. The T-coil circuit is coupled to an input/output (I/O) pad and an internal circuit. The SCR is coupled to the T-coil circuit and the internal circuit. The signal-loss prevention circuit is coupled to the T-coil circuit and the SCR. The signal-loss prevention circuit includes a resistor coupled to the T-coil circuit and the SCR. An electrostatic current flows through the resistor and turns on the SCR. The signal-loss prevention circuit may also include a diode circuit coupled to the T-coil circuit and the SCR. The diode circuit is configured to prevent signal loss.

Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: Exemplary subpixel structures include a directional light-emitting diode structure characterized by a full-width-half-maximum (FWHM) of emitted light having a divergence angle of less than or about 10°. The subpixel structure further includes a lens positioned a first distance from the light-emitting diode structure, where the lens is shaped to focus the emitted light from the light-emitting diode structure. The subpixel structure still further includes a patterned light absorption barrier positioned a second distance from the lens. The patterned light absorption barrier defines an opening in the barrier, and the focal point of the light focused by the lens is positioned within the opening. The subpixels structures may be incorporated into a pixel structure, and pixel structures may be incorporated into a display that is free of a polarizer layer.

Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.

Abstract: The present disclosure is generally related to 3D imaging capable OLED displays. A light field display comprises an array of 3D light field pixels, each of which comprises an array of corrugated OLED pixels, a metasurface layer disposed adjacent to the array of 3D light field pixels, and a plurality of median layers disposed between the metasurface layer and the corrugated OLED pixels. Each of the corrugated OLED pixels comprises primary or non-primary color subpixels, and produces a different view of an image through the median layers to the metasurface to form a 3D image. The corrugated OLED pixels combined with a cavity effect reduce a divergence of emitted light to enable effective beam direction manipulation by the metasurface. The metasurface having a higher refractive index and a smaller filling factor enables the deflection and direction of the emitted light from the corrugated OLED pixels to be well controlled.

Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.

Abstract: In some embodiments, the present disclosure relates to a device having a semiconductor substrate including a frontside and a backside. On the frontside of the semiconductor substrate are a first source/drain region and a second source/drain region. A gate electrode is arranged on the frontside of the semiconductor substrate and includes a horizontal portion, a first vertical portion, and a second vertical portion. The horizontal portion is arranged over the frontside of the semiconductor substrate and between the first and second source/drain regions. The first vertical portion extends from the frontside towards the backside of the semiconductor substrate and contacts the horizontal portion of the gate electrode structure. The second vertical portion extends from the frontside towards the backside of the semiconductor substrate, contacts the horizontal portion of the gate electrode structure, and is separated from the first vertical portion by a channel region of the substrate.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: An image searching module and a searching method thereof are applicable to motion estimation of a dynamic image-processing system. The image searching module comprises a storage module, a setting module, and a processing module. The storage module stores a first frame, and the first frame has a first block and a first pixel. The setting module sets a plurality of first estimation blocks with a first estimation pixel and a first interval as a side length in a second frame. The setting module sets an initiation point on the position corresponding to the first pixel in the second frame, and arranges these first estimation blocks in order along a predetermined direction. The processing module matches each first estimation block and the first block to work out respectively a first predicted strength value of each first estimation block corresponding to the first block.

Abstract: A mobile video/audio device is provided, comprising a receiving box, a display mounted on a surface of the receiving box for displaying a video content with a corresponding audio content accompanied, a compact disk (CD) drive disposed within the receiving box with an access side thereof exposed and having an eject button formed at a side thereof, a control module comprising a video/audio playing circuit formed in modules for controlling the display, CD drive and other units associated with the video/audio playing circuit, the control module being further disposed within the receiving box and detachable therefrom; and a control panel disposed at a location outside the display within the receiving box and having a plurality of control keys for controlling the control module to play the video/audio content and a plurality of video/audio out/input ports for connecting with an external device.

Abstract: An interior liquid crystal and multimedia data display is provided. The interior liquid crystal and multimedia data display comprises a container being installed in the back of the headrest for containing other equipments. A monitor is set in the container and the container is axially connected with the monitor at a bottom edge thereof, therefore the monitor can be turned over from or pushing back to the container. A control panel is set below the monitor with a plurality of function keys and a direction key. An extension slot is set above the monitor and concealed between the monitor and the container. A peripheral panel is set in the headrest at a side thereof, in which the peripheral panel has a surface with a plurality of output ports and a plurality of input ports for being connected to other audio/video equipments.

Abstract: A reception structure for a video/audio device includes a machine box having a surface on which a display is mounted. The display has one side by which a CD-ROM having an end is mounted. The machine box is received within a reception box and the end of CD-ROM of the machine box is pushed out from the reception box so that a CD is allowed to be accessed with respect to the CD-ROM when a locking mechanism is loosened. The locking mechanism for fixing the machine box within the reception box and a spring-out mechanism for pushing out the end of the CD-ROM of the machine box are disposed between the machine box and the reception box.