Patents by Inventor Wei Z. Chen

Wei Z. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5280717
    Abstract: An improved adhesion testing apparatus (20) for the accurate, quantitative measurement of adhesion of coherent flowable materials such as doughs is provided which includes an extrusion-type sample holding device (42) together with a shiftable probe (38). The device (42) includes a base (46) threadably interconnected with a top (48), the latter supporting an extrusion screen (50). In use, a dough sample placed within the base (46) is extruded through the screen (50) in order to present a test portion (92) above the screen (50); the plunger (38) is then lowered into contact with the portion (92), and rapidly withdrawn. The force required to separate the plunger (38) from the test portion (92) is recorded as a measure of adhesion. Provision of the screen (50) essentially eliminates the potentially interferring factor of dough flow in the measurement of adhesion.
    Type: Grant
    Filed: October 14, 1992
    Date of Patent: January 25, 1994
    Assignee: Kansas State University Research Foundation
    Inventors: Russell C. Hoseney, Wei Z. Chen