Patents by Inventor Wei-Zhi Hu
Wei-Zhi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152193Abstract: The invention provides a power supply including at least one power output port, at least one status alert component, and at least one output port status monitoring module. The status alert component generates at least one visual prompt based on an alert signal. The output port status monitoring module includes at least one temperature sensor adjacent to the power output port, a microcontroller connected to the temperature sensor and sensing an output current from the power output port, and a reset signal generator connected to the microcontroller. The microcontroller comprises at least one port status alert condition that takes a temperature and the output current of the power output port as decision factors. The microcontroller outputs the alert signal to the status alert component when the port status alert condition is met and maintains the status until a reset signal provided by the reset signal generator is received.Type: ApplicationFiled: November 4, 2022Publication date: May 9, 2024Inventors: Wei-Chen WU, Wen-Hau HU, Hung-Wei YANG, Cheng-Yung LO, Yu-Hao SU, Jian-Zhi HUANG
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Patent number: 10510918Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.Type: GrantFiled: May 12, 2014Date of Patent: December 17, 2019Assignee: FUJIKURA LTD.Inventors: Wei-Zhi Hu, Kenichi Nakatate, Takeshi Segi, Kenichi Ishibashi, Fumihiko Nishimura, Satoshi Hida, Hitoe Iikura, Hideo Shiratani
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Patent number: 9749593Abstract: An optical fiber structure according to the present application includes a cylindrical resin body, and a plurality of circumferential arrays of optical fiber bare wires disposed within the resin body and extending along a longitudinal direction of the resin body. The resin body includes a linear slit provided at a location intermediate the length of the resin body. The linear slit extends from an outer surface to an inner bore of the resin body and extending substantially parallel to the bare wires.Type: GrantFiled: February 10, 2014Date of Patent: August 29, 2017Assignee: FUJIKURA LTD.Inventors: Wei-Zhi Hu, Kenichi Nakatate, Hitoe Iikura, Hideo Shiratani
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Patent number: 9380928Abstract: An imaging part of an electronic visualized catheter including, an object lens system, and a solid state imaging element which is positioned to receive light output from the object lens system and which photoelectrically converts the light output from the object lens system into an electric signal, wherein an output lens face of the object lens system is planar, and the output lens face is joined to a light receiving surface of the solid state imaging element.Type: GrantFiled: May 31, 2012Date of Patent: July 5, 2016Assignee: FUJIKURA LTD.Inventors: Wei-Zhi Hu, Takeshi Segi, Kenichi Nakatate, Katsuya Yamagami
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Publication number: 20140249368Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.Type: ApplicationFiled: May 12, 2014Publication date: September 4, 2014Applicant: FUJIKURA LTD.Inventors: Wei-Zhi HU, Kenichi NAKATATE, Takeshi SEGI, Kenichi ISHIBASHI, Fumihiko NISHIMURA, Satoshi HIDA, Hitoe IIKURA, Hideo SHIRATANI
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Publication number: 20140152789Abstract: An optical fiber structure according to the present application includes a cylindrical resin body, and a plurality of circumferential arrays of optical fiber bare wires disposed within the resin body and extending along a longitudinal direction of the resin body. The resin body includes a linear slit provided at a location intermediate the length of the resin body. The linear slit extends from an outer surface to an inner bore of the resin body and extending substantially parallel to the bare wires.Type: ApplicationFiled: February 10, 2014Publication date: June 5, 2014Applicant: FUJIKURA LTD.Inventors: Wei-Zhi HU, Kenichi NAKATATE, Hitoe IIKURA, Hideo SHIRATANI
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Publication number: 20120310043Abstract: An imaging part of an electronic visualized catheter including, an object lens system, and a solid state imaging element which is positioned to receive light output from the object lens system and which photoelectrically converts the light output from the object lens system into an electric signal, wherein an output lens face of the object lens system is planar, and the output lens face is joined to a light receiving surface of the solid state imaging element.Type: ApplicationFiled: May 31, 2012Publication date: December 6, 2012Applicant: FUJIKURA LTD.Inventors: Wei-Zhi HU, Takeshi SEGI, Kenichi NAKATATE, Katsuya YAMAGAMI
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Publication number: 20120310045Abstract: An electronic endoscope of the present invention includes an elongated insertion portion inserted into a subject, a distal end of the elongated insertion portion including a solid state imaging device, an operating portion connected to an other end of the insertion portion so as to be freely attachable thereto or detached therefrom, and an interface substrate that processes RAW data obtained by the solid-state imaging device and that creates and outputs image signals. At least part of an interface substrate is disposed inside the operating portion, and a first electrical cable that transmits the RAW data obtained by the solid-state imaging device is connected to a connector located on the interface substrate or located on the way toward the interface substrate, and when the insertion portion is being attached to or detached from the operating portion, the first electrical cable is attached or detached at a connector portion.Type: ApplicationFiled: June 1, 2012Publication date: December 6, 2012Applicant: FUJIKURA LTD.Inventors: Wei-Zhi HU, Takeshi SEGI, Kenichi NAKATATE, Kenichi ISHIBASHI
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Publication number: 20110318701Abstract: A dental probe according to the invention is provided with a tip portion including a water flow path, an air flow path, a multi-lumen tube including a duct formed therein in which an optical fiber is inserted, and the optical fiber inserted in the duct. The optical fiber includes a resin-coated layer provided on an outer circumference of a cladding and a metal-coated layer provided on the outer circumference of the resin-coated layer, and the resin-coated layer is formed of a polymer compound having a refractive index lower than that of the cladding.Type: ApplicationFiled: September 2, 2011Publication date: December 29, 2011Applicant: FUJIKURA LTD.Inventors: Kenichi NAKATATE, Wei-Zhi HU
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Patent number: 6740623Abstract: An Hg- or Nd-based oxide superconductor comprises Ba as a constituent element and has a content of carbon as an impurity at a level of not greater than 2.0 atomic % whereby the oxide superconductor stably shows high superconducting characteristics without causing degradation with time. For its production, BaO, which has a reduced content of carbon impurity of 0.5% or below, is provided as a feed stock for Ba, and the starting materials are mixed and processed in a dry atmosphere wherein an amount of a carbon-containing gas is suppressed to a certain level, thereby obtaining the oxide superconductor.Type: GrantFiled: January 24, 2003Date of Patent: May 25, 2004Assignee: International Superconductivity Technology CenterInventors: Ayako Yamamoto, Wei-Zhi Hu, Setsuko Tajima
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Publication number: 20030144149Abstract: An Hg- or Nd-based oxide superconductor comprises Ba as a constituent element and has a content of carbon as an impurity at a level of not greater than 2.0 atomic % whereby the oxide superconductor stably shows high superconducting characteristics without causing degradation with time. For its production, BaO, which has a reduced content of carbon impurity of 0.5% or below, is provided as a feed stock for Ba, and the starting materials are mixed and processed in a dry atmosphere wherein an amount of a carbon-containing gas is suppressed to a certain level, thereby obtaining the oxide superconductor.Type: ApplicationFiled: January 24, 2003Publication date: July 31, 2003Applicant: International Superconductivity Technology CenterInventors: Ayako Yamamoto, Wei-Zhi Hu, Setsuko Tajima
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Patent number: 6537949Abstract: An Hg- or Nd-based oxide superconductor comprises Ba as a constituent element and has a content of carbon as an impurity at a level of not greater than 2.0 atomic % whereby the oxide superconductor stably shows high superconducting characteristics without causing degradation with time. For its production, BaO, which has a reduced content of carbon impurity of 0.5% or below, is provided as a feed stock for Ba, and the starting materials are mixed and processed in a dry atmosphere wherein an amount of a carbon-containing gas is suppressed to a certain level, thereby obtaining the oxide superconductor.Type: GrantFiled: March 3, 2000Date of Patent: March 25, 2003Assignee: International Superconductivity Technology CenterInventors: Ayako Yamamoto, Wei-Zhi Hu, Setsuko Tajima